Surface-mount coil and method for manufacturing same

Information

  • Patent Grant
  • 6825746
  • Patent Number
    6,825,746
  • Date Filed
    Tuesday, March 25, 2003
    21 years ago
  • Date Issued
    Tuesday, November 30, 2004
    19 years ago
Abstract
A surface mountable coil is provided with a drum-shaped core including a body portion and raised portion each raised portion having a peripheral surface and an end surface, a winding wire wound around the body portion, an encapsulating member, base electrodes, and terminal electrodes. The encapsulating member exposes some portions of the base electrodes on the peripheral surfaces and substantially the whole base electrodes on the end surfaces. By exposing the portions of the base electrodes on the peripheral surfaces and whole base electrodes on the end surfaces, the contact strength between the base electrodes and the terminal electrodes can be substantially increased.
Description




FIELD OF THE INVENTION




The present invention relates to a surface-mount (or surface mountable) coil; and, more particularly, to an electrode structure thereof and a method of making same.




BACKGROUND OF THE INVENTION




Nowadays, miniaturized chip type electronic components are extensively employed in high density surface mounting on a printed circuit board by using a chip mounter. Referring to

FIGS. 10 and 11

, there are illustrated a partial cut-away view and a cross sectional view of a conventional winding type surface mountable chip coil


10


having a wiring wound around a core thereof. The coil


10


typically includes a drum-shaped core


4


having a body portion


1


and raised portions


2


,


3


integrally formed at two opposite ends of the body portion


1


; a winding wire


5


wound around the body portion


1


; base electrodes


6


-


1


,


6


-


2


disposed on two end surfaces


2




b


,


3




b


and also on parts of peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


, two ends (not shown) of the winding wire


5


being connected to the base electrodes


6


-


1


,


6


-


2


; an encapsulating member


7


covering the whole structure excepting parts of the base electrodes


6


-


1


,


6


-


2


at the central regions of the end surfaces


2




b


,


3




b


of the raised portions


2


,


3


; and terminal electrodes


8


-


1


,


8


-


2


covering exposed base electrodes


6


-


1




a


,


6


-


2




a


up to portions of the encapsulating member


7


on the peripheral surfaces


2




a


and


3




a.






In the surface mountable coil


10


illustrated above, the drum-shaped core


4


, to which the base electrodes


6


-


1


,


6


-


2


can be directly attached, is made of a magnetic material, e.g., nickel-zinc based ferrite of a high resistivity, or an insulating material, e.g., alumina. The base electrodes


6


-


1


,


6


-


2


are conductive layers, each including therein Ag, Ag—Pt or Cu film formed by dip-baking or plating, and a conductive material, e.g., Ni/Sn or Sn alloy formed thereon. The winding wire


5


is a conductive wire coated with an insulating film, e.g., polyurethane, polyamideimide, and the like. with a diameter of 0.03˜0.15 mm and the respective end portions thereof are connected to the base electrodes


6


-


1


,


6


-


2


on the peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


by means of welding, thermocompression bonding, ultrasonic vibration, or a combination thereof. The encapsulating member


7


is formed by injection molding of an epoxy based synthetic resin.




After forming the encapsulating number


7


, the terminal electrodes


8


-


1


,


8


-


2


are formed on the regions corresponding to the end surfaces


2




b


,


3




b


and the peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


, respectively, and the finished structure is shaped to provide the thin miniaturized surface mountable coil


10


.




In the conventional surface mountable coil described above, only small portions


6


-


1




a


,


6


-


2




a


of the base electrodes


6


-


1


,


6


-


2


on the central parts of the end surfaces


2




b


,


3




b


of the core


4


are exposed through the encapsulating member


7


. Therefore, the contact areas between the base internal electrodes


6


-


1


,


6


-


2


and the terminal electrodes


8


-


1


,


8


-


2


are limited to be the small portions of the base electrodes


6


-


1


,


6


-


2


exposed through the encapsulating member


7


, resulting in a structurally insufficient adhesion strength between the base and the terminal electrodes.




As a result, in case where the surface mountable coil


10


is soldered on a printed circuit board and subjected to thermal variation, e.g., by a thermal cycle test (TCT test), the terminal electrodes


8


-


1


,


8


-


2


may be delaminated from contact portions of the base electrodes


6


-


1


,


6


-


2


, i.e., the exposed base electrodes


6


-


1




a


,


6


-


2




a


, due to thermally induced tensile stresses on the terminal electrodes


8


-


1


,


8


-


2


.




The present inventors have conducted a series of experiments and found that the mechanical contact strength between the base electrodes


6


-


1


,


6


-


2


and the terminal electrodes


8


-


1


,


8


-


2


can be substantially increased when the terminal electrodes


8


-


1


,


8


-


2


are in contact with at least on portions of the peripheral surfaces


2




a


,


3




a


as well as the base electrodes


6


-


1


,


6


-


2


on the end surfaces


2




b


,


3




b.






One may be tempted to remove parts of the encapsulating member


7


off the peripheral surfaces


2




a


,


3




a


after molding in order to expose the base electrodes


6


-


1


,


6


-


2


underneath, but the encapsulating member


7


circumferentially formed thereon is too rigid to be readily removed.




Another way to expose the base electrodes


6


-


1


,


6


-


2


on the peripheral surfaces


2




a


,


3




a


may be to remove a gap clearance between the inner surface of the mold and the base electrodes


6


-


1


,


6


-


2


disposed on the peripheral surfaces


2




a


,


3




a


to prevent the synthetic resin from being injected through the gap during the molding process to reach the end surfaces


2




b


,


3




b


of the raised portion


2


,


3


. Since the gap serves as an escape path of the injected resin during the molding process, the core


4


and/or the wire


5


can be subjected to a high pressure induced by the absence of the escape path. The escape path is necessary for the synthetic resin to uniformly flow into and fill in the mold cavity, and consequently, burrs (surplus encapsulating member


7


on the peripheral surfaces


2




a


,


3




a


) would be unavoidably formed.




SUMMARY OF THE INVENTION




It is, therefore, an object of the present invention to provide a surface mountable coil having a reliable electrode structure, and method for the manufacture thereof.




In accordance with a preferred embodiment of the present invention, there is provided a surface mountable coil comprising:




a core including a body portion and two raised portions disposed at two opposite ends of the body portion, each of the raised portions having an end surface and a peripheral surface;




a winding wire wound around the body portion;




a pair of base electrodes, each of the base electrodes being disposed on the peripheral surface and the end surface of the raised portions, and two ends of the winding wire being connected to the base electrodes respectively;




an encapsulating member extending from a portion of one base electrode to a portion of the other base electrode to thereby cover the region therebetween while exposing a part of the base electrode on each peripheral surface and substantially the entire base electrode on each end surface; and




a pair of terminal electrodes respectively covering the exposed internal electrodes and the end portions of the encapsulating member on the peripheral surfaces of the raised portions,




wherein the end portions of the encapsulating member on the peripheral surfaces have peak portions extending toward the end surfaces of the raised portions and valley portions retracting away from the end surfaces.











BRIEF DESCRIPTION OF THE DRAWINGS




The above and other objects and features of the present invention will become apparent from the following description of preferred embodiments given in conjunction with the accompanying drawings, in which:





FIG. 1

shows a cross-sectional view of a surface mountable coil in accordance with a preferred embodiment of the invention;





FIG. 2

provides a perspective view of the surface mountable coil prior to the formation of terminal electrodes, illustrating an overlay configuration of an encapsulating member on base electrodes at the peripheral surfaces of the raised portions of a core;





FIG. 3

describes a perspective view of a drum-shaped core in accordance with a first preferred embodiment of the invention;





FIGS. 4A

to


4


C illustrate various exemplary structures of a raised portion of a drum-shaped core in accordance with a second preferred embodiment of the invention;





FIG. 5

offers a perspective view depicting a shape of a raised portion of a drum-shaped core in accordance with a third preferred embodiment of the invention;





FIG. 6

presents a perspective view of a base electrode in accordance with a preferred embodiment of the present invention;





FIG. 7

portrays a perspective view of a base electrode in accordance with another preferred embodiment of the invention;





FIG. 8

represents a cross-sectional view of a surface mountable coil in accordance with another preferred embodiment of the invention;





FIG. 9

displays a cross-sectional view of a surface mountable coil during an injection molding process in accordance with the present invention;





FIG. 10

exemplifies a cut-away view of a conventional surface mountable coil; and





FIG. 11

exhibits a cross-sectional view of a conventional surface mountable coil.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




The preferred embodiments of a surface mountable coil in accordance with the present invention will now be described with reference to

FIGS. 1

to


9


. Like reference numerals and characters will be used to designate like parts of the conventional coil


10


and the preferred embodiments of the invention.




Referring to

FIGS. 1 and 2

, a surface mountable coil


30


includes a drum-shaped core


4


having a body portion


1


and raised portions


2


,


3


integrally formed at two opposite ends of the body portion


1


; a winding wire


5


wound around the body portion


1


; base electrodes


6


-


1


,


6


-


2


disposed on end surfaces


2




b


,


3




b


and peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


, the respective end portions (not shown) of the wire


5


being connected to the base electrodes


6


-


1


,


6


-


2


; an encapsulating member


17


extending from a portion of the base electrode


6


-


1


on the peripheral surface


2




a


to a portion of the base electrode


6


-


2


on the peripheral surface


3




a


; and terminal electrodes


18


-


1


,


18


-


2


covering exposed portions of the base electrodes


6


-


1


,


6


-


2


and end portions of the encapsulating member


17


on the peripheral surfaces


2




a


,


3




a


. In accordance with the present invention, the edges of the encapsulating member


17


have peak (P) and valley (V) portions alternatively disposed along the peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


, said P and V portions extending towards and retracting away from the end surfaces


2




b


and


3




b


, respectively.




In other words, portions of the base electrodes


6


-


1


,


6


-


2


on the peripheral surfaces


2




a


,


3




a


are not covered with the encapsulating member


17


. Leading edges of the progression part P portions may remain on the peripheral surfaces


2




a


,


3




a


or may reach the end surfaces


2




b


,


3




b.






Since at least some portions of the base electrodes


6


-


1


,


6


-


2


on the peripheral surfaces


2




a


,


3




a


are exposed without being covered by the encapsulating member


17


as described above, the terminal electrodes


18


-


1


,


18


-


2


can encompass virtually the entire base electrodes


6


-


1


,


6


-


2


on the end surfaces


2




b


,


3




b


and the exposed portions thereof on the peripheral surfaces


2




a


,


3




a


. As a result, the mechanical adhesive contact strength between the base electrodes


6


-


1


,


6


-


2


and the terminal electrodes


18


-


1


,


18


-


2


of the present invention is substantially increased compared with that of a conventional surface mountable coil


10


shown in

FIGS. 10 and 11

having the contact areas only at the central parts of the end surfaces; and thus the delamination of the terminal electrodes


18


-


1


,


18


-


2


from the base electrodes


16


-


1


,


16


-


2


can be effectively prevented and the reliability can be increased.




The wavy profile of the encapsulating member


17


on the peripheral surfaces


2




a


,


3




a


shown in

FIG. 2

can be obtained by using, e.g., a drum-shaped core


12


having plateaus (PL) and recesses (R) alternately formed on the peripheral surfaces of the raised portions


2


,


3


of the core


12


as illustrated in

FIG. 3

, the recesses running parallel to the axial direction of the body portion


1


of the core. That is, when molding an encapsulating material, which forms the encapsulating member


17


, after forming the base electrodes


6


-


1


,


6


-


2


on the drum-shaped core


12


as in

FIG. 1

, the gaps between the mold and the recesses serve as escape paths for the encapsulating material. Therefore, the encapsulating material would penetrate more along the recesses and less along the plateaus towards the end surfaces of the raised portions


2


,


3


, resulting in the wavy profile of the encapsulating member


17


exposing portions of the base electrodes


6


-


1


,


6


-


2


on the peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


as shown in FIG.


2


. Some of the encapsulating material penetrating along the recesses may reach the end surfaces of the raised portions


2


,


3


and become burrs after being solidified. Such burrs are relatively easy to remove because they are not linked together. The burrs may not be removed before forming the terminal electrodes


18


-


1


,


18


-


2


.




The raised portions


2


,


3


are preferably of a polygonal shape and more preferably of a rectangular shape when viewed along the axial direction of the body portion


1


. In such a case, the escape paths for the encapsulating material can be secured by providing at the corners of the peripheral surfaces


2




a


,


3




a


of the raised portions


2


,


3


of the drum-shaped core


4


shown in

FIG. 1

, cutaway portions Z


1


, Z


2


, Z


3


extending along the axial direction of the core


4


as shown in

FIGS. 4A

to


4


C. The cutaway portions Z


1


of a drum-shaped core


13


in

FIG. 4A

are of a rectangular shape; a drum-shaped core


14


with the cutaway portions Z


2


in

FIG. 4B

has slanted corners, and a core


15


with the cutaway portions Z


3


in

FIG. 4C

has removed corners when viewed along the axial direction of the body portion of each core. Providing escape paths at the corners of a core is advantageous in that it is relatively easy to form the cutaway portions Z


1


, Z


2


, Z


3


at the corners and that such cutaway portions can be made large enough to serve as the escape paths effectively. It is important to make a sufficiently narrow clearance between the mold and the peripheral surfaces of the raised portions


2


,


3


of the drum-shaped cores


4


,


12


,


13


,


14


,


15


described above, on which the base electrodes


6


-


1


,


6


-


2


are disposed, to prevent the encapsulating material from covering the entire peripheral surfaces of the raised portions


2


,


3


.




Referring to

FIG. 5

, there is illustrated another exemplary drum-shaped core


21


having recesses (Y) and plateaus (X) both on the end surfaces and on the peripheral surfaces of the raised portions


2


,


3


thereof. The recesses may all be linked together as shown in FIG.


5


. When molding, the encapsulating material penetrates through the recesses, which serve as the escape paths, towards the end surfaces. By controlling the clearance between the mold and the peripheral surfaces to be small enough such that the encapsulating material does not cover the end surfaces and the plateaus of the peripheral surfaces, it is possible to secure the exposed base electrodes (i.e. uncovered by the encapsulating material) on the end surfaces and portions of the peripheral surfaces.




The base electrodes need not have any specific structure. The base electrodes can be of a structure having planar surfaces as shown in

FIGS. 1 and 2

. It is preferable, however, to make the base electrodes to have an uneven material


43


.




The base electrodes


6


-


1


,


6


-


2


and the terminal electrodes


18


-


1


,


18


-


2


are formed of, e.g., a resin paste containing silver. The encapsulating member


17


is formed of, e.g., a synthetic resin such as an epoxy based resin, phenol resin and silicone resin, or such a resin containing therein powder of a magnetic material or an insulating material.




While the invention has been shown and described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined in the following claims.



Claims
  • 1. A surface mountable coil comprising:a core including a body portion and two raised portions disposed at two opposite ends of the body portion, each of the raised portions having an end surface and a peripheral surface, wherein the peripheral surface has corner regions and is provided with cutaway portions at the corner regions; a winding wire wound around the body portion; a pair of base electrodes, each of the base electrodes being disposed on the peripheral surface and the end surface of one of the raised portions, and two ends of the winding wire being connected to the base electrodes respectively; an encapsulating member extending from a portion of one base electrode to a portion of the other base electrode to thereby cover the region therebetween while exposing a part of the base electrode on each peripheral surface; and a pair of terminal electrodes respectively covering the exposed base electrodes and end portions of the encapsulating member on the peripheral surfaces of the raised portions, wherein the end portions of the encapsulating member on the peripheral surfaces have peak portions extending toward the end surfaces of the raised portions and valley portions retracting away from the end surfaces.
  • 2. The surface mountable coil of claim 1, wherein the encapsulating member exposes the entire base electrodes on the end surfaces.
  • 3. The surface mountable coil of claim 1, wherein the peripheral surfaces are provided with recesses.
  • 4. The surface mountable coil of claim 1, wherein the peripheral surfaces the end surfaces are provided with recesses and protrusions.
  • 5. The surface mountable coil of claim 1, wherein each of the base electrodes is a mesh-shaped electrode.
  • 6. The surface mountable coil of claim 1, wherein each of the base electrodes is a perforated electrode having a plurality of openings.
  • 7. The surface mountable coil of claim 1, further comprising a stress buffer layer disposed between each of the base electrodes and the end surface of each of the raised portions.
  • 8. The surface mountable coil of claim 1, wherein each of the raised portions is of a polygonal shape when viewed along an axial direction of the body portion.
  • 9. The surface mountable coil of claim 1, wherein each of the raised portions is of generally a rectangular shape when viewed along art axial direction of the body portion.
  • 10. The surface mountable coil of claim 9, wherein at least one of the cutaway portions is of a rectangular shape pillar having a rectangular base.
  • 11. The surface mountable coil of claim 9, wherein at least one of the cutaway portions is of a triangular prism shape having a triangular base.
  • 12. The surface mountable coil of claim 9, wherein the rectangular shape has one or more round corners.
  • 13. The surface mountable coil of claim 1, comprising the step of:preparing the core provided with the winding wire and the base electrodes; providing a mold having an elastic material on parts of an inner surface thereof, the elastic material facing portions of the base electrodes on the peripheral surfaces; molding the encapsulating member by using the mold while maintaining the contact between the elastic material and the portions of the base electrodes on the peripheral surfaces; and forming the terminal electrodes.
Priority Claims (1)
Number Date Country Kind
11-335735 Nov 1999 JP
Parent Case Info

This application is a divisional application of prior U.S. application Ser. No. 09/718,967 now U.S. Pat. No. 6,566,993 B1.

US Referenced Citations (2)
Number Name Date Kind
6154112 Aoba et al. Nov 2000 A
6566993 Otsuka et al. May 2003 B1