Surface mount connector with integrated PCB assembly

Information

  • Patent Grant
  • 6183301
  • Patent Number
    6,183,301
  • Date Filed
    Thursday, January 16, 1997
    28 years ago
  • Date Issued
    Tuesday, February 6, 2001
    24 years ago
Abstract
A connector is formed of printed circuit board (PCB) modules (10). The PCB modules are provided at a mounting interface with surface engaging terminals (22) for interconnecting traces (16) on the PCBs (12) with traces on the mounting substrate. The terminals may comprise compressible or deformable elements formed of conductive elastomeric rods or solder balls fitted into recesses (36) in the board edges. A shield terminal (28) functions as a hold down that is alternately convertible from a through-hole mounting position to a surface mounting position by bending the terminal. The shield terminals (28) are to be joined to shield layers (24) formed on one side of the PCBs (12)
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to connectors and specifically to high speed, shielded connectors having one or more integrated PCB assemblies.




2. Brief Description of Prior Developments




U.S. Pat. No. 4,571,014 shows an approach for the manufacturing of backplane connectors using one or more PCB assemblies. Each of the PCB assemblies comprises one insulated substrate, one spacer, and one cover plate, all of which are attached to one another. The insulating substrate is provided with a predetermined pattern of conducting tracks, while ground tracks are provided between the conducting tracks. The conducting tracks are connected at one end to a female contact terminal for connection to the backplane and at the other end to a male through-hole contact terminal.




PCT patent application Ser. No. US96/11214 filed Jul. 2, 1996 also discloses connectors employing side-by-side circuit substrates. The connectors disclosed in that application also employ through-hole terminals to make a mechanically and electrically secure connection to the circuit board on which the connector is to be mounted. The disclosure of the above-mentioned application is incorporated herein by reference.




While both of the above-mentioned connector arrangements can yield useful interconnection systems, many manufacturers of electronic equipment prefer to surface mount components on printed circuit boards. Surface mounting provides enhanced opportunities for miniaturization and the potential for mounting components on both sides of the circuit board.




SUMMARY OF THE INVENTION




The object of the present invention is to provide high speed connectors that can be surface mounted onto a receiving substrate.




Another object of the invention is to provide surface mount connectors having relatively low manufacturing costs.




These objects achieved in modularized connectors employing a plurality of conductive terminal traces by providing deformable conductive elements at the interface of the PCBs with the circuit substrate on which the connector is to be mounted. The conductive elements may be received in one or more recesses in the edges the PCBs. Recesses for receiving the deformable elements can also be present in the cover plates overlying each of the PCBs.




Second contact terminals may comprise press-fit or compliant section pins for additionally securing the connector on a circuit substrate and to hold the deformable elements against contact pads on the substrate. Such second contacts can form convertible terminals that can be press fitted or, upon reorientation, surface mounted on the substrate.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

shows in partial cross-section a connector illustrating the principles of the present invention;





FIG. 1



a


is an enlargement of the circled area of

FIG. 1

;





FIG. 2

shows a rear view of the connector shown in

FIG. 1

;





FIG. 3

is a partial bottom view of the connector shown in

FIG. 1

;





FIG. 4

is a partial isometric view of a PCB assembly according to the invention;





FIG. 4



a


is a fragmentary view of a PCB assembly having a shield layer on the obverse side of the PCB;





FIG. 5

is a partial cross-sectional view showing an alternative mounting of shield terminals on the PCB assembly of the connector shown in

FIG. 1

;





FIG. 5



a


is an illustration of the circled area in

FIG. 5

with the shield/hold down terminal in an actual surface mount orientation;





FIG. 6

is a rear view of the connector of

FIG. 5

;





FIG. 7

is a front view of a hold down terminal used with the connector in

FIG. 5

;





FIG. 8

is a side view of the hold down terminal shown in

FIG. 7

;




and





FIG. 9

illustrates a second form of mounting interface terminal.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




It is to be understood that, although the figures illustrate right angle connectors, the principles of the present invention equally apply to other connector configurations.





FIGS. 1 and 2

show two views of a connector formed of a plurality of integrated PCB column modules


10


. The modules


10


may comprise basically two elements, a printed circuit board (PCB)


12


and an insulative cover


14


. The phantom lines in

FIG. 1

show the features of cover


14


in relation to elements of PCB


12


.




Referring to

FIG. 1

, the PCB assembly


10


comprises an insulating substrate


12


of a material commonly commercially used for making PCBs. The substrate


12


can be a substantially planar resin impregnated fiber assembly, such as is sold under the designation FR


4


, having a thickness 0.4 mm, for example. On a first surface of the substrate


12


, a plurality of circuit or signal traces


16


are formed by conventional PCB techniques. Each trace


16


extends from a first portion of the substrate


10


, for example adjacent the front edge as shown in

FIG. 1

, to a second area or region of the substrate


10


, such as the bottom edge as shown in FIG.


1


. The traces


16


may include contact pads at one end adapted to have metal terminals secured to them, as by conventional surface mounting techniques using solder or welding. A plurality of ground or shielding traces


18


may also be applied to the substrate


10


. The shielding traces


18


may be disposed between each of the circuit traces


16


or between groups of such traces. A terminal, such as a contact terminal


20


is mounted at the first end of each trace


16


. Board mounting terminals


22


, described in greater detail below, are disposed at the second end of each circuit trace


16


. An additional shielding or ground layer


24


may be applied to the remainder of the trace bearing side of substrate


12


. A ground or shield terminal


28


is fixed onto the ground layer


24


.




The contact structures


22


comprise surface mount terminals for electrically interconnecting each of the traces


16


with a circuit trace printed on the circuit substrate (not shown) onto which the connector is to be mounted. In a preferred arrangement, the contact structures


22


include a compressible or deformable element


30


formed of an elastomeric material. The element


30


may be circular in cross-section (as shown), D-shaped or another appropriate shape. The member


30


can be a continuous, elongated member that extends between several PCB modules, as shown (in FIG.


3


), along aligned edges. In this case, the member has alternating non-conductive regions


32


and conductive regions


34


, which can be formed by metallized coatings. The conductive regions are generally aligned with the centerlines of the contacts


20


. In this manner, the row pitch of the connector at the mating interface is carried through to the contact pitch at the mounting interface. Along an edge


38


of the PCB


12


adjacent the ends of tracks


16


, are suitably shaped recesses or notches


36


, that may, for example, have a trapezoidal form as in

FIG. 1



a


or a circular form, as shown in

FIG. 4



a


. The compressible member


30


is received in and retained, as by a push fit, in the notches


36


with a portion extending beyond edge


38


. This arrangement provides a mounting interface with good coplanarity. The inside surfaces


36




a


of each notch


36


are metallized, preferable by a coating that is continuous with the circuit trace


16


. If a shield or ground layer


37


(

FIG. 4



a


) is present on the obverse side of PCB


12


, the shield should be spaced from the notch


36


, so that the notch remains electrically isolated from the shield layer, as is shown in more detail below. The covers


14


are similarly notched to accept the compressible member


30


. The conductive sections


34


are arranged so that one end portion extends into the notch


36


and is in electrical contact with the plating on the interior surfaces


36




a


of the notch.




Each PCB module


10


preferable includes a hold-down for holding a connector formed from a plurality of such modules on a circuit substrate. In

FIG. 1

, the press-fit terminal


28


comprises such a hold-down. As well, the location peg


71


and hold-down pegs


73


of the housing


70


can be utilized to provide hold down or board retention functions. When the connector is pressed onto the receiving circuit substrate and the terminals


28


are pressed into holes on the circuit substrate, the portion of each element


30


extending beyond edge


38


is compressed. This compression creates normal forces that press the conductive portions


34


against the conductive traces on the mounting substrate and the surfaces


36




a


of the notches. As a result, a secure electrical connection is made between signal traces


16


and corresponding circuit traces on the mounting substrate.




The compressible members


30


can also comprise metallic elements, for example, elastically deformable spring contacts or non-elastically deformable metal contacts. Further, the compressible members


30


can comprise individual conductive elements, each one being associated with one of the notches


36


. For example, the member


30


may comprise an elastically deformable, conductive spherical element or a heat deformable element, such as a solder ball (described below).




A locating hole


40


may be placed in the substrate


12


. The locating hole


40


preferably comprises a plated through-hole for establishing electrical connection with a metallic shield layer


37


(see

FIG. 4



a


) extending across the back surface of the substrate


12


. As also previously described, small vias (not shown) forming plated through-holes may be disposed in each of the ground tracks


18


so that the ground tracks


18


, the shield layer


24


and the back shield layer


37


form a shielding structure for the signal traces


16


and associated terminals.




As shown in

FIG. 1

, contact terminals


20


are formed as a one-piece stamping and can comprise a dual beam contact defining an insertion axis for a mating terminal, such as a pin from a pin header.




A terminal module


10


is formed by associating a PCB assembly


12


with a cover


14


. The cover


14


and PCB


12


are configured and joined substantially in the same manner as described in the above-referenced PCT patent application. The terminals


28


are located in the contact recesses


42


in covers


14


. If the board mounting terminal


28


is of a type that is likely to have a relatively high axial insertion force applied to it as the terminal is pushed into a through hole on the mounting substrate, such as a press-fit terminal, the surface


42




a


(

FIG. 1

) of the recess


42


is advantageously located so that it bears against the upturned tang


28




a


of the terminal


28


. As previously noted in the above-identified PCT application, this arrangement allows the insertion force applied to the connector to be transmitted to terminal


28


through cover


14


in a manner that minimizes shear stress on the connection between terminal


28


and PCB


12


.





FIG. 2

shows a rear view of a connector comprising a molded plastic housing


70


and a plurality of PCB modules


10


in side-by-side relationship. In the connector shown in

FIG. 2

, the circuit boards


12


are located in back to back relationship, so that corresponding signal pairs (the location of which is shown schematically by small squares


11


) can be arranged in twinax pairs. However, other shielded or non-shielded signal contact arrangements can be used. The PCB modules


10


are secured in housing


70


, preferably by upper and lower dove tail ribs


66


and


64


, respectively, formed in each of the covers


14


. The ribs


66


and


64


are received in upper and lower dove tail grooves


68


and


65


, respectively, formed on the inner top and bottom surfaces of housing


70


. As illustrated in

FIG. 2

, each circuit board includes a press fit terminal


28


. The region of the bottom side of the connector at which the surface contact members


30


are located in flanked at one end by the retention pegs


73


and at the other by the press fit terminals


28


, to ensure adequate compressive force for urging the members


30


against contact pads (not shown) on the mounting substrate.





FIG. 4

is an fragmentary isometric view of a rear bottom corner of PCB


12


before terminals or conductive elements are associated with notches


36


. It shows signal traces


16


that terminate at an edge of the board


12


. Recesses


36


are formed at the edge of the PCB


12


and the surfaces


36




a


of the recesses are plated, so that there is electrical continuity between traces


16


and recesses


36


. Referring to

FIG. 4



a


, if the PCB carries a shield layer


37


on the side opposite the side on which signal traces


16


and shield traces


18


are printed, the shield layer is spaced from recesses


36


, for example, by the unplated regions


39


.





FIG. 5

shows a partial cross-sectional view of a connector having a convertible form of hold-down terminal


50


.

FIGS. 5 and 6

show the terminal


50


positioned for press fitting into a mounting substrate and

FIG. 5



a


shows how the terminal is positioned for surfacing mounting by being bent 90°. The terminals


50


, shown in greater detail in

FIGS. 7 and 8

, have a mounting section


52


and compliant through-hole sections


54


. The mounting section


52


includes a base


55


and a solder tab


56


disposed in substantially a right angle relationship with base


55


. The mounting section


52


is joined to the compliant sections


54


by a reduced width neck section


53


. The compliant section


54


comprises a pair of legs


58


that are movable inwardly when forces in the compliance direction of arrows F are imparted to legs


58


as it is inserted in a through-hole. As is known, elastic deformation of legs


58


creates a normal force that in turn creates a frictional force that opposes movement in the direction of the longitudinal axis of terminal


50


for retaining the terminal in a through-hole.




Each terminal


50


is mounted on an associated PCB by solder tab


56


. Such mounting positions the planes of base


55


and compliant section


54


substantially transverse to the plane of the PCB. If the angle between base


52


and solder tab


56


is 90°, then the planes of base


52


and compliant section


54


will be substantially normal to the plane of PCB


12


. An advantage of this positioning is that the terminal can readily be converted to a surface mount terminal by bending the section


54


with respect to the base section


52


in the region of neck


53


as shown in

FIG. 5



a


. As a result, the section


54


can be bent 90° to be positioned substantially parallel to the surface of the circuit board to which the connector is mounted. This places the compliant section


54


in an orientation to be surface mounted on the connector-receiving circuit board. A strong solder attachment can be made because the solder menicus can extend along and through the opening


57


.




Another advantage of the terminal


50


is that it can be used as normal press fit terminals by soldering the base


55


onto the PCB


12


, to position the compliant section


54


in the same orientation as terminal


28


shown in

FIGS. 1 and 2

. In this orientation the tab


56


functions in the same manner as tab


28




a


(

FIG. 1

) to take the axial force applied to the terminals during board insertion.




In the foregoing description, the mounting interface terminals


22


have been described principally as elements that are deformable upon the application of force. The terminals


22


(

FIG. 1

) can also comprise elements that are deformable upon the application of heat. In this regard,

FIG. 9

illustrates an embodiment wherein the conductive recesses or notches


36


in edge


38


of PCB


12


receive a heat deformable element


60


.




The element


60


as shown is a generally cylinderical body of solder. Alternatively, the body


60


may be other shapes, for example, a spherical solder ball. The element


60


can be retained in recess


36


by a snap or friction fit, by solder paste, or by fusing the element


60


into notch


36


, as by a reflow operation. An advantage of this embodiment is that connectors using this form of terminal at the mounting interface can be mounted without the need for a hold down arrangement that must maintain compressive forces, as in the previously described embodiment.




The term “surface mount” when used in the specification and claims with respect to the board mounting terminals or contacts


22


is meant to connect the absence of a through-hole type of connection and is not meant to refer solely to interconnections using solder or solder paste.




The foregoing constructions yield connectors with excellent high speed characteristics at low manufacturing costs. Although the preferred embodiment is illustrated in the context of a right angle connector, the invention is not so limited and the techniques disclosed in this application can be utilized for many types of high density connectors systems wherein signal contact are arranged in rows and columns.




While the present invention has been described in connection with the preferred embodiments of the various figures, it is to be understood that other similar embodiments may be used or modifications and additions may be made to the described embodiment for performing the same function of the present invention without deviating therefrom. Therefore, the present invention should not be limited to any single embodiment, but rather construed in breadth and scope in accordance with the recitation of the appended claims.



Claims
  • 1. A connector surface mountable to a substrate, and comprising:a housing having an opening, a mating interface for interacting with a mating connector and a mounting interface positionable adjacent the substrate; and a plurality of modules arranged in a series of adjacent columns generally transverse to the substrate, each module comprising: a printed circuit substrate at least partially located in said opening and having a first region located adjacent said mating interface of said housing, a second region locatable adjacent the substrate, and a conductor extending between said said first and second regions; a contact secured to said conductor at said first region for engaging a contact of the mating connector; and a surface mount contact secured to said conductor at said second region for mounting the connector to the substrate.
  • 2. The connector as recited in claim 1, wherein the connector is a right angle receptacle.
  • 3. The connector as recited in claim 1, wherein said housing includes an opening in which said modules at least partially reside.
  • 4. The connector as recited in claim 1, wherein adjacent ones of said modules abut each other.
  • 5. The connector as recited in claim 1, wherein said surface mount contact extends between adjacent modules.
  • 6. The connector as recited in claim 5, wherein said surface mount contact is disposed along aligned edges of said modules.
  • 7. The connector as recited in claim 1, wherein said surface mount contact is compressible.
  • 8. The connector as recited in claim 7, wherein said compressible contact is elastomeric.
  • 9. The connector as recited in claim 8, wherein said elastomeric contact resides in a recess.
  • 10. The connector as recited in claim 1, wherein said surface mount contact is deformable.
  • 11. The connector as recited in claim 10, wherein said deformable contact is heat deformable.
  • 12. The connector as recited in claim 11, wherein said heat deformable contact is a body of solder.
  • 13. The connector as recited in claim 12, wherein said body of solder is a solder ball.
  • 14. The connector as recited in claim 10, wherein said deformable contact is a spherical element.
  • 15. The connector as recited in claim 1, wherein said circuit substrate is a printed circuit board and said conductor is a trace on said printed circuit board.
  • 16. The connector as recited in claim 1, wherein the connector engages the mating connector along a mating axis, said modules generally aligned with said mating axis.
  • 17. The connector as recited in claim 1, in combination with a substrate to which the connector is adapted to surface mount.
  • 18. A connector, surface mountable to a substrate, and comprising:a plurality of modules arranged adjacently and generally transverse to the substrate, each module comprising: a printed circuit substrate having a first region, a second region locatable adjacent the substrate, and a conductor extending between said said first and second regions; a contact secured to said conductor at said first region for engaging a contact of the mating connector; and a surface mount contact secured to said conductor at said second region for mounting the connector to the substrate; and a housing having an opening to receive and to closely fit about at least said first region of each said circuit substrate and to retain said plurality of modules in position.
  • 19. The connector as recited in claim 18, wherein adjacent ones of said modules abut each other.
  • 20. A surface mountable receptacle connector, comprising:a housing, having a front face with apertures therein for receiving contacts from a mating connector and an opening in communication with said apertures, said apertures arranged in an array of rows and columns; and a plurality of modules arranged generally transverse to the substrate, each module comprising: a circuit substrate at least partially located in said opening and having a first region located adjacent said front face of said housing, a second region locatable adjacent the substrate, and a conductor extending between said first and second regions and along an outer surface of said circuit substrate; a contact secured to said conductor at said first region and associated with a respective aperture in said front face of said housing; and a surface mount contact secured to said conductor at said second region for mounting the connector to the substrate; wherein each circuit substrate aligns with a column of said apertures in said front face of said housing.
  • 21. A connector, surface mountable to a substrate, and comprising:a housing having a mating interface for interacting with a mating connector and a mounting interface positionable adjacent the substrate; and a plurality of modules arranged in a series of adjacent columns generally transverse to the substrate, each module comprising: a circuit substrate having a first region located adjacent said mating interface of said housing, a second region locatable adjacent the substrate, and a conductor extending between said first and second regions; a contact secured to said conductor at said first region for engaging a contact of the mating connector; and a surface mount contact secured to said conductor at said second region for mounting the connector to the substrate; wherein said surface mount contact extends between adjacent modules.
  • 22. The connector as recited in claim 21, wherein said surface mount contact is disposed along aligned edges of said modules.
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