This application claims the benefit of Japanese Patent Application No. 2007-178605 filed Jul. 6, 2007, which corresponds to U.S. Provisional Patent Application No. 60/950,623 filed Jul. 19, 2007, and Japanese Patent Application No. 2008-080792 filed Mar. 26, 2008, the disclosures of which are incorporated herein by reference.
This invention belongs to a technical field of a surface mount contact member to be mounted on a surface of a printed circuit board in order to achieve conduction between the printed circuit board and, for example, a housing.
In order to achieve conduction between a printed circuit board and, for example, a housing, a surface mount contact member to be mounted on a surface of the printed circuit board includes a coil spring connector provided with two coil springs and an insulating holder that holds the two coil springs apart, as disclosed in Unexamined Japanese Patent Publication No. 2002-170617. A flat surface formed on the holder between the two coil springs is used as a nozzle suction surface to be sucked by a suction nozzle.
In the case of the above coil spring connector, the flat surface between the two coil springs can be sucked by the suction nozzle for automatic mounting. However, since the coil spring connector is constituted of two (or more) coil springs and the insulating holder, a constitution with only a single coil spring, that is, reduction in number of components, has been desired.
A surface mount contact member in a first aspect of the present invention includes: a metal base provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered and is faced downward when the nozzle suction surface is faced upward; and a conductive coil spring attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
The surface mount contact member of the first aspect is mounted on a surface of the printed circuit board with its soldering surface soldered on the printed circuit board. Soldering is not limited only to the soldering surface. For example, not only the soldering surface but the side surface and so on of the metal base may be soldered.
The metal base is provided with the nozzle suction surface to be sucked by the suction nozzle, other than the soldering surface. The soldering surface is faced downward when the nozzle suction surface is faced upward. The coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to the inner peripheral side of the coil spring. Therefore, automatic mounting of the contact member is achieved by inserting the suction nozzle through the interior of the coil spring and sucking the nozzle suction surface by the suction nozzle.
The conductive coil spring, which is attached to the metal base in an electrically conductive manner, functions as a contact point, and is brought into pressurized contact with a different conducting body (for example, a housing or other printed circuit board) from the printed circuit board having the surface mount contact member soldered thereon.
Since the contact point is made of a coil spring, no plastic deformation but mere elastic deformation occurs even if the contact point is touched by a worker or other members. Also, the contact point made of a coil spring is unlikely to be damaged due to loss of spring elasticity even if repetitively used multiple times.
In a second aspect of the present invention, the nozzle suction surface is a top surface of a protrusion provided to stand on a base portion of the metal base. The coil spring is fitted over the protrusion. The soldering surface is provided on a leg portion extending from the base portion in a direction opposite to the protrusion.
The nozzle suction surface is the top surface of the protrusion provided to stand on the base portion. The coil spring is fitted over the protrusion. Therefore, for example, since no labor such as welding is required, operation to attach the coil spring to the metal base is easy.
In a third aspect of the present invention, the coil spring has an opening only sufficient for the suction nozzle to pass through. Accordingly, the surface mount contact member of the third aspect is suitable to be sucked by the suction nozzle.
In a fourth aspect of the present invention, the coil spring is fitted over the protrusion provided on the metal base, and a reverse section is provided at an upper end of the protrusion in order to inhibit the coil spring from coming off. Accordingly, the surface mount contact member of the fourth aspect can reliably inhibit drop off of the coil spring.
The invention will now be described below, by way of example, with reference to the accompanying drawings, in which:
Referring to
The metal base 2 is provided with a rectangular base portion 4. A protrusion 5 is provided to stand in a center part of the base portion 4. The protrusion 5 has a cylindrical shape, whose top surface 6 is parallel to the surface of the base portion 4. The top surface 6 is used as a nozzle suction surface.
Leg portions 7 extend from two mutually parallel sides of the base portion 4. The leg portions 7 are formed by bending the base portion 4 at a right angle so as to extend in a direction opposite to a protruding direction of the protrusion 5. The leg portions 7 are further bent at their ends at a right angle. The undersurfaces of the bent ends, which are parallel to the surface of the base portion 4, are used as soldering surfaces 8. That is, the top surface 6 and the soldering surfaces 8 are disposed such that the base portion 4 is located between the top surface 6 and the soldering surfaces 8. The base portion 4 (the surface), the top surface 6, and the soldering surfaces 8 are parallel to one another. As seen from
The coil spring 3 is fitted over the protrusion 5 to an extent of 2-3 turns from a lower end 9 of the coil spring 3. That is, the inner diameter of the coil spring 3 is substantially constant to the extent of 2-3 turns from the lower end 9. From the vicinity where the turns of the coil spring 3 are no longer fitted over the protrusion 5 toward an upper end 10 of the coil spring 3, the coil spring 3 has a horn (truncated cone) spiral shape flaring out at the side of the upper end 10.
The above exemplified wire is formed into the coil spring 3 as shown in
The emboss packaged surface mount contact member 1 is provided to an automatic mounting apparatus. As seen in
The surface mount contact member 1 is taken out of the recess formed by embossment by nozzle suction, automatically mounted on a printed circuit board, and then soldered onto the printed circuit board at the soldering surfaces 8 by reflow soldering for surface mounting.
The base portion 4 has a rectangular shape. The coil spring 3 is fitted over the protrusion 5 provided to stand in the center of the base portion 4. A pair of leg portions 7 extend from two mutually parallel sides of the base portion 4. Thus, a suction point (the top surface 6 of the protrusion 5) by the suction nozzle 11 is extremely close to (not far off) the center of gravity of the surface mount contact member 1. Accordingly, the weight balance of the surface mount contact member 1 is favorable upon nozzle suction. The surface mount contact member 1 does not tilt. Therefore, the position of the surface mount contact member 1 mounted on the printed circuit board is accurate.
The coil spring 3 attached to the metal base 2 functions as a contact point and is brought into pressurized contact with a different conducting body (for example, a housing or other printed circuit board) from the printed circuit board having the surface mount contact member 1 soldered thereon. At that time, pressurized contact between the coil spring 3 and the housing or the like is maintained by compression of the coil spring 3.
Since the contact point of the surface mount contact member 1 is made of the coil spring 3, no plastic deformation but mere elastic deformation occurs even if the contact point is touched by a worker or other members. Also, the contact point as the coil spring 3 is unlikely to be damaged due to loss of spring elasticity upon multiple repetition of use.
Referring to
Since the surface mount contact member 1a is provided with the reverse sections 12, there is no fear of dropping off of the coil spring 3 from the protrusion 5. The same effects as in the first embodiment can be also achieved.
Referring to
In the surface mount contact member 1b, since the latch portion 13 provided at the tip of the coil spring 3 is caught at the end section of the base portion 4, relative rotation between the coil spring 3 and the metal base 2 can be inhibited. The same effects as in the first embodiment can be also achieved.
Referring to
In the surface mount contact member 1c, since there is no variation in diameter of turns of the coil spring 3 (diameter of each turn is constant), forming of the coil spring 3 is simplified. Costs for forming can be reduced. The same effects as in the first embodiment can be also achieved.
Referring to
In the surface mount contact member 1d, since the diameters of upper-half turns of the coil spring 3 are gradually reduced toward the side of the upper end 15 so that the coil spring 3 has a shape of a cannonball, application of large force can be avoided even if a worker or the like touches the upper half of the coil spring 3. The same effects as in the first embodiment can be also achieved.
The present invention should not be limited by the above described embodiments. It should be noted that the present invention can be practiced in various manners without departing from the scope of the present invention.
Number | Date | Country | Kind |
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2007-178605 | Jul 2007 | JP | national |
2008-080792 | Mar 2008 | JP | national |
Number | Name | Date | Kind |
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5189638 | Kimura | Feb 1993 | A |
5671123 | Omori et al. | Sep 1997 | A |
6533097 | Sakamoto et al. | Mar 2003 | B1 |
20040127106 | Sekiguchi | Jul 2004 | A1 |
20050023119 | Lu | Feb 2005 | A1 |
Number | Date | Country |
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1 026 787 | Aug 2000 | EP |
2 392 322 | Jul 2005 | GB |
2002 170617 | Jun 2002 | JP |
Number | Date | Country | |
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20090011662 A1 | Jan 2009 | US |
Number | Date | Country | |
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60950623 | Jul 2007 | US |