SURFACE MOUNT TYPE CRYSTAL OSCILLATOR

Abstract

A surface mount type crystal oscillator is provided with: a container body having a bottom plate layer and a frame wall layer which has an opening, the frame wall layer being laminated on the bottom plate layer wherein a recess of the container body is formed by the opening; a crystal blank housed inside the recess; and an IC chip in which an oscillation circuit that uses the crystal blank is integrated. The IC chip has IC terminals used for external connections on one principal surface of the IC chip and is secured to the bottom plate layer. The IC chip is secured to the bottom plate layer by way of an anisotropic conductive material such that the one principal surface of the IC chip confronts the bottom plate layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing the configuration of a surface mount type crystal oscillator of the single-chamber construction of the prior art;

FIG. 2 is a plan view showing an IC chip;

FIG. 3 is a plan view showing a crystal blank;

FIG. 4 is a sectional view showing the configuration of a surface mount type crystal oscillator of the H-shaped construction of the prior art;

FIGS. 5A and 5B are a sectional view and a bottom plan view, respectively, showing the configuration of a surface mount type crystal oscillator according to an embodiment of the present invention;

FIG. 5C is an enlarged view of the dotted-line box labeled “P” in FIG. 5A;

FIG. 6A is a sectional view showing the configuration of a surface mount type crystal oscillator of the single-chamber construction according to another embodiment of the present invention; and

FIG. 6B is a sectional view showing the configuration of a surface mount type crystal oscillator of the H-shaped construction based on the present invention.

Claims

1. A surface mount type crystal oscillator comprising: a container body having a bottom plate layer and a frame wall layer which has an opening, said frame wall layer being laminated on said bottom plate layer, wherein a recess of said container body is formed by said opening;a crystal blank housed inside said recess; andan IC chip in which an oscillation circuit that uses said crystal blank is integrated, said IC chip having IC terminals used for external connections on one principal surface of said IC chip;wherein said IC chip is secured to said bottom plate layer by way of an anisotropic conductive material such that said one principal surface of said IC chip confronts said bottom plate layer.

2. The crystal oscillator according to claim 1, wherein circuit terminals are provided on said bottom plate layer corresponding to positions of said IC terminals, and said anisotropic conductive material electrically connects mutually corresponding IC terminals and circuit terminals.

3. The crystal oscillator according to claim 1, wherein: said frame wall layer is provided on only one principal surface of said bottom plate layer;said IC chip is secured to an outside bottom surface of said container body at a position that corresponds to said recess with said anisotropic conductive material being interposed;an outer periphery of said crystal blank to which extension electrodes of the crystal blank extend is secured to an inner bottom surface of said recess; andmetal balls for mounting are provided in four corners of the outside bottom surface of said container body.

4. The crystal oscillator according to claim 1, wherein: said frame wall layer is provided on only one principal surface of said bottom plate layer;said IC chip is secured to an outside bottom surface of said container body at a position that corresponds to said recess with said anisotropic conductive material interposed;an outer periphery of said crystal blank to which extension electrodes of said crystal blank extend is secured to a stepped portion formed in an inner wall of said recess; andmounting terminals are provided in four corners of an outside bottom surface of said container body.

5. The crystal oscillator according to claim 1, wherein: said bottom plate layer has a first principal surface and a second principal surface, and a pair of said frame wall layers are provided on both said first principal surface and said second principal surface, respectively;an outer periphery of said crystal blank to which extension electrodes of said crystal blank extend is secured to an inner bottom surface of a first recess which is formed on said first principal surface;said IC chip is secured to said bottom plate layer by being secured to an inner bottom surface of a second recess, which is formed on said second principal surface, with said anisotropic conductive material interposed; andmounting terminals are provided in four corners of said frame wall layer on the side of said second principal surface.

6. The crystal oscillator according to claim 1, wherein said anisotropic conductive material is an anisotropic conductive sheet or an anisotropic conductive adhesive.