Claims
- 1. A hot melt adhesive composition which comprises (A) 100 parts by weight of a resinous composition having a softening point in the range of about 60.degree. C to about 110.degree. C prepared by the method which comprises polymerizing a monomer mixture comprising about 45 to about 70 weight percent styrene, about 10 to about 35 weight percent isobutylene and about 8 to about 35 weight percent 1,3-butadiene where the molar ratio of isobutylene to butadiene is in the range of about 0.5/1 to about 3/1, in the presence of a catalyst selected from aluminum chloride and ethylaluminum dichloride and, in the presence of a solvent selected from aromatic hydrocarbons containing 6 to 8 carbon atoms and saturated aliphatic hydrocarbons containing 3 to 7 carbon atoms, said solvent containing dissolved water in an amount of about 50 to about 200 parts per million by weight based on said solvent but not exceeding the solvent's saturation level, and (B) about 50 to about 200 parts by weight of a polymer selected from copolymers of ethylene and vinyl acetate, of ethylene and alkyl acrylate, of vinyl acetate and acrylic acid and of terpolymers of ethylene and vinyl acetate and methacrylic acid.
- 2. The hot melt adhesive composition of claim 1 where said resinous composition is prepared by adding styrene, isobutylene and 1,3-butadiene simultaneously to the resin preparation reaction slowly enough that essentially no unreacted isobutylene and styrene monomers are allowed to accumulate in the reaction mixture.
Parent Case Info
This is a Division of application Ser. No. 469,262 filed May 13, 1974, now U.S. Pat. No. 3,910,865.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
2631953 |
Hubbard et al. |
Mar 1953 |
|
3835079 |
Scardiglia et al. |
Sep 1974 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
469262 |
May 1974 |
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