This application relates generally to room conditioning (e.g., heating, cooling) units and more particularly to self-contained heat pump room conditioning units, such as saddle window heat pump conditioning units, with supplemental heat sources.
Self-contained room conditioning units can be employed to heat a specific room or other area within a building. In some instances, self-contained room conditioning units can include a heat pump and can straddle the envelope opening such that a first heat exchanger of the heat pump system is located on an indoor side of the building envelope and a second heat exchanger of the heat pump system is located on an outdoor side of the building envelope. Typical room conditioning units (such as saddle units) are optimized for cooling (not heating) the interior space. As such, the electronics (circuit boards or the like) in typical saddle units are placed in the outdoor portion of the room conditioning units. Regardless of the configuration, it is a common desire to improve the energy efficiency of such systems. Accordingly, there is a desire to improve the energy efficiency of room conditioning units.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various aspects of the presently disclosed subject matter and serve to explain the principles of the presently disclosed subject matter. The drawings are not intended to limit the scope of the presently disclosed subject matter in any manner.
In certain embodiments, the systems and methods disclosed herein are directed to self-contained heat pump room conditioning units (referenced herein as “room conditioning unit” or “unit”).
In some instances, the self-contained heat pump room conditioning unit may be configured to harvest excess heat from one or more components (e.g., electronics or the like) of the self-contained heat pump room conditioning unit that are located within an indoor portion thereof in order to increase the heating efficiency of the unit. For example, in certain embodiments, the room conditioning unit can include an indoor portion having an indoor heat exchanger coil, an outdoor portion having an outdoor heat exchanger coil, and a bridge portion connecting the indoor and outdoor portions being configured to extend across the opening of the building envelope (e.g., across a windowsill). In certain embodiments, excess heat from computing components (e.g., electronics or the like) can be captured and introduced into the conditioned space when the room conditioning unit is operating in a heating mode, thereby improving the energy efficiency of the room conditioning unit.
In certain embodiments, the self-contained heat pump room conditioning unit may include an electronics board (e.g., a circuit board or the like) located in a compartment of an indoor portion of the room conditioning unit. In this manner, during heating mode of the unit, air can be pulled through the compartment and across the electronics board (e.g., the heat sink thereof) to transfer heat from the electronics board to the passing air, thereby warming the passing air. In some instances, the warmed air can be mixed with intake air that is being directed toward the indoor coil for heating. In other instances, the warmed air can be mixed and/or entrained with discharge air that has already passed through the indoor coil for heating. In yet other instances, the warmed air may not be mixed with intake air that is being directed toward the indoor coil for heating and/or the discharge air; instead, the warmed air may be directed directly into the room.
In certain embodiments, during cooling mode of the unit, a damper or the like can open to permit airflow through a conduit passing through the bridge portion of the room conditioning unit and to the outdoor portion. In this manner, a fan can pull warmed air from the compartment and pass the warmed air through the conduit and discharge the warmed air to outside via the outdoor unit.
These and other aspects of the present disclosure are described below with reference to the accompanying figures. Other aspects and features of the present disclosure will become apparent to those of ordinary skill in the art upon reviewing the following description of specific examples of the present disclosure in concert with the figures. While features of the present disclosure may be discussed relative to certain examples and figures, all examples of the present disclosure can include one or more of the features discussed herein. Further, while one or more examples may be discussed as having certain advantageous features, one or more of such features may also be used with the various other examples of the disclosure discussed herein. In similar fashion, while examples may be discussed below as devices, systems, or methods, it is to be understood that such examples can be implemented in various devices, systems, and methods of the present disclosure.
Although various aspects of the disclosed technology are explained in detail herein, it is to be understood that other aspects of the disclosed technology are contemplated. Accordingly, it is not intended that the disclosed technology is limited in its scope to the details of construction and arrangement of components expressly set forth in the following description or illustrated in the drawings. The disclosed technology can be implemented and practiced or carried out in various ways. In particular, the presently disclosed subject matter is described in the context of being systems and methods for use with a heat pump water heating system. The present disclosure, however, is not so limited, and can be applicable in other contexts. The present disclosure can, for example, include devices and systems for use with air conditioning systems, refrigeration systems, pool water heat systems, and other similar systems. Furthermore, although described in the context of being a water heater, the disclosed technology can be configured to heat fluids other than water. For example, the disclosed technology can be implemented in various commercial and industrial fluid heating systems used to heat fluids other than water. Accordingly, when the present disclosure is described in the context of a heat pump water heater system, it will be understood that other implementations can take the place of those referred to.
It should also be noted that, as used in the specification and the appended claims, the singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. References to a composition containing “a” constituent is intended to include other constituents in addition to the one named.
Also, in describing the disclosed technology, terminology will be resorted to for the sake of clarity. It is intended that each term contemplates its broadest meaning as understood by those skilled in the art and includes all technical equivalents which operate in a similar manner to accomplish a similar purpose.
Ranges may be expressed herein as from “about” or “approximately” or “substantially” one particular value and/or to “about” or “approximately” or “substantially” another particular value. When such a range is expressed, the disclosed technology can include from the one particular value and/or to the other particular value. Further, ranges described as being between a first value and a second value are inclusive of the first and second values. Likewise, ranges described as being from a first value and to a second value are inclusive of the first and second values.
Herein, the use of terms such as “having,” “has,” “including,” or “includes” are open-ended and are intended to have the same meaning as terms such as “comprising” or “comprises” and not preclude the presence of other structure, material, or acts. Similarly, though the use of terms such as “can” or “may” are intended to be open-ended and to reflect that structure, material, or acts are not necessary, the failure to use such terms is not intended to reflect that structure, material, or acts are essential. To the extent that structure, material, or acts are presently considered to be essential, they are identified as such.
It is also to be understood that the mention of one or more method steps does not preclude the presence of additional method steps or intervening method steps between those steps expressly identified. Moreover, although the term “step” can be used herein to connote different aspects of methods employed, the term should not be interpreted as implying any particular order among or between various steps herein disclosed unless and except when the order of individual steps is explicitly required. Further, the disclosed technology does not necessarily require all steps included in the methods and processes described herein. That is, the disclosed technology includes methods that omit one or more steps expressly discussed with respect to the methods described herein.
The components described hereinafter as making up various elements of the disclosed technology are intended to be illustrative and not restrictive. Many suitable components that would perform the same or similar functions as the components described herein are intended to be embraced within the scope of the disclosed technology. Such other components not described herein can include, but are not limited to, similar components that are developed after development of the presently disclosed subject matter.
Referring now to the drawings, and particularly to
As shown in
In certain embodiments, the indoor portion 102 can include an indoor base pan 126. Referring to
The outdoor portion 104 can include an outdoor base pan 132, an outer-facing side 134, an inner-facing side 136, opposing lateral sides 138, 139, and a top 140. At least a portion of the inner-facing side 136 and/or one or both of the opposing lateral sides 138, 139 can include louvers 170, 172. In some instances, the louvers 170, 172 may act as air inlets. More so, the outer-facing side 134 of the outdoor portion 104 can include louvers 142 or the like, which may act as air outlets. During operation, the fan 124 can be configured to pull air into the outdoor portion 104 via the louvers 170, 172 (or other air inlet(s)), pass the air across the outdoor coil 122 to effect heat transfer between the refrigerant flowing through the outdoor coil 122 and the passing air, and discharge the air via the louver 142 on the outer-facing side 134. In some instances, the outdoor base pan 132 can be sloped to bias the flow of condensate to one or more desired locations for subsequent discharge or removal from the indoor base pan 126. A drain valve 148 may be disposed about the outdoor base pan 132. In certain embodiments, the outdoor coil 122 and/or at least some of the fan 124 (e.g., the fan blades) can be located in an outdoor coil housing 144 (e.g., as shown in
The bridge portion 106 can include insulation to prevent unwanted heat transfer between outdoor and the indoor space. The insulation can also reduce noise and vibration associated with the self-contained heat pump room conditioning unit 100, particularly from the indoor side. The bridge portion 106 can include a pathway for refrigerant tubing, power cables, and/or water pump tubing. In some instances, the bridge portion 106 can be located at or near the top of the indoor portion 102 and the outdoor portion 104 such that the self-contained heat pump room conditioning unit 100 has a generally saddle shape. The self-contained heat pump room conditioning unit 100 may be any suitable size, shape, or configuration. Accordingly, the self-contained heat pump room conditioning unit 100 can be configured to straddle a windowsill or another opening in a building envelope, such as is illustrated in
In certain embodiments, the width of the outdoor portion 104 and/or the bridge portion 106 can be less than a width of the indoor portion 102. For example, the width of the outdoor portion 104 and/or the bridge portion 106 can be less than the width of a standard window opening, whereas the width of the indoor portion 102 can be greater than or approximately equal to the width of a standard window opening. As specific examples, the outdoor portion 104 and/or the bridge portion 106 can have a width of approximately 20 inches, and the indoor portion 102 can have a width of approximately 26 inches. The bridge portion 106 can have a length sufficiently long to extend across a standard windowsill. As a specific example, the bridge portion 106 can have a length of approximately 12 inches. The length of the bridge portion 106 can also serve to separate the inner-facing side 116 of the indoor portion 102 from the wall of the building envelope and/or to separate the inner-facing side 136 of the outdoor portion 104 from the building. The indoor portion 102, the bridge portion 106, and the outdoor portion 104 may be any suitable size, shape, or configuration.
The self-contained heat pump room conditioning unit 100 can include a controller, which can include one or more processors and memory having instructions stored thereon that, when executed by the one or more processors, cause the controller to perform certain methods. For example, the controller can be configured to receive data inputs from a user interface and/or one or more sensors (e.g., temperature sensor(s), humidity sensor(s)) and can be configured to output instructions for certain components to operate. For example, the controller can be configured to output instructions for the compressor, the reversing valve, the fan 124, and/or the blower 120 to operate based at least in part on a current operating mode of the self-contained heat pump room conditioning unit 100 (e.g., heating mode, cooling mode, defrosting mode, etc.) and/or received sensor data from one or more of the sensors.
In certain embodiments, as depicted in
In conventional self-contained heat pump room conditioning units, an electronics board, includes electronics to control operations of the self-contained heat pump room conditioning unit, is disposed in the outdoor portion. In particular, a goal of operating a conventional self-contained heat pump room conditioning unit is to maximize efficiency when operating in the cooling mode, i.e., providing cool air into the interior portion of the building. To maximize efficiency when operating in the cooling mode, any heat generating elements that can be placed in the outdoor portion are placed in the outdoor portion to separate heat (produced by the heat generating elements (e.g., electronics)) from the cooled indoor heat exchanging coils in the inner portion of the unit. For this reason, the electronics board, which generates heat, is conventionally placed in the outdoor portion. Still further, there is generally more space in the outdoor portion to receive electronics board.
However, contrary to conventional systems, a goal of operating a self-contained heat pump room conditioning unit in accordance with one or more embodiments of the present disclosure is to maximize efficiency when operating in the heating mode, i.e., providing heated air into the interior portion of the building. In this manner, in some instances, to maximize efficiency when operating in the heating mode, one or more heat generating elements may be placed in the indoor portion to provide supplement heat (produced by the heat generating elements (e.g., electronics)) to the heated interior portion of the building. In some instances, the warmed air produced by the heat generating elements (e.g., electronics) can be mixed with intake air that is being directed toward the indoor coil for heating. In other instances, the warmed air can be mixed and/or entrained with discharge air that has already passed through the indoor coil for heating. In yet other instances, the warmed air may not be mixed with intake air that is being directed toward the indoor coil for heating and/or the discharge air; instead, the warmed air may be directed directly into the room. For this reason, the electronics board, which generates heat, may be placed in the indoor portion.
Referring to
It should be noted that in certain embodiments, the electronics board 302 may be more broadly described as a heat source, which includes any device or system that is configured to generate heat. Further, in certain embodiments, the heat source, e.g., the electronics board 302, may include a heat sink. A heat sink is a device that is used to dissipate heat from a hot object, such as a computer processor or a power transistor. Heat sinks work by increasing the surface area of the object that is in contact with the air surrounding it, which in turn increases the rate at which heat can be transferred away from the object. Heat sinks are typically made of materials that are good conductors of heat, such as aluminum or copper. The heat sinks disclosed herein may be any suitable material. In certain embodiments, the heat sink may be designed to have fins or other structures that increase its surface area. When the hot object (e.g., electronics or the like) are attached to the heat sink, the heat is conducted from the object to the heat sink, and then from the heat sink to air surrounding it. As the air flows over the heat sink, it carries away the heat, which is then dissipated into the surrounding environment. This process of heat transfer is called convection, and it is what allows the heat sink to cool the hot object.
In certain embodiments, the air filter 306 can help prevent dust from entering the interior portion of the access panel 176 and accumulating on the heat sink and/or the electronics board 302 therein, which could eventually lead to the electronics board 302 overheating, which can degrade performance and/or cause damage to the electronics board 302.
The blower 120 may be configured to blow air 312 into the interior portion of the building. As shown in
In certain embodiments, as shown in
In other instances, the heated air 318 can be discharged from the interior portion of the access panel 176 entirely into the conditioned space via the access panel air outlet 322. For example, in some instances, the interior portion of the access panel 176 may include a separate fan or the like configured to move air from the access panel air inlet 304, across the filter 306, and across the electronics board 302 and/or associated heat sink to effect a heat transfer from the components of the electronics board 302 and/or heat sink to the heated air 318, which may exit the interior portion of the access panel 176 via the access panel air outlet 322 directly into the conditioned space. In some instances, the access panel air outlet 322 may be disposed on a high voltage protection block 320.
In the embodiments, as depicted in
In some instances, the fan 502 may operate at the same time as the blower 120. In other instances, the fan 502 may operate when the blower 120 is not operating.
It should be noted that a fan may be added to other embodiments disclosed herein to increase air flow within the indoor portion 102. For example, certain embodiments discussed above with reference to
As will be appreciated, the configuration discussed to this point can be beneficial during heating mode. Conversely, the added heat can negatively impact system performance during cooling mode. As one example of mitigating such a negative impact on system performance, the self-contained heat pump room conditioning unit 100 can include a conduit fluidly connected to the interior of the access panel 176 and passing through the bridge portion 106 and exiting into the outdoor portion 130. A fan can be located in or near the conduit and can be configured to pull air from the interior of the access panel 176 during cooling mode and push the warmed air to the outdoor portion 130 where the warmed air can be discharged to the outside environment. Alternatively, or in addition, a shutter or damper can be configured to open or close passage to the conduit depending on the current operational mode. During heating mode, the damper can be closed such that warmed air can be ultimately directed into the conditioned space, and during cooling mode, the damper can be opened such that the warmed air can be directed outside. When the damper is open, the same or a separate damper or flap may block the cut-out 316 and/or the access panel air outlet 322 to prevent the warmed air from entering the conditioned space.
While the present disclosure has been described in connection with a plurality of exemplary aspects, as illustrated in the various figures and discussed above, it is understood that other similar aspects can be used, or modifications and additions can be made to the described subject matter for performing the same function of the present disclosure without deviating therefrom. In this disclosure, methods and compositions were described according to aspects of the presently disclosed subject matter. But other equivalent methods or compositions to these described aspects are also contemplated by the teachings herein. Therefore, the present disclosure should not be limited to any single aspect, but rather construed in breadth and scope in accordance with the appended claims.
Moreover, the various diagrams and figures presented herein are for illustrative purposes and are not to be considered exhaustive. That is, the systems described herein can include one or more additional components, such as various valves, expansions tanks, and the like, as will be appreciated by one having ordinary skill in the art.
This application claims priority to and the benefit of U.S. provisional application No. 63/320,477, filed Mar. 16, 2022, which is hereby incorporated by reference herein in its entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/US2023/015292 | 3/15/2023 | WO |
Number | Date | Country | |
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63320477 | Mar 2022 | US |