Claims
- 1. A substrate having thereon a cured film comprising a nonaqueous composition comprising: an ungelled acrylic resin composition containing an arcylic polymer having in a molecule thereof at least one group containing a silicon atom said group selected from: ##STR18## wherein each R independently is selected form the group of moieties consisting of Y, hydrogen, a C.sub.1 -C.sub.10 group joined to Si through an Si-C linkage, and OR.sup.7 --in which R.sup.7 --represents alkyl having at least 4 carbon atoms, aryl, alkylaryl, arylalkyl, aryloxyalkyl, or alkyloxyalkyl, wherein Y represents an easily hydrolyzable group; provided that said acrylic resin composition contains an amount of easily hydrolyzable Y moieties such that the ratio of the number of grams of said ungelled acrylic resin composition to equivalents of easily hydrolyzable Y moieties in said ungelled acrylic resin composition is in a range of from 40 to 667.
- 2. The substrate of claim 1 wherein said nonaqueous composition is curable in the presence of atmospheric moisture and a catalyst at a temperature of less than or equal to 121 degrees C. within 3 hours.
Parent Case Info
This is a division of application Ser. No. 728,973, filed Apr. 30, 1985, now U.S. Pat. No. 4,714,738.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
126470 |
Jul 1984 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
728973 |
Apr 1985 |
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