Coaxial cables are present in a wide variety of electronic devices. Frequently, coaxial cables carry radio frequency (RF) signals from RF modules to antennas in an electronic device.
Changes in the physical routing of coaxial cabling along a backplane, such as a printed circuit board, can affect the electrical characteristics, such as impedance, of the coaxial cabling or adjacent components or both. Maintaining an intended arrangement of the physical routing of coaxial cabling during and after assembly produces an electronic device which performs as engineered.
Shrinking devices and use of surface mount technology has rendered routing coaxial cable runs within electronic devices more critical. Many small form factor devices such as e-book readers, cellular telephones, portable media players, laptops, netbooks, and the like, utilize coaxial cables.
However, the low profile and volumetric confines of these small form factor devices, combined with the small diameters of coaxial cable used, makes establishing coaxial cable routing during assembly a challenge.
In addition to maintaining the physical routing of the coaxial cabling, proper grounding of the coaxial cable poses further challenges in electronic devices. Improper, erratic, or incomplete grounding of coaxial cable can result in electromagnetic interference between components in the device, adversely affecting performance.
Effectively grounding coaxial cable during assembly can be particularly difficult given the small size of surface mount devices and the small diameter of coaxial cable often used. For example, grounding by soldering a shield of the coaxial cable to a printed circuit board is difficult, expensive in time and labor, and likely to damage the coaxial cable. Desoldering or cutting is required during subsequent removal of the coaxial cable.
Thus, surface mount electronic devices which use coaxial cabling pose special challenges in physical routing and grounding during assembly and repair.
The detailed description is set forth with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items.
Overview
As discussed above, maintaining an intended route of a coaxial cable along a backplane and properly grounding the coaxial cable produces an electronic device which performs as engineered. However, the low profile and limited volume in small form factor devices makes routing and grounding small diameter coaxial cable on a backplane difficult. The surface-mount grounding system described herein maintains a desired routing of coaxial cable along a backplane in an electronic device, and provides an electrical ground connection for the coaxial cable. In one illustrative example, a surface mount clip affixed to a backplane positively engages a sheath affixed to a coaxial cable to route and ground the coaxial cable.
The sheath body may be circular in cross section, and maybe affixed circumferentially to a coaxial cable. The sheath may be affixed to the coaxial cable by crimping, adhesive, or a latch integral to the sheath body. The sheath may include a tooth or an edge to pierce or break the coaxial cable external insulation and contact the coaxial cable shield. For example, if attached by crimping, the sheath may break the insulation on insulated coaxial cable during crimping to contact the coaxial cable shield. In other implementations, surface-mount grounding systems may be provided that omit the sheath altogether. In that case, the clip retains and grounds the cable directly.
In one specific example, an electronic device such as an e-Book reader may utilize an antenna to radiate and receive radio signals. A coaxial cable may connect the RF module and the antenna. Within the e-Book reader, a printed circuit board (PCB) has surface mount electronic components affixed. One or more clips soldered to the PCB along an intended path of the coaxial cable define the route of the coaxial cable. Soldering aids in the electrical connection to the electrical ground on the PCB required for grounding. The coaxial cable used to connect the RF module and the antenna has sheaths attached on the cable to correspond to the location of the clips. One end of the coaxial cable may be connected to the RF module, for example, via solder or a connector. The coaxial cable may be laid along the predetermined route, and the sheaths can then be pushed into the clips, mechanically and electrically engaging the coaxial cable and clip via the sheath. The other end of the coaxial cable may then be connected to the antenna, for example via solder or a connector. Installation is thus quicker, and during service removal of the coaxial cable without desoldering or cutting at the grounding points is possible.
While coaxial cable is discussed, the described device and method may be used for other types of cabling, such as a single wire, a multiconductor cable with a circular cross section, or a multiconductor ribbon cable with a rectangular cross section. For cable types with non-circular cross sections, the sheaths and/or clips may have alternate designs, as described above with reference to
While describe in the context of coaxial cable and printed circuit boards, the system is applicable to routing and grounding other cables to other types of backplanes.
Sheath and Clip Design
The clip 104 is capable of accepting and engaging a sheath, such as sheath 102. The clip 104 may be comprised of any of the materials described above for the sheath. As for the clip, where the material is non-conductive but conductivity is desired, the clip may be plated with a conductive material.
In the implementation of
Extending away from the centerline 114 at the left and right inward bend ridges are top flanges 120 and 122, respectively. Top flanges 120 and 122 are substantially parallel to the bottom surface 108 and extend away from the centerline 114 of the clip 104. The top flanges 120 and 122 protect the coaxial cable 106 from inadvertent crushing during assembly, as well as provide a useable surface for automated equipment such as pick-and-placement machines to retrieve the clip 104. The bottom surface 108 may extend a length “L” 124 along the centerline 114 beyond front and back vertical edges of the vertical sides 110 and 116 to form tabs 126. These tabs 126 provide for easier access when soldering or otherwise affixing the clip 104 to a backplane (not shown). A backplane as used herein includes a printed circuit board, housing, or other mounting surface.
Use of a clip, such as clip 104, to attach and ground a cable to a backplane allows installation of the cable without manually soldering, which is time intensive, expensive, and prone to damage the cable. Also, using such a clip facilitates removal and reinstallation of the cable if necessary during assembly or repair as no desoldering or cutting is necessary for removal from the clip. Also, desired routing and grounding of the cable is more easily achieved and reproducible using the clip compared to direct soldering of the board due to the clip being affixed to the board prior to installation of the coaxial cable. When sheaths are used, the sheaths further aid in the routing and grounding for the cable, because the sheaths define locations at which the clip retains the cable. That is, sheaths serve as locating means along the cable to indicate which points of the cable engage with the clip.
The clip may also accept a coaxial cable 106 which does not have a sheath, or has a non-conductive sheath. When grounding an insulated coaxial cable with a non-conductive sheath or without a sheath, teeth may be present along the bottom surface 108 of the clip 104, left side 110, right side 116, or on the face of the left inward bend ridge 112 or right inward bend ridge 118, or any suitable combination thereof, to pierce the sheath, insulation, or both and establish an electrical connection.
Other Clip Designs
A relief hole 412 may be present in the left or right or both sides of the clip 400 to permit easier insertion of the sheath 102. Any of the clips or sheaths disclosed herein may have, or omit, relief holes.
The sheath and the clip may be made by stamping, milling, molding, forming, or other methods of fabrication suitable to the material chosen. Moreover, the sheath and clips may be assembled to a backplane using manual and/or automated assembly techniques, such as pick-and-place machines, automated soldering processes, manual assembly, etc. Solder, adhesive, mechanical engagement, and the like, may affix the clip to the backplane and the clip to the coaxial cable. Any of the acts of any of the devices described herein may be implemented in a variety of materials or similar configurations.
Illustrative Manufacturing Method
Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the claims. For example, any of the devices described herein may be implemented using a variety of materials, or steps in the methods presented may be implemented in a variety of sequences.
Number | Name | Date | Kind |
---|---|---|---|
3383457 | Schumacher et al. | May 1968 | A |
3549787 | Churla, Jr. | Dec 1970 | A |
4637669 | Tajima | Jan 1987 | A |
5092795 | Kitagawa | Mar 1992 | A |
5207597 | Kline et al. | May 1993 | A |
5397250 | Briones | Mar 1995 | A |
5401192 | Briones et al. | Mar 1995 | A |
5949020 | Mitchell et al. | Sep 1999 | A |
6050854 | Fang et al. | Apr 2000 | A |
6132253 | Wu | Oct 2000 | A |
6190205 | Wu | Feb 2001 | B1 |
6319061 | Chen et al. | Nov 2001 | B1 |
6343941 | Kan | Feb 2002 | B1 |
6343956 | Stickney | Feb 2002 | B2 |
6368154 | Hirata et al. | Apr 2002 | B1 |
6478622 | Hwang | Nov 2002 | B1 |
6482044 | Ma et al. | Nov 2002 | B1 |
6582240 | Suto | Jun 2003 | B2 |
6773275 | Chen | Aug 2004 | B1 |
7044791 | Wang | May 2006 | B2 |
7371084 | Xue et al. | May 2008 | B2 |
7473127 | Wang et al. | Jan 2009 | B2 |
7530845 | Yang | May 2009 | B1 |
7608782 | Hill | Oct 2009 | B2 |
7686646 | Lee et al. | Mar 2010 | B2 |
7708600 | Wu | May 2010 | B2 |
20080266198 | Walker et al. | Oct 2008 | A1 |