This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2014-258141, filed on Dec. 20, 2014, the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a surface-mount inductor and a method for manufacturing the same.
2. Description of the Related Art
As shown in JP2010-245473 (patent document 1), an inductor having a coil embedded in magnetic resin, which is a mixture of magnetic powder and resin, has been widely used. A molded coil which is embedded in magnetic resin is configured as a surface-mount inductor which is built by forming electrodes for mounting on a printed wiring board. The electrodes being made by painting an electric conductive paste which is made by dispersing metal particles such as Ag in thermosetting resin such as epoxy resin, or adhering metal terminals to the molded coil.
As the electric conductive paste is expensive, it is costly to apply it over a large area. Thus, metal plates are widely used instead as external terminals of large-size surface-mount inductors. Methods for manufacturing such surface-mount inductors are disclosed in JP2010-087240 (patent document 2) and JP2011-054713 (patent document 3), for example.
The patent document 2 discloses a method for manufacturing a surface-mount inductor in which a molded coil is formed by embedding a coil in magnetic resin with exposed lead ends brought out therefrom, preliminarily folding metal terminals in a predetermined shape, attaching the metal terminals to the molded coil, and electrically connecting the lead ends and the metal terminals by soldering or welding.
The patent document 3 discloses another method for manufacturing a surface-mount inductor in which lead ends and metal terminals are connected by soldering or welding, the lead ends and a part of a metal plate including the connecting portion thereof are embedded in magnetic resin to form a molded coil, the metal plate exposed from the molded coil being folded along the outermost turn of the molded coil to form metal terminals.
The method for manufacturing the surface-mount inductor in the patent document 2 has some issues. One of them is the large size of the surface-mount inductor due to the metal terminals being mounted after the completion of the coil. The size of the inductor varies with the thickness of the metal terminals. Another issue is the terminals falling off due to the adherence of the adhesive being deteriorated when soldering the metal terminals onto the molded coil.
Further, the method for manufacturing the surface-mount inductor in the patent document 3 has a problem in that the portion connecting the metal terminals and the lead ends is embedded in the molded coil so that it is not possible to visually confirm the connecting state.
A surface-mount inductor according to the present invention is characterized by a surface-mount inductor including: a coil formed by winding insulated wire and bringing out lead ends therefrom; and a premolded body formed by thermopressing into a form a mixture of magnetic powder and thermosetting resin to accommodate the coil whose lead ends are brought out therefrom; comprising
a pair of metal terminals made of deformable plates, and arranged on the outer exposed surface of the premolded body; and
a coil the lead ends of which are embedded at the outer exposed surface.
A method for manufacturing a surface-mount inductor according to the present invention is characterized by the steps of:
mixing magnetic powder and thermosetting resin so as to produce a combination-type premolded body of predetermined shape; and
preparing a coil formed by winding an insulated wire, accommodating the coil in the combination-type premolded body with the lead ends of the coil brought out therefrom, arranging the metal terminals on the outer surface of the premolded body, arranging the lead ends on the outer surface of the metal terminals, and thermopressing the premolded body into form.
According to the surface-mount inductor of the present invention, a surface-mount inductor may be manufactured without using any adhesive, thus metal terminals do not fall off since the metal terminals are partially embedded in the resin. And, the portion connecting the metal terminals and the lead ends is exposed on the surface of the surface-mount inductor so that the connecting state may be visually confirmed.
The surface-mount inductor according to the present invention is described below, referring to
The surface-mount inductor 10 includes: premolded bodies 20, 30 formed by pressure forming magnetic resin, which is a mixture of magnetic powder and thermosetting resin such as epoxy resin; coil 40 formed by winding an insulated wire; and a pair of metal terminals 50a, 50b formed by punching a thin metal plate and by folding in a predetermined shape which are connected with both of the lead ends 41a, 41b, respectively.
The premolded body 20 has a rectangular parallelepipedic profile, a cylindrical pot-like space inside, and a protruded portion 21 provided at the center of the bottom surface inside the space. The premolded body 20 has an E-shaped longitudinal section, and the outer wall thereof is partially cut out at the corners to make open portions 22a, 22b.
The premolded body 30 fitted with the premolded body 20 is substantially rectangular in plan view and the corners 31a, 31b are chamfered.
The coil 40 is wound to be cylindrical in shape, and the lead ends are brought out from the outermost turn in radial directions outwardly and folded about 90° in the direction of the center axis of the coil 40.
As shown in
The method for manufacturing the surface-mount inductor according to the present invention is described referring sequentially to
Processing the formed surface-mount inductor 10B by dip soldering, the insulation layer of the lead ends 41a, 41b are removed and at the same time the lead ends 41a, 41b and the metal terminals 50a, 50b are electrically connected to form the surface-mount inductor 10 as a formed article. Here, dip soldering may be replaced by thermocompression bonding.
As shown in
As shown in
As shown in
Since the metal terminals 50a, 50b are preferably thin so that the lead ends 41a, 41b are easily embedded therein, the material of the metal terminals 50a, 50b is preferably soft so as to easily deform when the lead ends 41a, 41b embed therein, tough pitch copper being preferable to phosphor bronze thus the use of relatively soft normalized hardness of less than ½ H, for example, thin metal terminals 50a, 50b is ideal.
As shown in
The surface-mount inductor described above enables preventing the falling off of the metal terminals because the metal terminals are partially embedded in the mold coil, and the state of the connection may be visually recognized.
Further, the metal terminals do not increase the size of the surface-mount inductor because the lead ends sink in the metal terminals and in turn the metal terminals sink in the mold coil.
Furthermore, since the base portions of the lead ends are also embedded in resin, the position shift caused by the spring back before electrically connecting the lead ends to the metal terminals, and the loss of connection between the lead ends and the metal terminals when melting solder to solder on the mounting board, is minimized.
In the process of forming the premolded body, resin from the magnetic resin permeates the premolded body and covers a part of the bottom surface thus obstructing the mounting of the surface-mount inductor. In such a case, the premolded body should be processed by means of barrel polishing and the like to remove the permeating resin.
In addition, the portion embedding the metal terminals may be selected to have, for example, a wide-top shape or a hollow structure in order to provide a surface-mount inductor with metal terminals which do not easily fall off therefrom.
Number | Date | Country | Kind |
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2014-258141 | Dec 2014 | JP | national |
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Entry |
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JP2005310812A, Nov. 2005, Machine Translation. |
JP2005310812, Nov. 2005, Machine Translation. |
Japanese Decision of Rejection with English Translation (Application No. JP 2014-258141) (4 pages—dated Jan. 10, 2017). |
Number | Date | Country | |
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20160181014 A1 | Jun 2016 | US |