FIELD OF THE INVENTION
The invention relates to an electrical connector for surface mounting to a printed circuit board in multiple configurations.
BACKGROUND OF THE INVENTION
Multiple different configurations of circuit boards exist in electronic packaging, along with the corresponding electrical connection technology. Some circuit boards provide for an insulated carrier having traces along one or more of the surfaces, for example top or bottom, and electrical connectors may be mounted thereto in electrical connection with these traces. Many different component mounting methods exist, for example through-hole connection or surface mount connection.
Other types of printed boards exist which carry power through the board or provide a thermally dissipative path through the board. In one example, aluminum cladding is provided with an insulative overlay, and then circuit traces are provided on the insulative overlay, for example, through an additive or subtractive plating process. In such an architecture, components are typically surface mounted to the conductive traces top of the board. In the case of a connector header, the mating pins normally extend from the top of the board. It would be advantageous to allow for surface mount header placement yet project the header pins through the board and through the aluminum cladding to allow a connector to mate on the underside of the board. Further, a single header could be dual-configured to allow placement as a conventional header on top of the board or placed such that the pins project downwardly through the board.
SUMMARY
The objects of the invention have been accomplished by providing an electrical connector having alternative mounting arrangements, comprising an electrical connector housing, having a housing body portion. A plurality of electrical contacts, comprised of pins and electrical connection devices are adapted for mating engagement with a plurality of electrical circuit board traces. The electrical connection devices are connectable to a circuit board in any one of a plurality of configurations, where the plurality of configurations include a first configuration where the electrical connection devices are surface mounted to a first surface of a circuit board with the pins projecting away from the board; and a second configuration wherein said electrical connection devices are surface mounted to first surface of the circuit board, and said pins project through the circuit board.
In another embodiment, an electrical connector comprises an electrical connector housing having a housing body portion, and at least one electrical contact, comprised of a pin and an electrical connection device adapted for surface mount engagement with at least one electrical circuit board trace. An insulative sleeve surrounds the pin, whereby the electrical connection device is adapted for surface mounting to a surface of a circuit board, and with the pins projecting through a through opening of the circuit board, and with the insulative sleeve at least partly positioned in the through opening in the board.
In yet another embodiment, an electrical connector comprises an electrical connector housing body portion and at least one electrical contact, comprised of a pin and an electrical connection device adapted for surface mount engagement with at least one electrical circuit board trace, the electrical connection device is comprised of first and second contact surfaces, the first contact surface being positioned in a plane spaced from the second contact surface.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will now be described by way of reference to the drawings, where:
FIG. 1 is a front perspective view of the surface mount header;
FIG. 2 shows an end view of the surface mount header of FIG. 1;
FIG. 3 shows a side view of the surface mount header of FIG. 1;
FIG. 4 shows the surface mount header of FIG. 1 mounted to a top surface of a printed circuit board;
FIG. 5 shows a side view of the surface mount header mounted to a top surface of a printed circuit board;
FIG. 6 shows an end view of the surface mount header mounted to a top surface of a printed circuit board;
FIG. 7 shows a top perspective view showing the surface mount header of FIG. 1 mounted to a top surface of a printed circuit board with pins protruding through the bottom;
FIG. 8 shows an end view of the embodiment of FIG. 7; and
FIG. 9 shows a side view of the embodiment of FIG. 7.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
With reference first to FIG. 1, an electrical connector is shown in the form of a surface mount header at 2 which includes a housing 4 comprised of a housing body portion 6 and insulative sleeves 8. Surface mount header 2 further includes electrical contacts 10 having electrical connection devices 12 integral to pins 14. With reference now to FIG. 2, contacts 10 will be described in greater detail.
Contact 10 is shown as a T-shaped member where pins 14 upstand from a transverse portion 18 with a contact member 20 positioned on one side of transverse portion 18 and a contact member 22 positioned on the opposite side of transverse portion 18. Contact member 20 includes a contact surface 24 and an oppositely directed contact surface 26. In a like manner, contact 22 includes a contact surface 28 and an oppositely directed contact surface 30. Contacts 10 could be comprised of any typical conductive material such as brass, a copper alloy, bronze, phosphor bronze, beryllium copper, gold plated contacts, and the like.
With reference still to FIG. 2, housing body portion 6 is shown overmolded over transverse portion 18 to retain contacts 10 to housing 4. It should be appreciated that apertures (not shown) could be positioned in transverse portion 18 to receive over-mold material from housing 4 to better retain contacts 10 to housing 4. Alternatively, housing body portion 6 could totally encapsulate transverse portion 18 to increase the retention of contacts 10 to housing 4. Housing body could also be formed of an insulative member with the contacts press fit in place.
With reference still to FIG. 2, housing body portion 6 has a lower surface 34 and an oppositely facing upper surface 36. As shown, surfaces 34 and 36 are the extreme surfaces of the housing body portion. Contact surfaces 28, 30 have a distance between them which is greater than the distance between the surfaces 34, 36. As shown in FIG. 2, the distance between surfaces 34, 36 of housing body portion 6 is shown as “a”; the distance between contact surfaces 28, 30 is shown as “b”; the difference between contact surface 30 and surface 36 of housing body portion 6 is shown as “c”; and the difference between contact surface 28 and surface 34 of housing body portion 6 is shown as “d”.
Finally, with respect to FIG. 3, insulative sleeves 8 are shown which include a cylindrical portion 40 and a frusto-conical portion 42. While the preferred embodiment of the surface mount header 2 has insulative sleeves 8 integrally molded to the housing body portion 6, other versions could have sleeves which are independent from housing body portion 6. It should also be appreciated that the housing 4 and/or sleeves could be comprised of any non-conductive material such as a phenolic, ceramic, or thermoplastic. However a moldable plastic material that is suitable to withstand the reflow soldering process would normally be utilized.
With reference now to FIG. 4, surface mount header 2 is shown electrically connected to a printed circuit board 50 in a first configuration. Circuit board 50 is comprised of printed circuit traces 52 having a pad portion 54 and a trace portion 56, all of which is positioned on an insulative carrier material 58 such as a plastic or phenolic material. As shown in FIGS. 5 and 6, contact surfaces 24, 28 are shown connected to electrical circuit traces 52. Due to the configuration mentioned above, the transverse portion 18 and the surface 34 of housing body portion 6 are spaced away from the surface of the printed circuit board. That is, as the surface 34 of the housing body portion 6 is spaced a distance d from the contact surfaces 24, 28, neither the housing body portion 6 nor the transverse portion 18 will interfere with the board 50, nor with a reflow soldering process.
With reference now to FIG. 7, surface mount header 2 could alternatively be configured as connected to a printed circuit board 50′ where printed circuit board 50′ is substantially similar to that shown as printed circuit board 50, however, printed circuit board 50′ includes an aluminum cladding shown at 60 for thermal dissipation of heat through the board. Circuit board 50′ would include electrical circuit traces 52′ substantially as shown at 52 in FIG. 4. In this embodiment, printed circuit board 50′ would include openings 62 through the board 50′ and through the aluminum cladding 60 and surface mount header 2 would project through the board and insulative sleeves 8 would insulate contacts 10 and more particularly pins 14 from the aluminum clad layer 60. It should be appreciated that frusto-conical portion 42 (FIG. 3) will help position the sleeves within openings 62 and that the sleeves 40 (FIG. 3) will be designed for slight interference fit with the openings 62.
Thus the surface mount header 2 could be position as shown in FIG. 7, and retained to printed circuit board 50′ prior to and during the surface mount soldering process by way of the interference fit between the sleeves 8 and the openings 62. Due to the configuration mentioned above, the surface 36 of housing body portion 6 is spaced away from the surface of the printed circuit board. That is, as the surface 36 of the housing body portion 6 is spaced a distance c from the contact surfaces 26, 30, the housing body portion 6 will not interfere with the board 50, nor with a reflow soldering process.
It should also be appreciated that the Figures herein show the surface mount header 2 in certain configurations, that oppositely directed configurations are entirely anticipated herein. More specifically, FIG. 4 shows surface mount header 2 standing upwardly, but it is also anticipated that surface mount header may also project away from board 50, but in an inverted fashion. Likewise, FIG. 7 shows surface mount header attached to a upper surface of board 50, and the pins 14 extending downwardly through opening 62. However, it is entirely anticipated that this configuration may too be inverted, such that surface mount header is attached to what is then the top surface, and where pins 14 project downwardly through opening 62. Thus any reference to top, bottom, upper or lower herein, and the like, is only for the purpose of relative description and should not be interpreted to limit the claims.
It should also be appreciated that multiple connections of different configurations could be made on the same board. For example, multiple connections such as that shown in 4, and multiple connections, such as that shown in FIG. 7, can be mounted to the same board. Further, as the pins 14 herein are shown as straight, it should be appreciated that right angle versions of pins are also usable, where the pins are insertable into apertures 62, and the entire header is rotated into position, such that the ending configuration of the pin ends, would be parallel to the plane of the board.
Patent Application
20080311767
