The present invention relates to a switch and a manufacturing method thereof.
When the push switch 100 is pressed from above the protection sheet 180, the dome shape of the tactile spring 160 is inverted by the operation load for the switch. Accordingly, the central contact 112 and the outer contact 114 are electrically connected and the switch is turned on. Further, when the operation load is removed, the dome shape of the tactile spring 160 is restored. Then, the central contact 112 and the outer contact 114 are not electrically connected to each other, and the switch is turned off.
At the time of manufacturing the push switch 100, the case 120 is integrally molded with the central contact 112 and the outer contact 114 by insert molding as described in, for example, Patent Literature 1. After that, the tactile spring 160, the pressing member 170 and the protection sheet 180 are attached. In the insert molding, metal plates (lead frame), which serve as the central contact 112 and the outer contact 114, are supported from below by pins 210 projecting upward from a mold 200 matching the shape of the case 120, and after the metal plates are inserted and fixed between the pins 210 and upper side pins (not depicted), resin injected into the mold 200. In the case 120 molded integrally with the metal plates in this manner, portions (ejector pin marks) corresponding to the pins become through holes 121 from which the metal plates are exposed.
Patent Literature 1: Japanese Unexamined Patent Publication (Kokai) No. 2013-191482
When the through holes 121 are formed in the case 120, solvent 300 such as flux used in mounting by reflow soldering performed after the insert molding or cleaning liquid used for removing the flux, as depicted in
In order to prevent such permeation of the solvent, it is conceivable to cover the bottom surface of the case 120 with an adhesive insulating sheet, as described in, for example, Patent Literature 1. However, in this case, since the molded resin and the insulating sheet are fixed with the adhesive, the resistance to the solvent is weak and the possibility that the solvent permeates into the interface between the metal plates and the molded resin remains. In the case of covering with a sheet, air in the through holes 121 expands when mounting by reflow soldering is performed, and the insulating sheet swells. Thus, flatness of a product is impaired and mounting defects may be caused.
It is therefore an object of the present invention to provide a switch that more reliably prevents solvent permeation from the outside in comparison with a switch without the features of the disclosed invention, and a manufacturing method thereof.
Provided is a switch including a first molded resin molded integrally with a plurality of fixed contacts by insert molding, a movable member disposed above the first molded resin to bring the plurality of fixed contacts into and out of contact with each other, and a second molded resin molded so as to close a through hole of the first molded resin formed by a pin supporting the plurality of fixed contacts at a time of the insert molding.
Preferably, the second molded resin closes the through hole from below the first molded resin and covers a side surface of the first molded resin, so that the second molded resin in cooperation with the first molded resin forms a case that houses the movable member therein.
Preferably, there is no boundary line between the first molded resin and the second molded resin on a side surface of the case.
Further, provided a method of manufacturing a switch including the steps of molding a first molded resin integrally with a plurality of fixed contacts by insert molding, disposing a movable member for bringing the plurality of fixed contacts into and out of contact with each other above the first molded resin, and molding a second molded resin so as to close a through hole of the first molded resin formed by a pin supporting the plurality of fixed contacts at a time of the insert molding.
According to the above switch and manufacturing method thereof, it is possible to more reliably prevent solvent permeation from the outside in comparison with a switch without the features of the disclosed invention.
Hereinafter, with reference to the accompanying drawings, a switch and a manufacturing method thereof will be explained in detail. However, it should be noted that the present invention is not limited to the drawings or the embodiments described below.
As depicted in
As depicted in
The second molded resin 30 is molded so as to close the through holes 21 of the first molded resin 20 formed by the pins supporting the lead frame 10 when the first molded resin 20 is insert-molded. In other words, after the first molded resin 20 is molded, the second molded resin 30 is molded such that the through holes 21 are closed by pouring the same resin as the first molded resin 20 below the first molded resin 20. As depicted in
The second molded resin 30 is fit to the lower part of the first molded resin 20, thereby cooperating with the first molded resin 20 to form a case for accommodating the tactile spring 60 therein. In the push switch 1, a resin boundary S between the first molded resin 20 and the second molded resin 30 is formed on the four side surfaces and the bottom surface of the case as depicted in
As depicted in
The pressing member 70 is a resin member (actuator) for pressing down the tactile spring 60. As depicted in
The protection sheet 80 is a flexible insulating resin sheet, and its end portion is adhered to the upper surface edge portion of the first molded resin 20 to cover the concave portion 25. The protection sheet 80, together with the first molded resin 20 and the second molded resin 30, encloses (sealing) the tactile spring 60 and the pressing member 70 in the concave portion 25.
Since the second molded resin 30 is fit to the lower part of the first molded resin 20, the through holes 21 of the first molded resin 20 are all closed, and the bottom surface of the push switch 1 is made into a flat surface. This prevents solvent such as flux from permeating into the inside of the push switch 1 from the through holes 21 due to pin marks of insert molding during, for example, mounting by reflow soldering performed after insert molding.
As described above, in the push switch 1, the resin boundary S between the first molded resin 20 and the second molded resin 30 is formed on the four side surfaces of the case. Since the first molded resin 20 and the second molded resin 30 are made or the same resin, their adhesion is good. However, when an operation load (stress) is applied in the vertical direction during operation of the push switch cracks (peeling) may occur especially at the resin boundary S on the side surfaces of the case due to the influence of stress. Therefore, for the push switch 2, covering the side surfaces of the first molded resin 40 with the second molded resin 50 allows the resin boundary on the side surfaces of the case to be eliminated, and the resistance to stress is enhanced.
As depicted in
The second molded resin 50 closes the through holes 41 of the first molded resin 40 formed by the pins supporting the lead frame 10 when the first molded resin 40 is insert-molded, and is molded so as to cover the four side surfaces of the first molded resin 40. In other words, after the first molded resin 40 is molded, the second molded resin 50 is molded such that the through holes 41 are closed and the four side walls of the push switch 2 are formed by pouring the same resin as the first molded resin 40 below and into the sides of the first molded resin 40.
As depicted in
The second molded resin 50 is molded so as to wrap the first molded resin 40, thereby cooperating with the first molded resin 40 to form a case for accommodating the tactile spring 60 therein. In the push switch 2, as depicted in
For example, shrinkage and expansion due to heat may create delicate gaps at the resin boundary. However, in the push switch 2, since there is no resin boundary S on the side surfaces of the case, permeation of solvent or the like from the side surfaces of the case is prevented. Therefore, in the push switch 2, the flux is prevented from permeating into the case more reliability than in the push switch 1, for example, during mounting by reflow soldering. In addition, since there is no resin boundary on the side surfaces of the case of the push switch 2, the distance from the resin boundary to the lead frame 10 longer than that of the push switch 1. Therefore, even when there is permeation, it is difficult for the permeating solvent or the like to reach the lead frame 10. Furthermore, in the push switch since the second molded resin 50 is molded so as to wrap the first molded resin 40, the push switch 2 has a stronger structure against the stress in the vertical direction than the push switch 1, and occurrence of cracks at the resin boundary S is also prevented.
The movable member does not necessarily have to be a convex dome-shaped spring. The shape and arrangement of the fixed contacts may be appropriately changed according to the movable contacts, and are not limited to those described above. Further, the configuration of the above-mentioned first molded resins 20 and 40 and second molded resins 30 and 50 can be applied to a multi-stage push switch in which, for example, switching with two or more stages is available. Furthermore, this configuration can be applied to not only the push switch that is pressed in the vertical direction, but also, for example, a slide switch that operated in the lateral direction.
Number | Date | Country | Kind |
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2014-211039 | Oct 2014 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2015/073389 | 8/20/2015 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2016/059872 | 4/21/2016 | WO | A |
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---|---|---|---|
4843197 | Kojima | Jun 1989 | A |
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20110089004 | Yanai et al. | Apr 2011 | A1 |
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1453807 | Nov 2003 | CN |
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S63-069115 | Mar 1988 | JP |
H06-187870 | Jul 1994 | JP |
2011-044608 | Mar 2011 | JP |
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2014-025770 | Feb 2014 | JP |
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Number | Date | Country | |
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20170229258 A1 | Aug 2017 | US |