1. Field of the Invention
This invention relates to MEMS oscillators and more particularly to power handling associated therewith.
2. Description of the Related Art
Microelectromechanical Systems (MEMS) generally refers to an apparatus incorporating some mechanical structure having dimensions, less than, e.g., approximately 100 or 200 μm. MEMS devices are commonly used for such applications as oscillators in timing applications, accelerometers, and inertial sensors, and the number of applications is growing. Certain structural components of a MEMS device are typically capable of some form of mechanical motion. The MEMS device can be formed using fabrication techniques similar to techniques used in the electronics industry such as Low Pressure Chemical Vapor Deposition, (LPCVD), Plasma Enhanced CVD (PECVD), patterning using photolithography, and Reactive Ion Etching (RIE), etc.
MEMS devices used in timing applications include a resonator. The resonator may have a variety of physical shapes, e.g., beams and plates.
As MEMS oscillators have the advantage of small form factor and low-cost production, they can be found in a variety of consumer products, including portable products using batteries to supply power. Improvement in power handling in MEMS oscillators is desirable to provide better performance.
Accordingly, in one embodiment a MEMS oscillator includes a resonator body and a first set of electrodes to drive or sense motion of the resonator body. The first set of electrodes includes a primary electrode and a secondary electrode. The primary and secondary electrodes are configured to be used together at a first time during operation of the MEMS oscillator, and the secondary electrode is configured to be disabled at a second time during operation of the MEMS oscillator. The first time period is, e.g., at start-up and the second time-period is after start-up.
In another embodiment a MEMS oscillator includes a resonator body and a first set of drive electrodes, having primary and secondary electrodes, to electrostatically drive the resonator body. A second set of sense electrodes, having a primary and secondary electrode, senses motion of the resonator body. The primary and secondary electrodes of each set are configured to be used together during start-up of the MEMS oscillator, and the secondary electrode of each set is configured to be disabled after start-up while the primary electrode of each set remains enabled.
A method of operating a MEMS oscillator includes, during a first time period, using a first set of electrodes, including a primary and secondary electrode, together to drive movement of a resonator body. During a second time period, during oscillation of the MEMS oscillator, the secondary electrode is disabled and the primary electrode is used to sustain oscillation of the resonator body. The method may further include using a second set of electrodes having a primary and secondary electrode together to sense movement of the resonator body during the first time period. During the second time period the secondary electrode of the second set is disabled and using the primary electrode is used to sense movement of the resonator body during the second time period.
The present invention may be better understood, and its numerous objects, features, and advantages made apparent to those skilled in the art by referencing the accompanying drawings.
The use of the same reference symbols in different drawings indicates similar or identical items.
Referring to
The sense electrode is also split into primary electrodes 209 and secondary electrodes 211. The primary and secondary sense electrodes are used together during start-up while the secondary electrode may be turned off after start-up, which adds to motional impedance.
Certain parts of the electrodes contribute more to the electrostatic nonlinearity of the resonator. Thus, when the electrodes are split, those parts that contribute more to electrostatic nonlinearity should be the secondary electrodes. For an in-plane resonator as shown in
where gap is the nominal gap between the electrode and the resonator and displacement relates to the movement of the resonator from its nominal position during oscillation. So the part of the resonator that has the greatest displacement contributes the most to the nonlinearity. Thus, referring to
While the discussion has centered on MEMS oscillators in which the resonator body oscillates in-plane, the approach is equally valid for out-of-plane resonators or torsional mode resonators.
Note that while the description above has turned off both drive and sense secondary electrodes, other embodiments may just turn off the drive electrodes after startup. That could reduce the displacement while maintaining the same sense transduction. The overall motional impedance would still increase.
The description of the invention set forth herein is illustrative, and is not intended to limit the scope of the invention as set forth in the following claims. Other variations and modifications of the embodiments disclosed herein, may be made based on the description set forth herein, without departing from the scope of the invention as set forth in the following claims.
Number | Name | Date | Kind |
---|---|---|---|
5729075 | Strain | Mar 1998 | A |
6557419 | Herb et al. | May 2003 | B1 |
6739190 | Hsu et al. | May 2004 | B2 |
6744174 | Paden et al. | Jun 2004 | B2 |
6831531 | Giousouf et al. | Dec 2004 | B1 |
6844214 | Mei et al. | Jan 2005 | B1 |
6987432 | Lutz et al. | Jan 2006 | B2 |
6988789 | Silverbrook | Jan 2006 | B2 |
7008812 | Carley | Mar 2006 | B1 |
7071793 | Lutz et al. | Jul 2006 | B2 |
7079299 | Conant et al. | Jul 2006 | B1 |
7202761 | Lutz et al. | Apr 2007 | B2 |
7595708 | Lutz et al. | Sep 2009 | B2 |
7639104 | Quevy et al. | Dec 2009 | B1 |
7990233 | Suzuki | Aug 2011 | B2 |
20020151100 | Coffa et al. | Oct 2002 | A1 |
20050250236 | Takeuchi et al. | Nov 2005 | A1 |
20060017533 | Jahnes et al. | Jan 2006 | A1 |
20060033594 | Lutz et al. | Feb 2006 | A1 |
20060186971 | Lutz et al. | Aug 2006 | A1 |
20070013268 | Kubo et al. | Jan 2007 | A1 |
20080178672 | Kanai et al. | Jul 2008 | A1 |
20100093125 | Quevy et al. | Apr 2010 | A1 |
20110084781 | Quevy et al. | Apr 2011 | A1 |
20110090554 | Tung | Apr 2011 | A1 |
Entry |
---|
Choo, H. et al., “A Simple Process to Fabricate Self-Aligned, High-Performance Torsional Microscanners; Demonstrated Use in a Two-Dimensional Scanner,” 2005 IEEE/LEOS International Conference on Optical MEMS and Their Applications; Aug. 1-4, 2005, pp. 21-22. |
Chiou, J.C. et al., “Out-of-Plane CMOS-MEMS Resonator with Electrostatic Driving and Piezoresistive Sensing,” 2006 IEEE-NANO Sixth IEEE Conference on Nanotechnology, Jun. 17-20, 2006, vol. 2, pp. 929-932. |
Helmbrecht, Michael A., et al., “Performance of high-stroke, segmented MEMS deformable-mirror technology,” MEMS/MOEMS Components and Their Applications III, Proc. of SPIE, vol. 6113, 61130L, (Jan. 2006), pp. 1-10. |
Jianqiang, Han, et al., “Dependence of the resonance frequency of thermally excited microcantilever resonators on temperature,” Elsevier, Sensors and Actuators, A 101 (Apr. 2002), pp. 37-41. |
Schmidt, Martin A., et al., “Design and Calibration of a Microfabricated Floating-Element Shear-Stress Sensor,” IEEE Transactions on Electron Devices, vol. 35, No. 6, (Jun. 1988), pp. 750-757. |
Shen, F., et al., “Thermal Effects on Coated Resonant Microcantilevers,” Elsevier, Sensors and Actuators, A 95, (Aug. 2001), pp. 17-23. |
Tang, William C., et al., “Electrostatic Comb Drive Levitation and Control Method,” Journal of Microelectromechanical Systems, vol. 1, No. 4 (Dec. 1992), pp. 170-178. |
Tang, William C., et al., “Laterally Driven Polysilicon Resonant Microstructures,” MEMS 1989, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, IEEE (Feb. 1989), pp. 53-59. |
Tung, Meng Fai, “An Introduction to MEMS Optical Switches,” (Dec. 13, 2001), pp. 1-37. |
Kaajakari, V., Doskinen, J.K., and Mattila, T., “Phase Noise in Capacitively Coupled Micromechanical Oscillators,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 52, No. 12, pp. 2322-2331, Dec. 2005. |
Number | Date | Country | |
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20130002364 A1 | Jan 2013 | US |