Claims
- 1. A method of ablating a material comprising the steps of:applying alternating pulses of (a) laser radiation, and (b) a fracturing fluid to substantially the same region of a material to induce thermo-elastic failure and ablation of the material with each pulse; removing loose material resulting from said ablation; and repeating the above steps; wherein the fracturing fluid is applied within a delay time tdelay after a falling edge of said pulse of laser radiation, where tdelay is less than the time required for the region to cool to a temperature distribution with a gradient insufficient to promote thermal failure upon further cooling by said pulse of fracturing fluid, and is less than 1 millisecond.
- 2. The method of claim 1, wherein said tdelay is less than 100 microseconds.
- 3. The method of claim 2, wherein said tdelay is less than 10 microseconds.
- 4. A method of ablating a material, comprising the steps of:(a) applying laser radiation to a surface of said material to ablate said material through thermo-elastic failure; (b) terminating said application of laser radiation, (c) applying a fracturing fluid to said material after terminating said laser radiation to further ablate said material and to remove loose material; (d) terminating said application of fracturing fluid; and (e) repeating the above steps; wherein said step (c) of applying a fracturing fluid is commenced within a time interval tdelay which is shorter than one millisecond.
- 5. The method of claim 1, wherein said laser radiation has a wavelength between about 7 μm and about 9 μm.
- 6. The method of claim 1, wherein said steps are repeated at a rate of about 5 Hz to about 50 Hz.
- 7. The method of claim 1, wherein said fracturing fluid is not absorbent of the laser radiation and has a rapid cooling capacity and cleansing ability.
- 8. The method of claim 1, wherein said fracturing fluid is water.
- 9. The method of claim 1, wherein said fracturing fluid is a gas.
- 10. The method of claim 1, wherein said fracturing fluid contains a surfactant.
- 11. The method of claim 1, wherein said fracturing fluid is additionally applied to the device applying the laser radiation to said surface to remove contamination adhered to said device.
- 12. The method of claim 1, wherein said fracturing fluid is applied within 100 microseconds after terminating the the application of said laser radiation.
- 13. The method of claim 18, wherein said fracturing fluid is applied within 10 microseconds after terminating the application of said laser radiation.
- 14. The method of claim 1, wherein said laser radiation has a wavelength between about 2 μm and about 3 μm.
- 15. The method of claim 2, wherein said laser radiation has a wavelength of 2.94 μm.
- 16. The method of claim 3, wherein said laser radiation is applied to said material in pulses with pulse duration in the approximate range of 100 μs to 400 μs.
- 17. The method of claim 1, wherein said process of ablating said material further contains the step of reducing the amount of liquid present on a surface of said material to be ablated.
- 18. The method of claim 7, wherein said liquid reduction is effectuated before applying said laser radiation to said surface.
- 19. The method of claim 7, wherein said liquid reduction is effectuated after said fracturing fluid is applied to said material.
- 20. The method of claim 7, wherein said liquid reduction is effectuated by laser radiation.
- 21. The method of claim 7, wherein said liquid reduction is accomplished by applying a dry gas to said material surface.
- 22. The method of claim 7, wherein said liquid reduction is accomplished by applying a vacuum to said material surface.
- 23. A method of ablating a material, comprising the steps of:providing a laser radiation system comprising: a laser radiation source; a radiation director for applying said laser radiation to said material to heat said material and cause it to fracture or rupture; a fluid dispenser for applying a fracturing fluid to said material to further fracture or rupturing said material; and a controller that alternates between said laser radiation and said fracturing fluid for application to said material; applying laser radiation to a surface of said material to ablate said material through thermo-elastic failure; terminating said application of laser radiation; within one millisecond after terminating said application of laser radiation, applying a fracturing fluid to said material to further ablate said material and to remove loose material; terminating said application of fracturing fluid; and repeating the above steps.
- 24. The method of claim 23, wherein said laser radiation has a wavelength between about 2 μm and about 3 μm.
- 25. The method of claim 23, wherein said laser radiation is applied to said material in pulses with pulse duration in the approximate range of 100 μs to 400 μs.
- 26. The method of claim 23, wherein said laser radiation has a wavelength between about 7 μm and about 9 μm.
- 27. The method of claim 23, wherein said steps are repeated at a rate of about 5 Hz to about 50 Hz.
- 28. The method of claim 23, further comprising the step of reducing the amount of liquid present on a surface of said material to be ablated, prior to the application of said laser radiation.
- 29. The method of claim 23, wherein said fracturing fluid is not absorbent of the laser radiation, and has a rapid cooling capacity and cleansing ability.
- 30. The method of claim 23, wherein said fracturing fluid contains a surfactant.
- 31. The method of claim 23, wherein said fracturing fluid is additionally applied to the device applying the laser radiation to said surface to remove contamination adhered to said device.
- 32. The method of claim 23, wherein said material remains substantially stationary with respect to said fluid dispenser between the application of said laser radiation and the application of said fracturing fluid.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 08/908,323, filed Aug. 7, 1997 now abandoned, to which priority is claimed under 35 U.S.C. 120.
US Referenced Citations (16)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO9707928 |
Mar 1997 |
WO |
Non-Patent Literature Citations (2)
Entry |
Altshuler, G. et al., “Physical Aspects of Cavity Formation of Er-Laser Radiation”, 6/95, SPIE vol. 2394, p. 211-222. |
Jacques, S. et al., “Laser-Tissue Interaction V”, 1/24-27/94, SPIE vol. 2134A p. 309-317. |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08/908323 |
Aug 1997 |
US |
Child |
09/512391 |
|
US |