This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2013-140621, filed on Jul. 4, 2013, the entire contents of which are incorporated herein by reference.
The present invention relates to a switch device that resiliently moves a leaf spring to produce a contact action.
Japanese Laid-Open Patent Publication No. 7-65681 describes a switch device referred to as a snap action module switch. The switch device resiliently moves a leaf spring to produce a contact action. In this structure, contacts open and close quickly and stably. This shortens the duration of arcs and prolongs the life of the switch.
In the switch device, the leaf spring is supported by a terminal. Thus, the leaf spring constantly contacts the terminal. However, the contact action causes abrasion at the portion of contact between the leaf spring and the terminal. This forms abrasive particles. Oxidation of the abrasive particles generates electric resistance that destabilizes the electric connection. To delay such oxidation, the above publication describes the application of silver plating to the leaf spring. However, the application of silver plating to portions of the leaf spring where stress concentrates adversely affects anti-fatigue properties.
The present invention provides a switch device capable of delaying the oxidation of abrasive grains while limiting deterioration of the anti-fatigue properties of a leaf spring.
A first aspect of the present invention is a switch device including a terminal and a leaf spring supported by the terminal. The leaf spring is resiliently movable to produce a contact action. The leaf spring includes a metal plating applied to a portion that is in contact with and supported by the terminal, and the metal plating is not applied to a portion of the leaf spring where stress concentrates when the leaf spring is resiliently moved.
A second aspect of the present invention is a switch device including a terminal and a leaf spring supported by the terminal. The leaf spring is resiliently movable to produce a contact action. The leaf spring includes a metal plating applied to only a portion that is in contact with and supported by the terminal.
A third aspect of the present invention is a leaf spring applied to a switch device and resiliently movable to produce a contact action. The leaf spring includes a metal plating applied to a portion that is in contact with and supported by a terminal of the switch device. The metal plating is not applied to a portion of the leaf spring where stress concentrates when the leaf spring is resiliently moved.
A fourth aspect of the present invention is a leaf spring applied to a switch device and resiliently movable to produce a contact action. The leaf spring includes a metal plating applied to only a portion that is in contact with and supported by a terminal of the switch device.
Other aspects and advantages of the present invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
The invention, together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
One embodiment of a switch device will now be described.
The insulator 2 includes a cavity that accommodates a leaf contact (not illustrated), which is supported by the UP terminal, and a leaf contact 5, which is supported by the DN terminal. Each leaf contact is movable in the cavity independently from the other leaf contact. The leaf contact 5 illustrated in
A slider (not illustrated) is arranged on the upper portion of the insulator 2 to generate an UP motion command when moved. A slider 7 is also arranged on the upper portion of the insulator 2 to generate a DOWN motion command when moved. Each slider is movable independently from the other slider. A pusher (not illustrated) moves in cooperation with the slider that generates the UP motion command, and a pusher 8 moves in cooperation with the slider 7 that generates the DOWN motion command. Each pusher constantly contacts the corresponding leaf contact 5 and moves in the vertical direction in accordance with the movement of the corresponding slider. For example, as viewed in
Referring to
Referring to
Referring to
The structure of the leaf contact 5 will now be described with reference to
As illustrated in
As illustrated in
The silver plating 55 is not applied to the leaf contact 5 at portions where stress concentrate when the stored force is released (refer to dots in
A process for manufacturing the leaf contact 5 will now be described.
First, a pressing process is performed on a metal spring material to shape a leaf spring. Then, a plating process is performed to apply the silver plating 55 to portions of the surfaces cut in the pressing process that are in contact with and supported by the DN terminal 3 and portions adjacent to such cut surfaces. Subsequently, the movable contact 6 is coupled to the spring material, and a bending process is performed to set a predetermined spring constant for the spring piece 53.
The operation of the power window switch 1 will now be described.
Referring to
The present embodiment has the advantages described below.
(1) The silver plating 55 is partially applied to the leaf contact 5. This limits deterioration of the anti-fatigue properties and delays oxidation of abrasive particles.
(2) Since deterioration of the anti-fatigue properties is limited, durability may be improved in the leaf contact 5 that repetitively produces the contact action.
(3) Silver plating 35 and 55 is applied to the portions of the leaf contact 5 and the DN terminal 3 that are in contact with each other. In such a structure, silver is in contact with silver. This lowers the electric resistance and stabilizes the electrical connection.
(4) The electric resistance is low. This reduces Joule heating during the passage of current.
It should be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention. Particularly, it should be understood that the present invention may be embodied in the following forms.
The metal plating applied to the leaf contact 5 may be a gold plating instead of the silver plating 35.
The metal plating applied to the DN terminal 3 may be a gold plating instead of the silver plating 55.
The metal plating of the leaf contact 5 and the metal plating of the DN terminal 3 may be formed from the same metal material or a different metal material.
In the above embodiment, the power window switch 1 is illustrated as an example of a switch device. However, the present invention may be applied to any switch device that resiliently moves a leaf spring supported by a terminal to produce a contact action. Further, the present invention is not limited to a switch device that is used in a vehicle. Moreover, the present invention is not limited to a switch device that produces two motions (UP motion and DOWN motion) like in the above embodiment.
This disclosure encompasses a method for manufacturing a leaf spring, in which the leaf spring is configured to supported by a terminal and resiliently movable to produce a contact action. The method includes performing a pressing process on a metal spring material, and applying metal plating to a cut surface of the spring material formed in the pressing process. The step of applying includes applying metal plating to only a portion of the cut surface that is in contact with and supported by the terminal.
The present examples and embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalence of the appended claims.
Number | Date | Country | Kind |
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2013-140621 | Jul 2013 | JP | national |