Syringe for liquid dispensing machine

Information

  • Patent Grant
  • D1039326
  • Patent Number
    D1,039,326
  • Date Filed
    Friday, November 19, 2021
    3 years ago
  • Date Issued
    Tuesday, August 20, 2024
    3 months ago
Abstract
Description


FIG. 1 is a front view thereof, showing a syringe for liquid dispensing machine of my new design;



FIG. 2 is a right side view thereof;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof;



FIG. 5 is an A-A cross-sectional view thereof;



FIG. 6 is a perspective view thereof; and,



FIG. 7 is another perspective view thereof.


This article is a syringe for connecting to a liquid dispensing machine. It is also used for transporting and storing liquid materials such as solder paste, UV resin, silver paste, epoxy resin liquid, etc.


Claims
  • The ornamental design for a syringe for liquid dispensing machine, as shown and described.
Priority Claims (1)
Number Date Country Kind
2021-010674 D May 2021 JP national
US Referenced Citations (17)
Number Name Date Kind
D460181 Swenson Jul 2002 S
D600498 Ma Sep 2009 S
D611310 Eide Mar 2010 S
D623291 Strong Sep 2010 S
D663023 Strong Jul 2012 S
D667950 Hyun Sep 2012 S
D798444 Darras Sep 2017 S
D836772 Nandi Dec 2018 S
D881005 Ikushima Apr 2020 S
D923432 Snopok Jun 2021 S
D926971 Coats Aug 2021 S
D942819 Yang Feb 2022 S
D943363 Yang Feb 2022 S
D946361 Yang Mar 2022 S
D957897 Javed Jul 2022 S
D1021083 Ikushima Apr 2024 S
20190381259 Doubet Dec 2019 A1
Foreign Referenced Citations (1)
Number Date Country
30-0695052 May 2013 KR
Non-Patent Literature Citations (1)
Entry
Office Action issued by the Japan Patent Office on Oct. 1, 2021 for patent application No. JPD2021-010674.