Syringe for liquid dispensing machine

Information

  • Patent Grant
  • D1045499
  • Patent Number
    D1,045,499
  • Date Filed
    Friday, November 19, 2021
    3 years ago
  • Date Issued
    Tuesday, October 8, 2024
    3 months ago
Abstract
Description


FIG. 1 is a front view thereof, showing a syringe for liquid dispensing machine of my new design;



FIG. 2 is a right side view thereof;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof;



FIG. 5 is a perspective view thereof;



FIG. 6 is another perspective view thereof;



FIG. 7 is a front view thereof, showing another embodiment of the syringe for liquid dispensing machine;



FIG. 8 is a right side view thereof;



FIG. 9 is a top plan view thereof;



FIG. 10 is a bottom plan view thereof;



FIG. 11 is a perspective view thereof; and,



FIG. 12 is another perspective view thereof.


In the drawings, the broken lines depict portions of the syringe for liquid dispensing machine that form no part of the claimed design.


This article is a syringe for connecting to a liquid dispensing machine. It is also used for transporting and storing liquid materials such as solder paste, UV resin, silver paste, epoxy resin liquid, etc. It is sealed with a syringe head cap on the upper part and a syringe tip cap on the lower part, as shown in the reference figure.


Claims
  • The ornamental design for a syringe for liquid dispensing machine, as shown and described.
Priority Claims (2)
Number Date Country Kind
2021-010675 D May 2021 JP national
2021-010678 D May 2021 JP national
US Referenced Citations (24)
Number Name Date Kind
D460181 Swenson Jul 2002 S
D600498 Ma Sep 2009 S
D611310 Eide Mar 2010 S
D623291 Strong Sep 2010 S
D663023 Strong Jul 2012 S
D667950 Hyun Sep 2012 S
D798444 Darras Sep 2017 S
D836772 Nandi Dec 2018 S
D881005 Ikushima Apr 2020 S
D923432 Snopok Jun 2021 S
D926971 Coats Aug 2021 S
D942819 Yang Feb 2022 S
D943363 Yang Feb 2022 S
D946361 Yang Mar 2022 S
D957897 Javed Jul 2022 S
D1021083 Ikushima Apr 2024 S
D1027168 Li May 2024 S
D1029240 Marie May 2024 S
D1029249 Pezzulli May 2024 S
11992669 Hirschmann May 2024 B2
20190381259 Doubet Dec 2019 A1
20240181169 Salem Jun 2024 A1
20240189519 Kumar Jun 2024 A1
20240198005 Nason Jun 2024 A1
Foreign Referenced Citations (1)
Number Date Country
30-0695052 May 2013 KR
Non-Patent Literature Citations (1)
Entry
Office Action issued by the Japan Patent Office on Oct. 1, 2021 for patent application No. JPD2021-010675.