Patent Application
20230390938
The information provided in this section is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
The present disclosure relates to painting of vehicles, and more particularly to supplemental and targeted heating of vehicle components during curing of a vehicle body-in-white (BIW) after painting.
During manufacturing, a vehicle body-in-white (BIW) is typically painted prior to assembly of other vehicle components such as powertrain, suspension, doors, interior, etc. After painting in a paint shop, the vehicle BIW passes through an oven to cure the paint and/or other structural adhesives that are used. During heating in the oven, outer panels of the vehicle BIW heat up much faster than inner panels of the vehicle BIW since the outer panels are directly exposed to a heat source of the oven. In other words, the outer panels shield the inner panels from the heat source. The temperature difference induces thermal stress and may cause outer panels to buckle as the vehicle BIW passes through the oven.
A heating system includes a conveying system configured to transport a plurality of vehicle body-in-whites (BIWs) sequentially through an oven room to cure paint applied in a paint room. A preheating system includes one or more robot arms. A heat source is connected to the one or more robot arms. A controller is configured to control the one or more robot arms based on a position of one of the vehicle BIWs on the conveying system and to position the heat source near or in direct contact with one or more inner components of the one of the vehicle BIWs to heat the one or more inner components prior to the one of the vehicle BIWs entering the oven room.
In other features, the heat source comprises a contact heat source. The contact heat source comprises a resistive heater. The contact heat source comprises an array of resistive heaters. The heat source comprises a non-contact heat source. The non-contact heat source includes an inductive heater including a coil. The non-contact heat source includes an inductive heater including an array of coils. The non-contact heat source includes an infrared heater. The non-contact heat source includes a heated air source.
In other features, the controller is configured to position the heat source while the one of the vehicle BIWs is moved by the conveying system.
A heating system includes a conveying system configured to transport a plurality of vehicle body-in-whites (BIWs) sequentially through a paint room and an oven room to cure paint applied in the paint room. A supplemental heating system is arranged inside of the oven room and includes a heat source, a controller, and one or more arms connected to the heat source and configured to extend into one of the vehicle BIWs to heat one or more interior components of the one of the vehicle BIWs to reduce a temperature differential relative to an outer surface of the one of the vehicle BIWs while the one of the vehicle BIWs passes through the oven room.
In other features, the heat source comprises a non-contact heat source. The non-contact heat source includes an infrared heater. A mirror connected to at least one of the one or more arms to divert a portion of infrared light output by the infrared heater onto the one or more interior components.
In other features, the non-contact heat source includes a heated air source and wherein the one or more arms include internal fluid channels configured to direct heater air onto the one or more interior components of the one of the vehicle BIWs. A diffuser is connected to at least one of the one or more arms to divert a portion of heated air from the heated air source.
In other features, the one or more arms include a first arm, a second arm movably connected to the first arm, and an actuator configured to extend the second arm into an interior of the one of the vehicle BIWs to direct the heat source at the one or more interior components of the one of the vehicle BIWs.
In other features, the one or more arms further include a third arm that rotates relative to the second arm. A first fluid channel in the first arm, a second fluid channel in the second arm and a third fluid channel in the third arm, wherein the first fluid channel is in fluid communication with a source of heated air, the second fluid channel, and the third fluid channel.
Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.
The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:
In the drawings, reference numbers may be reused to identify similar and/or identical elements.
The present disclosure relates preheating or supplemental heating of inner components/areas of a vehicle BIW to prevent thermal-induced distortion of outer panels of the vehicle BIW during curing in the oven. As described above, the vehicle body-in-white (BIW) is typically painted in a paint shop prior to assembly of other vehicle components. After being painted in the paint shop, the vehicle BIW passes through the oven to cure the wet paint and/or other structural adhesives that are used.
During heating in the oven, vehicle outer panels heat up much faster than vehicle inner panels since the outer panels are directly exposed to a heat source of the oven. In other words, the outer panels may shield the inner panels from the heat source. The temperature difference induces thermal stress and may cause outer panels to buckle as the vehicle BIW passes through the oven.
Referring now to
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In
A controller 30 is configured to coordinate movement of the one or more robot arms 36 (into position in the vehicle BIW and application of the current through the leads 24) relative to the vehicle BIWs on the conveying system 32. In other words, as the vehicle BIW 34 is moved on a conveying system, the one or more robot arms 36 extend into the vehicle BIW, position the leads 24 in contact with the vehicle BIW while it is moving, apply current for heating, and then retract. The process is repeated for the next vehicle BIW on the conveying system.
Resistive heating is the most direct and efficient method of heating targeted workpieces, even if the workpieces are encapsulated. Resistive heating is highly efficient since only a few seconds of heating is needed. Little or no extra workspace is needed.
Referring now to
In some examples, the one or more coils 118 include a single coil that heats a single portion of the vehicle BIW and/or is sequentially moved to multiple portions of the vehicle BIW. This arrangement is low-cost, relatively flexible, and supports low throughput. In some examples, the one or more coils 118 include an array of coils that are arranged by a fixture in one or more predetermined patterns corresponding one or more portions located inside of the vehicle BIW. In other examples, the one or more coils are arranged adjacent to different portions of the body inner structure to allow multiple components to be heated at the same time prior to entering the oven. This arrangement has a higher cost, is less flexible, and supports higher throughput.
In
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An arm 238 is connected to an end of the extendable arm 220. In some examples, the arm 238 is fixed relative to the extendible arm 220 and in other examples the arm rotates relative to an axis 234. In some examples, a positioning motor 230 adjusts an angular position of the arm 238 relative to the extendable arm 220. Heated air is supplied through fluid channels arranged inside of or outside of the mounted arm 222, the extendable arm 220, the arm 238 and an outlet 239 onto an inner surface of the vehicle BIW to be heated.
In some examples, the heated air that is supplied is already generated by the oven and redirected. The heated air is supplied to a region behind the oven wall 218 of the oven and flows through fluid channels 241 in the mounted arm 222, the extendable arm 220, the arm 238 and the outlet 239 onto the inner surface of the vehicle BIW to be heated.
In
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In some examples, the positioning system 420 includes a first positioner 430 configured to extend and retract the arm. In some examples, the first positioner 430 includes rollers with motors configured to rotate in first and second directions to extend or retract the arm. In other examples, the first positioner 430 includes a cylinder that extends and retracts to the arm using fluid such as liquid or gas, a screw motor or other linear actuator.
A second positioner 434 is configured to move the supplemental heating system longitudinally approximately in sync with the vehicle BIW on the conveying system while supplement heating is performed. After performing supplemental heating, the first positioner 430 retracts the arm and the second positioner 434 moves the supplemental heating system in a direction opposite to the conveying direction to align with the next vehicle BIW. When positioned relative to the next vehicle BIW, the first positioner 430 extends the arm and the second positioner 434 moves approximately in sync with the conveying system while supplemental heating is performed again.
The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and/or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.
Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”
In the figures, the direction of an arrow, as indicated by the arrowhead, generally demonstrates the flow of information (such as data or instructions) that is of interest to the illustration. For example, when element A and element B exchange a variety of information but information transmitted from element A to element B is relevant to the illustration, the arrow may point from element A to element B. This unidirectional arrow does not imply that no other information is transmitted from element B to element A. Further, for information sent from element A to element B, element B may send requests for, or receipt acknowledgements of, the information to element A.
In this application, including the definitions below, the term “module” or the term “controller” may be replaced with the term “circuit.” The term “module” may refer to, be part of, or include: an Application Specific Integrated Circuit (ASIC); a digital, analog, or mixed analog/digital discrete circuit; a digital, analog, or mixed analog/digital integrated circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor circuit (shared, dedicated, or group) that executes code; a memory circuit (shared, dedicated, or group) that stores code executed by the processor circuit; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system-on-chip.
The module may include one or more interface circuits. In some examples, the interface circuits may include wired or wireless interfaces that are connected to a local area network (LAN), the Internet, a wide area network (WAN), or combinations thereof. The functionality of any given module of the present disclosure may be distributed among multiple modules that are connected via interface circuits. For example, multiple modules may allow load balancing. In a further example, a server (also known as remote, or cloud) module may accomplish some functionality on behalf of a client module.
The term code, as used above, may include software, firmware, and/or microcode, and may refer to programs, routines, functions, classes, data structures, and/or objects. The term shared processor circuit encompasses a single processor circuit that executes some or all code from multiple modules. The term group processor circuit encompasses a processor circuit that, in combination with additional processor circuits, executes some or all code from one or more modules. References to multiple processor circuits encompass multiple processor circuits on discrete dies, multiple processor circuits on a single die, multiple cores of a single processor circuit, multiple threads of a single processor circuit, or a combination of the above. The term shared memory circuit encompasses a single memory circuit that stores some or all code from multiple modules. The term group memory circuit encompasses a memory circuit that, in combination with additional memories, stores some or all code from one or more modules.
The term memory circuit is a subset of the term computer-readable medium. The term computer-readable medium, as used herein, does not encompass transitory electrical or electromagnetic signals propagating through a medium (such as on a carrier wave); the term computer-readable medium may therefore be considered tangible and non-transitory. Non-limiting examples of a non-transitory, tangible computer-readable medium are nonvolatile memory circuits (such as a flash memory circuit, an erasable programmable read-only memory circuit, or a mask read-only memory circuit), volatile memory circuits (such as a static random access memory circuit or a dynamic random access memory circuit), magnetic storage media (such as an analog or digital magnetic tape or a hard disk drive), and optical storage media (such as a CD, a DVD, or a Blu-ray Disc).
The apparatuses and methods described in this application may be partially or fully implemented by a special purpose computer created by configuring a general purpose computer to execute one or more particular functions embodied in computer programs. The functional blocks, flowchart components, and other elements described above serve as software specifications, which can be translated into the computer programs by the routine work of a skilled technician or programmer.
The computer programs include processor-executable instructions that are stored on at least one non-transitory, tangible computer-readable medium. The computer programs may also include or rely on stored data. The computer programs may encompass a basic input/output system (BIOS) that interacts with hardware of the special purpose computer, device drivers that interact with particular devices of the special purpose computer, one or more operating systems, user applications, background services, background applications, etc.
The computer programs may include: (i) descriptive text to be parsed, such as HTML (hypertext markup language), XML (extensible markup language), or JSON (JavaScript Object Notation) (ii) assembly code, (iii) object code generated from source code by a compiler, (iv) source code for execution by an interpreter, (v) source code for compilation and execution by a just-in-time compiler, etc. As examples only, source code may be written using syntax from languages including C, C++, C #, Objective-C, Swift, Haskell, Go, SQL, R, Lisp, Java®, Fortran, Perl, Pascal, Curl, OCaml, Javascript®, HTML5 (Hypertext Markup Language 5th revision), Ada, ASP (Active Server Pages), PHP (PHP: Hypertext Preprocessor), Scala, Eiffel, Smalltalk, Erlang, Ruby, Flash®, Visual Basic®, Lua, MATLAB, SIMULINK, and Python®.
