Claims
- 1. A metal carbide supported compact comprising a sintered polycrystalline compact layer bonded at an interface to a metal carbide support layer, said supported compact characterized as exhibiting essentially constant or increasing principal residual compressive stresses on the surface of said compact layer as portions of a predefined thickness, W, of said support layer measured from said interface are incrementally removed from said supported compact.
- 2. The supported compact of claim 1 wherein said polycrystalline compact layer bonded to said metal carbide support layer comprises diamond.
- 3. The supported compact of claim 1 wherein said polycrystalline compact layer bonded to said metal carbide support layer comprises cubic boron nitride.
- 4. The supported compact of claim 1 wherein said metal carbide support layer supporting said polycrystalline compact layer comprises carbide particles selected from the group consisting of tungsten, titanium, tantalum, and molybdenum carbide particles, and mixtures thereof.
- 5. The supported compact of claim 4 wherein said metal carbide support layer supporting said polycrystalline compact layer comprises a metal binder selected from the group consisting of cobalt, nickel, and iron, and mixtures and alloys thereof.
- 6. The supported compact of claim 1 wherein said portion of said predefined thickness W of said support layer removed from said supported compact is from about 0.02 inch (0.5 mm) to about 0.1 inch (2.5 mm).
- 7. The supported compact of claim 1 wherein said metal carbide support layer supporting said polycrystalline compact layer is provided as having a thickness of from about 0.06-inch (1.5 mm) to about 0.02-inch (0.5 mm).
Parent Case Info
This is a divisional of co-pending application Ser. No. 08/239,156 filed on May 6, 1994, now U.S. Pat. No. 5,512,235.
US Referenced Citations (5)
Divisions (1)
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Number |
Date |
Country |
Parent |
239156 |
May 1994 |
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