Claims
- 1. A method for molding a susceptor-impregnated thermoplastic foam, comprising the steps of:
a) heating the susceptor-impregnated thermoplastic foam; b) imprinting an object against the heated susceptor-impregnated thermoplastic foam; and c) allowing the susceptor-impregnated thermoplastic foam to cool into a hardened form conformed to the imprint of the object.
- 2. The method of claim 1, wherein the susceptor-impregnated thermoplastic foam is heated by induction.
- 3. The method of claim 1, wherein the susceptor-impregnated foam is electrically insulating.
- 4. The method of claim 1, wherein the susceptor-impregnated thermoplastic foam is imprinted with a body part.
- 5. The method of claim 1, wherein a laminate including a heated susceptor-impregnated thermoplastic foam is imprinted with a body part.
- 6. The method of claim 1, wherein at least a portion of a hand is imprinted against the heated susceptor-impregnated thermoplastic foam.
- 7. The method of claim 1, wherein at least a portion of a foot is imprinted against the heated susceptor-impregnated thermoplastic foam.
- 8. The method of claim 1, wherein a head or a portion of a head is imprinted against the heated susceptor-impregnated thermoplastic foam.
- 9. An electrically-insulating susceptor-impregnated article comprising:
a) foam, wherein the foam provides structure to the article; and b) susceptor particles, wherein the susceptor particles are impregnated within the foam, and wherein the susceptor particles are present in a concentration that:
1) is sufficient to make the article thermoplastically conformable to a mold upon heating the susceptor particles with microwave energy, and 2) is sufficiently limited to preserve the electrically-insulating character of the article.
- 10. The electrically-insulating susceptor-impregnated article of claim 9, wherein a majority of the susceptor particles are physically separated from all other susceptor particles.
- 11. The eleccrically-insulating susceptor-impregnated article of claim 9, wherein the foam is a component of an article of apparel.
- 12. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of an insole.
- 13. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a glove.
- 14. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a footwear liner.
- 15. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a piece of guard equipment.
- 16. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a hand grip.
- 17. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a seat.
- 18. The thermoplastic piece of apparel of claim 9, wherein the foam is a component of a moldable wrap.
- 19. A method for manufacturing foam comprising the steps of:
a) mixing a resin and a susceptor material; and b) heating the susceptor by induction to accelerate polymerization of the resin.
- 20. A method for manufacturing foam comprising the steps of:
a) mixing a resin and a susceptor material; and b) heating the susceptor by magnetic induction to accelerate polymerization of the resin.
- 21. A method for molding polymeric articles comprising the steps of:
a) filling a mold cavity with a resin-based composition including a susceptor material; and b) heating the susceptor material by induction to accelerate polymerization of the resin-based composition.
- 22. A thermoplastically-conformable insole comprising a foaming burst pak layer including a first package containing a resin and a second package containing an additive that will promote polymerization of the resin when contacted with the resin.
- 23. The thermoplastically-conformable insole of claim 22 wherein the foaming burst pak layer includes variable density foam inserts.
- 24. A thermoplastically-conformable insole comprising:
a) a reactive burst pak layer including a first package containing a first reactant and a second package containing a second reactant, wherein the first reactant and the second reactant will react exothermically when contacted; and b) a foam layer in thermal contact with the reactive burst pak layer.
- 25. A thermoplastically-conformable insole comprising:
a) an electrically-conductive resistive circuit; and b) a foam layer in thermal contact with electrically-conductive resistive circuit
- 26. The thermoplastically-conformable insole of claim 25 wherein the electrically-conductive resistive circuit includes a removable bus bar.
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/038,189 filed on Feb. 14, 1997, the contents of which are incorporated herein by reference in their entirety.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60038189 |
Feb 1997 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09023740 |
Feb 1998 |
US |
Child |
10024362 |
Dec 2001 |
US |