This article is a syringe for connecting to a liquid dispensing machine. It is also used for transporting and storing liquid materials such as solder paste, UV resin, silver paste, epoxy resin liquid, etc.
This article is a syringe for connecting to a liquid dispensing machine. It is also used for transporting and storing liquid materials such as solder paste, UV resin, silver paste, epoxy resin liquid, etc.
Number | Date | Country | Kind |
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2021-010674 D | May 2021 | JP | national |
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30-0695052 | May 2013 | KR |
Entry |
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Office Action issued by the Japan Patent Office on Oct. 1, 2021 for patent application No. JPD2021-010674. |