Claims
- 1. A superconductor layer formed on a main surface of a substrate, comprising an oxide superconductor that contains at least one metal selected from the group consisting of yttrium and lanthanoids, barium, copper and oxygen, wherein, when a cross section of the superconductor layer that is parallel with the main surface and spaced apart from the main surface by 50 nm to 70% of a thickness of the superconductor layer is observed, an area ratio of copper oxide particles to the superconductor layer is 1/100 or less.
- 2. The superconductor layer according to claim 1, further comprising fluorine.
- 3. The superconductor layer according to claim 1, wherein the oxide superconductor contains at least one metal selected from the group consisting of samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium and thulium.
- 4. The superconductor layer according to claim 1, further comprising fluorine, wherein the oxide superconductor contains at least one metal selected from the group consisting of samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium and thulium.
- 5. The superconductor layer according to claim 1, wherein the superconductor layer contains copper oxide particles, and the oxide superconductor is present in an amount of at least 50% by volume in a region of the superconductor layer, the region surrounding the copper oxide particle and an outer surface of the region being away from a surface of the copper oxide particle by 0.1 μm.
- 6. The superconductor layer according to claim 2, wherein the superconductor layer contains copper oxide particles, and the oxide superconductor is present in an amount of at least 50% by volume in a region of the superconductor layer, the region surrounding the copper oxide particle and an outer surface of the region being away from a surface of the copper oxide particle by 0.1 μm.
- 7. The superconductor layer according to claim 3, wherein the superconductor layer contains copper oxide particles, and the oxide superconductor is present in an amount of at least 50% by volume in a region of the superconductor layer, the region surrounding the copper oxide particle and an outer surface of the region being away from a surface of the copper oxide particle by 0.1 μm.
- 8. The superconductor layer according to claim 4, wherein the superconductor layer contains copper oxide particles, and the oxide superconductor is present in an amount of at least 50% by volume in a region of the superconductor layer, the region surrounding the copper oxide particle and an outer surface of the region being away from a surface of the copper oxide particle by 0.1 μm.
- 9. A method of manufacturing a superconductor layer, comprising:
preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent; coating a main surface of a substrate with the coating solution to form a coating film; subjecting the coating film to a calcining process in an atmosphere containing oxygen; and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process, wherein the calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.
- 10. A method of manufacturing a superconductor layer, comprising:
preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent; coating a main surface of a substrate with the coating solution to form a coating film; subjecting the coating film to a calcining process in an atmosphere containing oxygen; and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process, wherein the calcining process includes elevating a temperature of the coating film in an atmosphere of the atmospheric pressure containing water vapor such that a maximum temperature that the coating film reaches is 400° C. or higher, and that, during the temperature elevation, a period that the temperature of the coating film is kept at 200° C. to 250° C. falls within a range of 6 hours and 15 minutes to 16 hours and 30 minutes.
- 11. The method of manufacturing a superconductor layer according to claim 9, wherein the firing process is carried out in an atmosphere containing water vapor in an amount of at least 4.2% by volume.
- 12. The method of manufacturing a superconductor layer according to claim 10, wherein the firing process is carried out in an atmosphere containing water vapor in an amount of at least 4.2% by volume.
- 13. The method of manufacturing a superconductor layer according to claim 9, wherein the trifluoroacetates used contain impurities in an amount equal to or less than 6% by mass.
- 14. The method of manufacturing a superconductor layer according to claim 10, wherein the trifluoroacetates used contain impurities in an amount equal to or less than 6% by mass.
- 15. The method of manufacturing a superconductor layer according to claim 9, wherein the solvent contains at least one of methanol and ethanol in an amount of at least 50% by mass.
- 16. The method of manufacturing a superconductor layer according to claim 10, wherein the solvent contains at least one of methanol and ethanol in an amount of at least 50% by mass.
- 17. The method of manufacturing a superconductor layer according to claim 9, wherein a maximum temperature of the coating film that is reached during the firing process is 725° C. or higher.
- 18. The method of manufacturing a superconductor layer according to claim 10, wherein a maximum temperature of the coating film that is reached during the firing process is 725° C. or higher.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2002-059398 |
Mar 2002 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation Application of PCT Application No. PCT/JP03/02577, filed Mar. 5, 2003, which was not published under PCT Article 21(2) in English.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP03/02577 |
Mar 2003 |
US |
Child |
10819258 |
Apr 2004 |
US |