TREA

Surface mount package

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Information

  • Patent Grant
  • D462062
  • Patent Number
    D462,062
  • Date Filed
    Friday, May 18, 2001
    23 years ago
  • Date Issued
    Tuesday, August 27, 2002
    22 years ago
Information
Abstract
Description




FIG. 1 is a perspective view of a surface mount package showing our new design;




FIG. 2 is a top plan view thereof;




FIG. 3 is a bottom plan view thereof:




FIG. 4 is a front elevational view thereof:




FIG. 5 is a rear elevational view thereof;




FIG. 6 is a left side elevational view thereof; and,




FIG. 7 the right side elevational view thereof.




The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.



Claims
  • The ornamental design for a surface mount package, as shown and described.
US Referenced Citations (4)
Number Name Date Kind
5224021 Takada et al. Jun 1993 A
5446623 Kanetake Aug 1995 A
5521429 Aono et al. May 1996 A
5689135 Ball Nov 1997 A
Non-Patent Literature Citations (3)
Entry
JEDEC Solid State Product Outlines, “Small Outline J-Lead” (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF.
JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
JEDEC Solid State Product Outlines, “Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width”, Issue B, May, 1992, MO-121, pp. 1-2.