Patent Application
20060238976
1. Field of the Invention
The present invention relates to a supporting plate, applied to a notebook computer. It is not only can support a thermal pad of heat sink module, but also can thermal conductive a second heat source component.
2. Description of the Related Art
Most information technology electronic devices, such as notebook computers, their electronic components will often generate a large quantity of heats during operation, therefore, the working temperature continues to be rising during electronic components operation. There is a temperature limit for each electronic component. If the electronic component does not dissipate the heat appropriately, and the heat over the electronic component can stand, it will have an unstable operation occurred in computer and the worse situation will stop or shut down the computer operation. As the operation speed continues to be rising in the electronic components, the higher heats will be generating continually. Therefore, the design of a heat sink module becomes a very important topic.
Usually, a heat sink module is installed on a heat source component of an electronic device, and a thermal pad of the heat sink module must closely attach to the heat surface of the heat source component for a thermal conductive purpose. To the general notebook computer, Central Processing Unit, North Bridge, South Bridge and display chip are the key of the heat source components, therefore, those chips are often operated with large quantity, resulted a large quantity of heats occurred.
Customers demand more and more the efficiency and the capacity of upgrading to the display card, hence, the design of display card is tend to be detachable which like an interface card of a table computer, not to fix to the mother board any more. Therefore, the display card will not be installed in the same plane with Central Processing Unit, South Bridge and North Bridge. As the notebook computer is small and light, to shrink the installed space of the display card, the design of the display card in insert way is different from the table computer. In notebook computer, the display card is horizontally inserted to a slot on the motherboard but the display card of a table computer is vertical inserted to a slot on the motherboard. Therefore, how to dissipate the heat generated from the display chip on the display card in a notebook computer becomes a topic and need to be overcome.
The objective of the present invention is to provide a supporting plate. It is not only can support a thermal pad of a heat sink module, but also can transfer heat from a second heat source component. As the supporting plate applies in the notebook computer, it is not only can dissipate the heat generated from a display chip, but also can transfer the heat generated from a second heat source component, such as a North Bridge to thermal conductive by the second concave.
To reach the aforementioned objective, the present invention provides a supporting plate, comprising a plate, a first concave and a second concave. The plate is a metal plate. The first concave is installed on the plate where corresponds to a thermal pad of the heat sink module. The first concave is to contain a thermal plate, and to hold the thermal pad. There is a hole under the first concave, the hole can contain the Heat Pipe of the heat sink module. The second concave is installed on the second heat source component of an electronic device, utilized to connect with a second heat source component for a thermal conductive purpose. The first concave and the second concave are formed in a punch manner.
By practicing this present invention, the first concave can support a thermal pad of a heat sink module, to connect with the first heat source component of interface cards for a thermal conductive purpose. And by the second concave to connect with the second heat source component of the mother board can also have a thermal conductive purpose. Therefore, the supporting plate has the dual functions to support a thermal pad and to connect with the second heat source component for a thermal conductive purpose. As the heat sink module is located in between the two heat source components where the heat source components are face by face to each other, by this arrangement can save the space in the notebook computer. The heats transfered path of the heat source components are proceeding between the interface card and the mother board, so that the temperature will not be spread directly and will not have a high temperature occurred on the surface of the product.
Thus, the implementation of this present invention brings forth at least the following desirable results:
1. The supporting plate can support the thermal pad of a heat sink module.
2. The supporting plate can transfer a heat from a second heat source component.
The invention will become more fully understood from the detailed description given below for illustration only, and thus are not limitative of the present invention, and wherein:
Referring to
The plate 41, a metal plate, particularly is a well thermal conductive plate, made of the stainless steel. By a metal material extension character, it can be made a first concave 42 and a second concave 43 into a whole in a punch manner.
As the supporting plate 40 is only to connect with the second heat source component 62 for a thermal conductive purpose, which is via the bottom of the second concave 43 to connect with the heat surface of the second heat source component 62 for a thermal conductive purpose. Therefore, the first concave 42 does not need the hole 44.
The supporting plate 40 of this embodiment is to support the thermal pad 22 of a heat sink module, and to connect with the second heat source component 62 for a thermal conductive purpose. The curve position of the first concave 42 is installed on the plate 41 where corresponds to the thermal pad 22 of the heat sink module. And the first concave 42 is to contain and to hold the thermal pad 22. After that, the thermal pad 22 can closely connect with the first heat source component 51 on the interface card 51 in a thermal conductive manner. The first heat source component 51 particularly is a display chip or a graphic chip.
Enable to closely connect with the thermal pad 22 and the first heat source component 51 on the interface card 50, the curve deepness of the first concave 42 is equal to the thickness of the thermal pad 22. Therefore, the top of the thermal pad 22 is same high as the top of the first concave 42, then the display chip or the graphic chip can smoothly connect with the thermal pad 22. The curve shape and the curve area of the first concave 42 are formed to contain the thermal pad 22. Enable to smoothly connect the heat pipe 23 with the thermal pad 22, the bottom of the first concave 42 has a hole 44, and the hole 44 can contain the heat pipe 23.
The second concave 43, its location is corresponded to the second heat source component 62 of the electronic device. The second heat source component 62 is one of Central Process Unit, a South Bridge, a North Bridge or a display chip. Enable to make the second concave 43 can closely connect with second heat source component 62 for a thermal conductive purpose, the curve deepness of the second concave 43, that is the bottom of the second concave 43, must be designed to closely attached to the surface of the second heat source component 62 for a thermal conductive purpose.
Referring to
When the supporting plate 40 be operated, first, the supporting plate 40 is connected with a heat sink module, then to screw hold them on the mother board 60. At the time, the second concave 43 of the supporting plate 40 is smoothly attached on the second heat source component 62 on the motherboard 60. Wherein the second heat source component 62, particularly is North Bridge, the bottom of the thermal pad 22 is closely attached to the first concave 42 of the supporting plate 40. Therefore, the heat of the North Bridge can transfer from the second concave 43 to the first concave 42 and can further transfer from the first concave 42 to the thermal pad 22 to dissipate the heat by the heat sink module.
The interface card 50 is via the slot 61 to connect with the motherboard 60. By the hole 52 of the interface card 50, the buckle pillar 212 and the screw pillar 214 of the thermal pad 22 can pass through the hole 52. Then put a buckle 219 of the clip 216 to hold the ring curve 213 of the buckle pillar 212, and put the screwed hole 218 of the clip 216 to aim at the screw hole 215 of the screw pillar 214; finally, using the screw to screw the screwed hole 218 and the screw hole 215. Therefore, the thermal pad 22 installed on the first concave 42 can closely connect with a display chip or a graphic chip on the interface card 50, and can dissipate the heat from the display chip or the graphic chip. When the supporting plate 40 being practiced, both the first heat source component 51 of interface card 50 and the second heat source component 62 of motherboard 60 can thermal conductive at the same time, and by heat sink module to dissipate the heats.
Those described above are only the preferred embodiments of the present invention, and it is no intended to limit the scope of the present invention. And equivalent variation and modification according to the appended claims of the present invention would not depart from the spirit of the present invention and is to be included within the scope of the present invention.
