Surface mount package

Information

  • Patent Grant
  • D467231
  • Patent Number
    D467,231
  • Date Filed
    Tuesday, July 17, 2001
    23 years ago
  • Date Issued
    Tuesday, December 17, 2002
    22 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D14 114
    • 257 621
    • 257 666
    • 257 669
    • 257 672
    • 257 673
    • 257 674
    • 257 676
    • 257 684
    • 257 690
    • 257 692
    • 257 696
    • 257 710
    • 257 711
    • 257 730
    • 257 731
    • 361 718
    • 361 742
    • 361 760
    • 361 774
    • 361 820
  • International Classifications
    • 1303
    • Term of Grant
      14Years
      Disclaimer
      Terminal disclaimer
Abstract
Description




FIG. 1 is a perspective view of a surface mount package showing my new design;




FIG. 2 is a top plan view thereof;




FIG. 3 is a bottom plan view thereof;




FIG. 4 is a front elevational view thereof;




FIG. 5 is a rear elevational view thereof;




FIG. 6 is a left side elevational view thereof; and,




FIG. 7 the right side elevational view thereof.




The broken line showing of the environment is for illustrative purpose only and forms not part of the claimed design.



Claims
  • The ornamental design for a surface mount package, as shown and described.
US Referenced Citations (4)
Number Name Date Kind
4984062 Uemira et al. Jan 1991 A
5224021 Takada et al. Jun 1993 A
5446623 Kanetake Aug 1995 A
6211462 Carter, Jr. et al. Apr 2001 B1
Non-Patent Literature Citations (3)
Entry
JEDEC Solid State Product Outlines, “Small Outline J-Lead” (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun. 1988, MO-088, AA-AF.
JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun. 1999, MO-199, pp. 1-5.
JEDEC Solid State Product Outlines, “Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width”, Issue B, May, 1992, MO-121, pp. 1-2.