The present invention relates to microelectromechanical system (MEMS) switch devices, and in particular to arrangements for MEMS switch devices and related methods.
As electronics evolve, there is an increased need for miniature switches that are provided on semiconductor substrates along with other semiconductor components to form various types of circuits. These miniature switches often act as relays, generally range in size from a micrometer to a millimeter, and are generally referred to as microelectromechanical system (MEMS) switches.
In some applications, MEMS switches are configured as switches and replace field effect transistors (FETs). Such MEMS switches reduce insertion losses due to added resistance, and reduce parasitic capacitance and inductance inherent in providing FET switches in a signal path. MEMS switches are currently being deployed in many radio frequency (RF) applications, such as antenna switches, load switches, transmit/receive switches, tuning switches, and the like. For instance, transmit/receive systems requiring complex RF switching capabilities may utilize a MEMS switch.
For such applications, MEMS switches are subjected to a large number of open and close contact cycles where switch contacts are actuated between an open position where corresponding contacts are spaced apart and a closed position where corresponding contacts are in contact with each other. As the open and close contact cycles are repeated, maintaining a low overall contact resistance for the MEMS switches can be challenging for a number of reasons. For example, residual manufacturing contaminants may be present on one or both of the corresponding contacts that can contribute to reduced contact area during repeated open and close cycles, thereby increasing contact resistance. In a similar manner, material transfer between the corresponding contacts after repeated open and close cycles can contribute to an increased contact resistance. Additionally, MEMS switches may be subjected to hot switching events that can exacerbate the problems associated with contaminants and/or material transfer. During switching cycles, a difference in potential may be present across corresponding contacts during the periods in which the corresponding contacts approach each other, touch, and separate from one another. When the distance between the corresponding contacts is small, electric fields can enable field emission of electrons and eventually breakdown and arcing between the corresponding contacts. This can lead to significant material transfer between the corresponding contacts, which in turn can reduce contact force and/or contact area, thereby increasing contact resistance. Additionally, this can lead to pyrolysis, or thermal decomposition, at contact surfaces which can create non-conductive and load bearing films.
The art continues to seek improved MEMS switches that provide desirable performance characteristics over multiple open and close cycles while being capable of overcoming challenges associated with conventional MEMS switches.
The present disclosure relates to microelectromechanical system (MEMS) switches and more particularly to arrangements for MEMS switches that provide a low contact resistance over a large number of open and close contact cycles. In certain embodiments, a MEMS switch device may include a plurality of parallel MEMS switches and at least one of the MEMS switches is configured differently in such a manner to close first and/or open last during open and close cycles. In this regard, the MEMS switch that closes before and/or opens after the other MEMS switches may experience increased contact resistance over a large number of open and close cycles while the other MEMS switches maintain a low contact resistance. In certain embodiments, at least one of the MEMS switches is controlled by a different control signal to open and close differently than other MEMS switches. In certain embodiments, a common control signal controls a plurality of MEMS switches and at least one of the MEMS switches is mechanically different such that it opens and closes differently than other MEMS switches.
In one aspect, a MEMS switch device comprises: a first MEMS switch configured to receive a first MEMS switch control signal; a plurality of second MEMs switches configured to receive a second MEMS switch control signal that is different than the first MEMS switch control signal, wherein the first MEMS switch and the plurality of second MEMS switches are arranged in parallel with each other; and control circuitry configured to provide the first MEMS switch control signal and the second MEMS switch control signal. In certain embodiments, the first MEMS switch is configured to close before the plurality of second MEMS switches close during an open and close cycle. In certain embodiments, the first MEMS switch is configured to reopen after the plurality of second MEMS switches reopen during the open and close cycle. In certain embodiments, the first MEMS switch is configured to (i) close before the plurality of second MEMS switches close, (ii) reopen after the plurality of second MEMS switches close, (iii) close again before the plurality of second MEMS switches open, and (iv) reopen again after the plurality of second MEMS switches open during an open and close cycle.
In certain embodiments, the MEMS switch device may further comprise a resistor configured in series with the first MEMS switch.
In certain embodiments, the MEMS switch device may further comprise an additional MEMS switch arranged in parallel with the first MEMS switch and the plurality of second MEMS switches, wherein the additional MEMS switch is configured to receive the first MEMS switch control signal. In further embodiments, a resistor is configured in series with the first MEMS switch and the additional MEMS switch.
In certain embodiments, the MEMS switch device may further comprise a plurality of additional switches arranged in parallel with the first MEMS switch and the plurality of second MEMS switches, wherein the plurality of additional MEMS switches are configured to receive the first MEMS switch control signal. In certain embodiments, the MEMS switch device may further comprising a shunt device that is connected to ground. The shunt device may comprise a shunt MEMS switch configured to receive a third MEMS switch control signal. The plurality of second MEMS switches may comprise a range of about two to about one hundred MEMS switches.
In one aspect, a method of operating a MEMS switch device comprises: providing a plurality of MEMS switches that are arranged in parallel with each other; closing a first MEMS switch of the plurality of MEMS switches before closing a second MEMS switch of the plurality of MEMS switches; and opening the second MEMS switch of the plurality of MEMS switches before opening the first MEMS switch of the plurality of MEMS switches. Closing the first MEMS switch may comprise sending a first MEMS switch control signal to the first MEMS switch, and closing the second MEMS switch comprises sending a second MEMS switch control signal to the second MEMS switch. In other embodiments, closing the first MEMS switch and closing the second MEMS switch may comprise sending a common MEMS switch control signal to both the first MEMS switch and the second MEMS switch.
In another aspect, a MEMS switch device comprises: a plurality of MEMS switches that are arranged in parallel with each other, wherein the plurality of MEMS switches are configured to receive a common MEMS switch control signal; and control circuitry configured to provide the common MEMS switch control signal; wherein a first MEMS switch of the plurality of MEMS switches is configured to close before a second MEMS switch of the plurality of MEMS switches in response to the common MEMS switch control signal. In certain embodiments, the first MEMS switch of the plurality of MEMS switches is configured to open after the second MEMS switch of the plurality of MEMS switches in response to the common MEMS switch control signal. In certain embodiments, the first MEMS switch comprises a first switch contact over a substrate and the second MEMS switch comprises a second switch contact over the substrate, and in an open position, the first switch contact is configured closer to the substrate than the second switch contact. In certain embodiments, the first MEMS switch comprises a first actuator and the second MEMS switch comprises a second actuator, and the second actuator has a higher spring constant than the first actuator. In certain embodiments, the first MEMS switch comprises a lighter mass than the second MEMS switch. The plurality of MEMS switches may comprise a range of about two to about one hundred MEMS switches.
In another aspect, any of the foregoing aspects, and/or various separate aspects and features as described herein, may be combined for additional advantage. Any of the various features and elements as disclosed herein may be combined with one or more other disclosed features and elements unless indicated to the contrary herein.
Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.
The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.
The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The present disclosure relates to microelectromechanical system (MEMS) switches and more particularly to arrangements for MEMS switches that provide a low contact resistance over a large number of open and close contact cycles. In certain embodiments, a MEMS switch device may include a plurality of parallel MEMS switches and at least one of the MEMS switches is configured differently in such a manner to close first and/or open last during open and close cycles. In this regard, the MEMS switch that closes before and/or opens after the other MEMS switches may experience an increased contact resistance over a large number of open and close cycles while the other MEMS switches maintain a low contact resistance. In certain embodiments, at least one of the MEMS switches is controlled by a different control signal to open and close differently than other MEMS switches. In certain embodiments, a common control signal controls a plurality of MEMS switches and at least one of the MEMS switches is mechanically different such that it opens and closes differently than other MEMS switches.
Before describing particular embodiments of the present disclosure further, a general discussion of MEMS switch devices is provided. Turning to
The second end of the actuator 16 forms or is provided with a switch contact 22, which is suspended over a corresponding terminal contact 24 and/or a second conductive pad 26. The second conductive pad 26 may form a portion of or be connected to a second terminal (not shown) of the main MEMS switch 12. Thus, when the main MEMS switch 12 is actuated, the actuator 16 moves the switch contact 22 into electrical contact with the terminal contact 24 of the second conductive pad 26 to electrically connect the first conductive pad 20 to the second conductive pad 26. To actuate the main MEMS switch 12, and in particular to cause the actuator 16 to move the switch contact 22 into contact with the terminal contact 24 of the second conductive pad 26, an actuator plate 28 is formed over a portion of the substrate 14, preferably under the middle portion of the actuator 16. To actuate the main MEMS switch 12, an electrostatic voltage is applied to the actuator plate 28. The presence of the electrostatic voltage creates an electromagnetic field that effectively moves the actuator 16 against a restoring force toward the actuator plate 28 from an “open” position illustrated in
In light of the electromechanical structure of the main MEMS switch 12, the main MEMS switch 12 cannot provide switching action as fast as typical solid state switches, such as n-type metal-oxide-semiconductor field effect transistor (NMOSFET) switches. A switching time of the main MEMS switch 12 typically depends upon the electromagnetic field applied to the actuator 16, a mass of the actuator 16, and a restoring force or spring constant of the actuator 16. However, an FET switch may generate higher insertion loss than is generated by the main MEMS switch 12. Moreover, at high power levels in a radio frequency (RF) circuit (not shown), parasitic capacitance at semiconductor junctions of the FET switch may alter RF signals.
During switching events, such as a hot switching event, a difference in potential between the switch contact 22 and the terminal contact 24 may cause an electrical arc resulting from an electrical current flowing through normally non-conductive media, such as air. Undesired or unintended electrical arcing may have detrimental effects on the switch contact 22 and the terminal contact 24 of the main MEMS switch 12. For instance, as the main MEMS switch 12 is being either actuated to the closed position of
In various RF applications, MEMS switch devices may include a single switch or a plurality of parallel switches. For instance,
In certain embodiments disclosed herein, a MEMS switch device includes at least a first MEMS switch and a second MEMS switch that are arranged in parallel with each other. Control circuitry is configured to provide a separate MEMS switch control signal to each of the first MEMS switch and the second MEMS switch. This configuration allows the first MEMS switch to be separately controlled to close before the second MEMS switch closes and/or open after the second MEMS switch is opened in an open and close cycle. In this manner, a common potential is established by the first MEMS switch while the second MEMS switch opens and closes. Accordingly, the first MEMS switch may experience arcing and degradation over a number of open and close cycles while arcing in the second MEMS switch is reduced. In certain embodiments, a first MEMS switch may operate in such a manner to reduce arcing in a plurality of second MEMS switches.
In a MEMS switch device that includes a first MEMS switch that serves as a degradation protection switch as previously described, degradation of the first MEMS switch may reach a level that prevents it from be able to establish a common potential between an RFin and an RFout. In certain embodiments as disclosed herein, additional MEMS switches may be configured in a similar manner to the first MEMS switch such that the MEMS switch device comprises two or more protection switches that collectively serve to protect other MEMS switches in the MEMS switch device from degradation.
In various RF applications, a MEMS switch device may be linked to an antenna, cable input, or other type of input that provides a hot switching power source. In certain embodiments as disclosed herein, the MEMS switch device may include a shunt device connected between the hot switching power source and ground that is configured to attenuate power entering the MEMS switch device.
In certain embodiments as disclosed herein, one or more MEMS switches may serve as degradation protection switches for other MEMS switches without the need for separate MEMS switch control signals. In this regard, a MEMS switch device may include a plurality of MEMS switches that are arranged in parallel with each other and the plurality of MEMS switches are configured to receive a common MEMS switch control signal. In certain embodiments, one or more of the MEMS switches may be configured to close before the other MEMS switches in response to the common control signal. This may be accomplished by configuring the one or more MEMS switches with one or more positional and/or structural differences that enable faster closing and slower opening than the other MEMS switches.
Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.
This application claims the benefit of provisional patent application Ser. No. 62/593,549, filed Dec. 1, 2017, the disclosure of which is hereby incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
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7864491 | Bauder et al. | Jan 2011 | B1 |
9156677 | Bauder et al. | Oct 2015 | B2 |
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Basu, Anirban, et al., “Leading and Trailing Edge Hot Switching Damage in a Metal Contact RF MEMS Switch,” Transducers and Eurosensors, Jun. 2013, Barcelona, Spain, IEEE, pp. 514-517. |
Dickrell, Daniel, III, et al., “Electrical Contact Resistance Degradation of a Hot-Switched Simulated Metal MEMS Contact,” vol. 30, Issue 1, Mar. 2007, IEEE, pp. 75-80. |
Number | Date | Country | |
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20190172671 A1 | Jun 2019 | US |
Number | Date | Country | |
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62593549 | Dec 2017 | US |