Claims
- 1. A duplexer comprising:
- an integrally formed multi-layer package, said multi-layer package formed of an alumina-ceramic;
- a predetermined number of surface-acoustic-wave band pass filter chips having different pass-band central frequencies mounted on an interior side of the multi-layer package a cap, mounted on said multi-layer package, said cap and said multi-layer package hermetically sealing said surface-acoustic-wave band pass filter chips; and
- phase matching circuit patterns connecting the surface-acoustic-wave band pass filter chips
- formed on an exterior surface layer of the multi-layer package.
- 2. The duplexer as claimed in claim 1, wherein the phase matching circuit patterns are formed as microstrip lines.
- 3. The duplexer as claimed in claim 1, wherein the phase matching circuit patterns are formed as layers containing a copper member.
- 4. The duplexer as claimed in claim 1, wherein a grounding layer is provided above the phase matching circuit patterns via an insulating layer.
- 5. The duplexer as claimed in claim 1, wherein a predetermined number of external connection terminals are formed in a bottom layer of the multi-layer package, and each of the phase matching circuit patterns is connected to one of the external connection terminals via a common terminal.
- 6. The duplexer as claimed in claim 1, wherein the phase matching circuit patterns include a predetermined number of adjustment patterns for adjustment of the length of the phase matching circuit patterns between an input and an output of the phase matching circuit.
- 7. A duplexer comprising:
- a predetermined number of surface-acoustic-wave band pass filter chips having different pass-band central frequencies; and
- a multi-layer package having said predetermined number of filter chips mounted on a chip mounting surface and having terminals for connection with external circuits formed in a bottom layer of the multi-layer package; and
- phase matching circuit patterns connected between the surface-acoustic-wave band pass filter chips, said phase matching circuit patterns being formed on an exterior surface of said multi-layer package, wherein said exterior surface of said multi-layer package is disposed between said chip mounting surface and said terminals.
- 8. The duplexer as claimed in claim 7, wherein said phase matching patterns are formed as microstrip lines.
- 9. The duplexer as claimed in claim 8, wherein said phase matching patterns are formed as layers containing a copper member.
- 10. The duplexer as claimed in claim 7, wherein common grounding patterns are formed between said chip mounting surface and said terminals.
- 11. The duplexer as claimed in claim 7, wherein an antenna terminal pattern connected to said filter chips is formed inside said multi-layer package.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-134311 |
May 1995 |
JPX |
|
Parent Case Info
This application is a Continuation-in-Part of application Ser. No. 08/603,615, filed Feb. 21, 1996, now abandoned.
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Number |
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Date |
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4737742 |
Takoshima et al. |
Apr 1988 |
|
5554960 |
Ohnuki et al. |
Sep 1996 |
|
5561406 |
Ikata et al. |
Oct 1996 |
|
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62-0269402 |
Nov 1987 |
JPX |
405095253 A |
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JPX |
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Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
603615 |
Feb 1996 |
|