System and method for a variable home position dispense system

Information

  • Patent Grant
  • 8814536
  • Patent Number
    8,814,536
  • Date Filed
    Friday, July 20, 2012
    12 years ago
  • Date Issued
    Tuesday, August 26, 2014
    10 years ago
Abstract
Embodiments of the invention provide a system, method and computer program product for reducing the hold-up volume of a pump. More particularly, embodiments of the invention can determine, prior to dispensing a fluid, a position for a diaphragm in a chamber to reduce a hold-up volume at a dispense pump and/or a feed pump. This variable home position of the diaphragm can be determined based on a set of factors affecting a dispense operation. Example factors may include a dispense volume and an error volume. The home position for the diaphragm can be selected such that the volume of the chamber at the dispense pump and/or feed pump contains sufficient fluid to perform the various steps of a dispense cycle while minimizing the hold-up volume. Additionally, the home position of the diaphragm can be selected to optimize the effective range of positive displacement.
Description
TECHNICAL FIELD

Embodiments of the invention generally relate to pumping systems and more particularly to dispense pumps. Even more particularly, embodiments of the invention provide systems and method for reducing the hold-up volume for a dispense pump.


BACKGROUND

Dispense systems for semiconductor manufacturing applications are designed to dispense a precise amount of fluid on a wafer. In one-phase systems, fluid is dispensed to a wafer from a dispense pump through a filter. In two-phase systems, fluid is filtered in a filtering phase before entering a dispense pump. The fluid is then dispensed directly to the wafer in a dispense phase.


In either case, the dispense pump typically has a chamber storing a particular volume of fluid and a movable diaphragm to push fluid from the chamber. Prior to dispense, the diaphragm is typically positioned so that the maximum volume of the chamber is utilized regardless of the volume of fluid required for a dispense operation. Thus, for example, in a 10 mL dispense pump, the chamber will store 10.5 mL or 11 mL of fluid even if each dispense only requires 3 mL of fluid (a 10 mL dispense pump will have a slightly larger chamber to ensure there is enough fluid to complete the maximum anticipated dispense of 10 mL). For each dispense cycle, the chamber will be filled to its maximum capacity (e.g., 10.5 mL or 11 mL, depending on the pump). This means that for a 3 mL dispense there is at least 7.5 mL “hold-up” volume (e.g., in a pump having a 10.5 mL chamber) of fluid that is not used for a dispense.


In two-phase dispense systems the hold-up volume increases because the two-phase systems utilize a feed pump that has a hold-up volume. If the feed pump also has a 10.5 mL capacity, but only needs to provide 3 mL of fluid to the dispense pump for each dispense operation, the feed pump will also have a 7.5 mL unused hold-up volume, leading, in this example, to a 15 mL of unused hold-up volume for the dispense system as a whole.


The hold-up volume presents several issues. One issue is that extra chemical waste is generated. When the dispense system is initially primed, excess fluid than what is used for the dispense operations is required to fill the extra volume at the dispense pump and/or feed pump. The hold-up volume also generates waste when flushing out the dispense system. The problem of chemical waste is exacerbated as hold-up volume increases.


A second issue with a hold-up volume is that fluid stagnation takes place. Chemicals have the opportunity to gel, crystallize, degas, separate etc. Again, these problems are made worse with a larger hold-up volume especially in low dispense volume applications. Stagnation of fluid can have deleterious effects on a dispense operation.


Systems with large hold-up volumes present further shortcomings with respect to testing new chemicals in a semiconductor manufacturing process. Because many semiconductor manufacturing process chemicals are expensive (e.g., thousands of dollars a liter), new chemicals are tested on wafers in small batches. Because semiconductor manufacturers do not wish to waste the hold-up volume of fluid and associated cost by running test dispenses using a multi-stage pump, they have resorted to dispensing small amounts of test chemicals using a syringe, for example. This is an inaccurate, time consuming and potentially dangerous process that is not representative of the actual dispense process.


SUMMARY OF THE INVENTION

Embodiments of the invention provide a system and method of fluid pumping that eliminates, or at least substantially reduces, the shortcomings of prior art pumping systems and methods. One embodiment of the invention can include a pumping system comprising a dispense pump having a dispense diaphragm movable in a dispense chamber, and a pump controller coupled to the dispense pump. The pump controller, according to one embodiment, is operable to control the dispense pump to move the dispense diaphragm in the dispense chamber to reach a dispense pump home position to partially fill the dispense pump. The available volume corresponding to the dispense pump home position is less than the maximum available volume of the dispense pump and is the greatest available volume for the dispense pump in a dispense cycle. The dispense pump home position is selected based on one or more parameters for a dispense operation.


Another embodiment of the invention includes a multi-stage pumping system comprising a feed pump that has a feed diaphragm movable within a feed chamber, a dispense pump downstream of the feed pump that has a dispense diaphragm movable within a dispense chamber and a pump controller coupled to the feed pump and the dispense pump to control the feed pump and the dispense pump.


The dispense pump can have a maximum available volume that is the maximum volume of fluid that the dispense pump can hold in the dispense chamber. The controller can control the dispense pump to move the dispense diaphragm in the dispense chamber to reach a dispense pump home position to partially fill the dispense pump. The available volume for holding fluid at the dispense pump corresponding to the dispense pump home position is less than the maximum available volume of the dispense pump and is the greatest available volume for the dispense pump in a dispense cycle. By reducing the amount of fluid held by the dispense pump to the amount required by the dispense pump in a particular dispense cycle (or some other reduced amount from the maximum available volume), the hold-up volume of fluid is reduced.


Another embodiment of the invention includes a method for reducing the hold-up volume of a pump that comprises asserting pressure on the process fluid, partially filling a dispense pump to a dispense pump home position for a dispense cycle, and dispensing a dispense volume of the process fluid from the dispense pump to a wafer. The dispense pump has an available volume corresponding to the dispense pump home position that is less than the maximum available volume of the dispense pump and is the greatest available volume at the dispense pump for the dispense cycle. The available volume corresponding to the dispense pump home position of the dispense pump is at least the dispense volume.


Another embodiment of the invention includes a computer program product for controlling a pump. The computer program product comprises software instructions stored on a computer readable medium that are executable by a processor. The set of computer instructions can comprise instructions executable to direct a dispense pump to move a dispense diaphragm to reach a dispense pump home position to partially fill the dispense pump, and direct the dispense pump to dispense a dispense volume of the process fluid from the dispense pump. The available volume of the dispense pump corresponding to the dispense pump home position is less than the maximum available volume of the dispense pump and is the greatest available volume for the dispense pump in a dispense cycle.


Embodiments of the invention provide an advantage over prior art pump systems and methods by reducing the hold-up volume of the pump (single stage or multi-stage), thereby reducing stagnation of the process fluid.


Embodiments of the invention provide another advantage by reducing the waste of unused process fluids in small volume and test dispenses.


Embodiments of the invention provide yet another advantage by providing for more efficient flushing of stagnant fluid.


Embodiments of the invention provide yet another advantage by optimizing the effective range of a pump diaphragm.





BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the invention and the advantages thereof may be acquired by referring to the following description, taken in conjunction with the accompanying drawings in which like reference numbers indicate like features and wherein:



FIG. 1 is a diagrammatic representation of a pumping system;



FIG. 2 is a diagrammatic representation of a multi-stage pump;



FIGS. 3A-3G provide diagrammatic representations of one embodiment of a multi-stage pump during various stages of operation



FIGS. 4A-4C are diagrammatic representations of home positions for pumps running various recipes;



FIGS. 5A-5K are diagrammatic representations of another embodiment of a multi-stage pump during various stages of a dispense cycle;



FIG. 6 is a diagrammatic representation of a user interface;



FIG. 7 is a flow chart illustrating one embodiment of a method for reducing hold-up volume at a multi-stage pump; and



FIG. 8 is a diagrammatic representation of a single stage pump.





DETAILED DESCRIPTION

Preferred embodiments of the invention are illustrated in the FIGURES, like numerals being used to refer to like and corresponding parts of the various drawings.


Embodiments of the invention provide a system and method for reducing the hold-up volume of a pump. More particularly, embodiments of the invention provide a system and method for determining a home position to reduce hold-up volume at a dispense pump and/or a feed pump. The home position for the diaphragm can be selected such that the volume of the chamber at the dispense pump and/or feed pump contains sufficient fluid to perform the various steps of a dispense cycle while minimizing the hold-up volume. Additionally, the home position of the diaphragm can be selected to optimize the effective range of positive displacement.



FIG. 1 is a diagrammatic representation of a pumping system 10. The pumping system 10 can include a fluid source 15, a pump controller 20 and a multiple stage (“multi-stage”) pump 100, which work together to dispense fluid onto a wafer 25. The operation of multi-stage pump 100 can be controlled by pump controller 20, which can be onboard multi-stage pump 100 or connected to multi-stage pump 100 via one or more communications links for communicating control signals, data or other information. Pump controller 20 can include a computer readable medium 27 (e.g., RAM, ROM, Flash memory, optical disk, magnetic drive or other computer readable medium) containing a set of control instructions 30 for controlling the operation of multi-stage pump 100. A processor 35 (e.g., CPU, ASIC, RISC or other processor) can execute the instructions. In the embodiment of FIG. 1, controller 20 communicates with multi-stage pump 100 via communications links 40 and 45. Communications links 40 and 45 can be networks (e.g., Ethernet, wireless network, global area network, DeviceNet network or other network known or developed in the art), a bus (e.g., SCSI bus) or other communications link. Pump controller 20 can include appropriate interfaces (e.g., network interfaces, I/O interfaces, analog to digital converters and other components) to allow pump controller 20 to communicate with multi-stage pump 100. Pump controller 20 includes a variety of computer components known in the art including processors, memories, interfaces, display devices, peripherals or other computer components. Pump controller 20 controls various valves and motors in multi-stage pump to cause multi-stage pump to accurately dispense fluids, including low viscosity fluids (i.e., less than 5 centipoises) or other fluids. It should be noted that while FIG. 1 uses the example of a multi-stage pump, pumping system 10 can also use a single stage pump.



FIG. 2 is a diagrammatic representation of a multi-stage pump 100. Multi-stage pump 100 includes a feed stage portion 105 and a separate dispense stage portion 110. Located between feed stage portion 105 and dispense stage portion 110, from a fluid flow perspective, is filter 120 to filter impurities from the process fluid. A number of valves can control fluid flow through multi-stage pump 100 including, for example, inlet valve 125, isolation valve 130, barrier valve 135, purge valve 140, vent valve 145 and outlet valve 147. Dispense stage portion 110 can further include a pressure sensor 112 that determines the pressure of fluid at dispense stage 110.


Feed stage 105 and dispense stage 110 can include rolling diaphragm pumps to pump fluid in multi-stage pump 100. Feed-stage pump 150 (“feed pump 150”), for example, includes a feed chamber 155 to collect fluid, a feed stage diaphragm 160 to move within feed chamber 155 and displace fluid, a piston 165 to move feed stage diaphragm 160, a lead screw 170 and a feed motor 175. Lead screw 170 couples to feed motor 175 through a nut, gear or other mechanism for imparting energy from the motor to lead screw 170. According to one embodiment, feed motor 175 rotates a nut that, in turn, rotates lead screw 170, causing piston 165 to actuate. Dispense-stage pump 180 (“dispense pump 180”) can similarly include a dispense chamber 185, a dispense stage diaphragm 190, a piston 192, a lead screw 195, and a dispense motor 200. According to other embodiments, feed stage 105 and dispense stage 110 can each include a variety of other pumps including pneumatically actuated pumps, hydraulic pumps or other pumps. One example of a multi-stage pump using a pneumatically actuated pump for the feed stage and a stepper motor driven dispense pump is described in U.S. patent application Ser. No. 11/051,576, which is hereby fully incorporated by reference herein.


Feed motor 175 and dispense motor 200 can be any suitable motor. According to one embodiment, dispense motor 200 is a Permanent-Magnet Synchronous Motor (“PMSM”) with a position sensor 203. The PMSM can be controlled by a digital signal processor (“DSP”) utilizing Field-Oriented Control (“FOC”) at motor 200, a controller onboard multi-stage pump 100 or a separate pump controller (e.g. as shown in FIG. 1). Position sensor 203 can be an encoder (e.g., a fine line rotary position encoder) for real time feedback of motor 200's position. The use of position sensor 203 gives accurate and repeatable control of the position of piston 192, which leads to accurate and repeatable control over fluid movements in dispense chamber 185. For, example, using a 2000 line encoder, it is possible to accurately measure to and control at 0.045 degrees of rotation. In addition, a PMSM can run at low velocities with little or no vibration. Feed motor 175 can also be a PMSM or a stepper motor.


The valves of multi-stage pump 100 are opened or closed to allow or restrict fluid flow to various portions of multi-stage pump 100. According to one embodiment, these valves can be pneumatically actuated (i.e., gas driven) diaphragm valves that open or close depending on whether pressure or a vacuum is asserted. However, in other embodiments of the invention, any suitable valve can be used.


In operation, the dispense cycle multi-stage pump 100 can include a ready segment, dispense segment, fill segment, pre-filtration segment, filtration segment, vent segment, purge segment and static purge segment. Additional segments can also be included to account for delays in valve openings and closings. In other embodiments the dispense cycle (i.e., the series of segments between when multi-stage pump 100 is ready to dispense to a wafer to when multi-stage pump 100 is again ready to dispense to wafer after a previous dispense) may require more or fewer segments and various segments can be performed in different orders. During the feed segment, inlet valve 125 is opened and feed stage pump 150 moves (e.g., pulls) feed stage diaphragm 160 to draw fluid into feed chamber 155. Once a sufficient amount of fluid has filled feed chamber 155, inlet valve 125 is closed. During the filtration segment, feed-stage pump 150 moves feed stage diaphragm 160 to displace fluid from feed chamber 155. Isolation valve 130 and barrier valve 135 are opened to allow fluid to flow through filter 120 to dispense chamber 185. Isolation valve 130, according to one embodiment, can be opened first (e.g., in the “pre-filtration segment”) to allow pressure to build in filter 120 and then barrier valve 135 opened to allow fluid flow into dispense chamber 185. Furthermore, pump 150 can assert pressure on the fluid before pump 180 retracts, thereby also causing the pressure to build.


At the beginning of the vent segment, isolation valve 130 is opened, barrier valve 135 closed and vent valve 145 opened. In another embodiment, barrier valve 135 can remain open during the vent segment and close at the end of the vent segment. Feed-stage pump 150 applies pressure to the fluid to remove air bubbles from filter 120 through open vent valve 145 by forcing fluid out the vent. Feed-stage pump 150 can be controlled to cause venting to occur at a predefined rate, allowing for longer vent times and lower vent rates, thereby allowing for accurate control of the amount of vent waste.


At the beginning of the purge segment, isolation valve 130 is closed, barrier valve 135, if it is open in the vent segment, is closed, vent valve 145 closed, and purge valve 140 opened. Dispense pump 180 applies pressure to the fluid in dispense chamber 185. The fluid can be routed out of multi-stage pump 100 or returned to the fluid supply or feed-pump 150. During the static purge segment, dispense pump 180 is stopped, but purge valve 140 remains open to relieve pressure built up during the purge segment. Any excess fluid removed during the purge or static purge segments can be routed out of multi-stage pump 100 (e.g., returned to the fluid source or discarded) or recycled to feed-stage pump 150. During the ready segment, all the valves can be closed.


During the dispense segment, outlet valve 147 opens and dispense pump 180 applies pressure to the fluid in dispense chamber 185. Because outlet valve 147 may react to controls more slowly than dispense pump 180, outlet valve 147 can be opened first and some predetermined period of time later dispense motor 200 started. This prevents dispense pump 180 from pushing fluid through a partially opened outlet valve 147. In other embodiments, the pump can be started before outlet valve 147 is opened or outlet valve 147 can be opened and dispense begun by dispense pump 180 simultaneously.


An additional suckback segment can be performed in which excess fluid in the dispense nozzle is removed by pulling the fluid back. During the suckback segment, outlet valve 147 can close and a secondary motor or vacuum can be used to suck excess fluid out of the outlet nozzle. Alternatively, outlet valve 147 can remain open and dispense motor 200 can be reversed to such fluid back into the dispense chamber. The suckback segment helps prevent dripping of excess fluid onto the wafer.



FIGS. 3A-3G provide diagrammatic representations of multi-stage pump 100 during various segments of operation in which multi-stage pump 100 does not compensate for hold up volume. For the sake of example, it is assumed that dispense pump 180 and feed pump 150 each have a 20 mL maximum available capacity, the dispense process dispenses 4 mL of fluid, the vent segment vents 0.5 mL of fluid and the purge segment (including static purge) purges 1 mL of fluid and the suckback volume is 1 mL. During the ready segment (FIG. 3A), isolation valve 130 and barrier valve 135 are open while inlet valve 125, vent valve 145, purge valve 140 and outlet valve 147 are closed. Dispense pump 180 will be near its maximum volume (e.g., 19 mL) (i.e., the maximum volume minus the 1 mL purged from the previous cycle). During the dispense segment (FIG. 3B), isolation valve 130, barrier valve 135, purge valve 140, vent valve 145 and inlet valve 125 are closed and outlet valve 147 is opened. Dispense pump 180 dispenses a predefined amount of fluid (e.g., 4 mL). In this example, at the end of the dispense segment, dispense pump 180 will have a volume of 15 mL.


During the suckback segment (FIG. 3C), some of the fluid (e.g., 1 mL) dispensed during the dispense segment can be sucked back into dispense pump 180 to clear the dispense nozzle. This can be done, for example, by reversing the dispense motor. In other embodiments, the additional 1 mL of fluid can be removed from the dispense nozzle by a vacuum or another pump. Using the example in which the 1 mL is sucked back into dispense pump 180, after the suckback segment, dispense pump 180 will have a volume of 16 mL.


In the feed segment (FIG. 3D), outlet valve 147 is closed and inlet valve 125 is opened. Feed pump 150, in prior system, fills with fluid to its maximum capacity (e.g., 20 mL). During the filtration segment, inlet valve 125 is closed and isolation valve 130 and barrier valve 135 opened. Feed pump 150 pushes fluid out of feed pump 150 through filter 120, causing fluid to enter dispense pump 180. In prior systems, dispense pump 180 is filled to its maximum capacity (e.g., 20 mL) during this segment. During the dispense segment and continuing with the previous example, feed pump 150 will displace 4 mL of fluid to cause dispense pump 180 to fill from 16 mL (the volume at the end of the suckback segment) to 20 mL (dispense pump 180's maximum volume). This will leave feed pump 150 with 16 mL of volume.


During the vent segment (FIG. 3F), barrier valve 135 can be closed or open and vent valve 145 is open. Feed pump 150 displaces a predefined amount of fluid (e.g., 0.5 mL) to force excess fluid or gas bubbles accumulated at filter 120 out vent valve 145. Thus, at the end of the vent segment, in this example, feed pump 150 is at 15.5 mL.


Dispense pump 180, during the purge segment (FIG. 3G) can purge a small amount of fluid (e.g., 1 mL) through open purge valve 140. The fluid can be sent to waste or re-circulated. At the end of the purge segment, multi-stage pump 100 is back to the ready segment, with the dispense pump at 19 mL.


In the example of FIGS. 3A-3G, dispense pump 180 only uses 5 mL of fluid, 4 mL for the dispense segment (1 mL of which is recovered in suckback) and 1 mL for the purge segment. Similarly, feed pump 150 only uses 4 mL to recharge dispense pump 180 in the filtration segment (4 mL to recharge for the dispense segment minus 1 mL recovered during suckback plus 1 mL to recharge for the purge segment) and 0.5 mL in the vent segment. Because both feed pump 150 and dispense pump 180 are filled to their maximum available volume (e.g., 20 mL each) there is a relatively large hold-up volume. Feed pump 150, for example, has a hold-up volume of 15.5 mL and dispense pump 180 has a hold-up volume of 15 mL, for a combined hold-up volume of 30.5 mL.


The hold-up volume is slightly reduced if fluid is not sucked back into the dispense pump during the suckback segment. In this case, the dispense pump 180 still uses 5 mL of fluid, 4 mL during the dispense segment and 1 mL during the purge segment. However, feed pump 150, using the example above, must recharge the 1 mL of fluid that is not recovered during suckback. Consequently feed pump 150 will have to recharge dispense pump 180 with 5 mL of fluid during the filtration segment. In this case feed pump 150 will have a hold-up volume of 14.5 mL and dispense pump 180 will have a hold up volume of 15 mL.


Embodiments of the invention reduce wasted fluid by reducing the hold-up volume. According to embodiments of the invention, the home position of the feed and dispense pumps can be defined such that the fluid capacity of the dispense pump is sufficient to handle a given “recipe” (i.e., a set of factors affecting the dispense operation including, for example, a dispense rate, dispense time, purge volume, vent volume or other factors that affect the dispense operation), a given maximum recipe or a given set of recipes. The home position of a pump is then defined as the position of the pump that has the greatest available volume for a given cycle. For example, the home position can be the diaphragm position that gives a greatest allowable volume during a dispense cycle. The available volume corresponding to the home position of the pump will typically be less than the maximum available volume for the pump.


Using the example above, given the recipe in which the dispense segment uses 4 mL of fluid, the purge segment 1 mL, the vent segment 0.5 mL and the suckback segment recovers 1 mL of fluid, the maximum volume required by the dispense pump is:

VDmax=VD+VP+e1  [EQN 1]

    • VDMax=maximum volume required by dispense pump
    • VD=volume dispensed during dispense segment
    • VP=volume purged during purge segment
    • e1=an error volume applied to dispense pump


and the maximum volume required by feed pump 150 is:

VFmax=VD+VP+Vv−Vsuckback+e2  [EQN 2]

    • VFMax=maximum volume required by dispense pump
    • VD=volume dispensed during dispense segment
    • VP=volume purged during purge segment
    • Vv=volume vented during vent segment
    • Vsuckback=volume recovered during suckback
    • e2=error volume applied to feed pump


Assuming no error volumes are applied and using the example above, VDMax=4+1=5 mL and VF max=4+1+0.5−1=4.5 mL. In cases in which dispense pump 180 does not recover fluid during suckback, the Vsuckback term can be set to 0 or dropped. e1 and e2 can be zero, a predefined volume (e.g., 1 mL), calculated volumes or other error factor. e1 and e2 can have the same value or different values (assumed to be zero in the previous example).


Returning to FIGS. 3A-3G, and using the example of VDmax=5 mL and VFmax=4.5 mL, during the ready segment (FIG. 3A), dispense pump 180 will have a volume of 4 mL and feed pump 150 will have a volume of 0 mL. Dispense pump 180, during the dispense segment (FIG. 3B), dispenses 4 mL of fluid and recovers 1 mL during the suckback segment (FIG. 3C). During the feed segment (FIG. 3D), feed pump 150 recharges to 4.5 mL. During the filtration segment (FIG. 3E), feed pump 150 can displace 4 mL of fluid causing dispense pump 180 to fill to 5 mL of fluid. Additionally, during the vent segment, feed pump 150 can vent 0.5 mL of fluid (FIG. 3F). Dispense pump 180, during the purge segment (FIG. 3G) can purge 1 mL of fluid to return to the ready segment. In this example, there is no hold-up volume as all the fluid in the feed segment and dispense segment is moved.


For a pump that is used with several different dispense recipes, the home position, of the dispense pump and feed pump can be selected as the home position that can handle the largest recipe. Table 1, below, provides example recipes for a multi-stage pump.











TABLE 1






RECIPE 1
RECIPE 2



















Name:
Main Dispense 1
Main Dispense 2













Dispense Rate
1.5
mL/sec
1
mL/sec



Dispense Time
2
sec
2.5
sec



Resulting Volume
3
mL
2.5
mL



Purge
0.5
mL
0.5
mL



Vent
0.25
mL
0.25
mL



Predispense Rate
1
mL/sec
0.5
mL/sec



Predispense Volume
1
mL
0.5
mL









In the above examples, it is assumed that no fluid is recovered during suckback. It is also assumed that there is a pre-dispense cycle in which a small amount of fluid is dispensed from the dispense chamber. The pre-dispense cycle can be used, for example, to force some fluid through the dispense nozzle to clean the nozzle. According to one embodiment the dispense pump is not recharged between a pre-dispense and a main dispense. In this case:

VD=VDPre+VDMain  [EQN. 3]

    • VDPre=amount of pre-dispense dispense
    • VDMain=amount of main dispense


Accordingly, the home position of the dispense diaphragm can be set for a volume of 4.5 mL (3+1+0.5) and the home position of the feed pump can be set to 4.75 mL (3+1+0.5+0.25). With these home positions, dispense pump 180 and feed pump 150 will have sufficient capacity for Recipe 1 or Recipe 2.


According to another embodiment, the home position of the dispense pump or feed pump can change based on the active recipe or a user-defined position. If a user adjusts a recipe to change the maximum volume required by the pump or the pump adjusts for a new active recipe in a dispense operation, say by changing Recipe 2 to require 4 mL of fluid, the dispense pump (or feed pump) can be adjusted manually or automatically. For example, the dispense pump diaphragm position can move to change the capacity of the dispense pump from 3 mL to 4 mL and the extra 1 mL of fluid can be added to the dispense pump. If the user specifies a lower volume recipe, say changing Recipe 2 to only require 2.5 mL of fluid, the dispense pump can wait until a dispense is executed and refill to the new lower required capacity.


The home position of the feed pump or dispense pump can also be adjusted to compensate for other issues such as to optimize the effective range of a particular pump. The maximum and minimum ranges for a particular pump diaphragm (e.g., a rolling edge diaphragm, a flat diaphragm or other diaphragm known in the art) can become nonlinear with displacement volume or force to drive the diaphragm because the diaphragm can begin to stretch or compress for example. The home position of a pump can be set to a stressed position for a large fluid capacity or to a lower stress position where the larger fluid capacity is not required. To address issues of stress, the home position of the diaphragm can be adjusted to position the diaphragm in an effective range.


As an example, dispense pump 180 that has a 10 mL capacity may have an effective range between 2 and 8 mL. The effective range can be defined as the linear region of a dispense pump where the diaphragm does not experience significant loading. FIGS. 4A-C provide diagrammatic representations of three examples of setting the home position of a dispense diaphragm (e.g., dispense diaphragm 190 of FIG. 2) for a 10 mL pump having a 6 mL effective range between 2 mL and 8 mL. It should be noted that in these examples, 0 mL indicates a diaphragm position that would cause the dispense pump to have a 10 mL available capacity and a 10 mL position would cause the dispense pump to have a 0 mL capacity. In other words, the 0 mL-10 mL scale refers to the displaced volume.



FIG. 4A provides a diagrammatic representation of the home positions for a pump that runs recipes having a VDmax=3 mL maximum volume and a VDmax=1.5 mL maximum volume for a pump that has a 6 mL non-stressed effective range (e.g., between 8 mL and 2 mL). In this example, the diaphragm of the dispense pump can be set so that the volume of the dispense pump is 5 mL (represented at 205). This provides sufficient volume for the 3 mL dispense process while not requiring use of 0 mL to 2 mL or 8 mL to 10 mL region that causes stress. In this example, the 2 mL volume of the lower-volume less effective region (i.e., the less effective region in which the pump has a lower available volume) is added to the largest VDmax for the pump such that the home position is 3 mL+2 mL=5 mL. Thus, the home position can account for the non-stressed effective region of the pump.



FIG. 4B provides a diagrammatic representation of a second example. In this second example, the dispense pump runs an 8 mL maximum volume dispense process and a 3 mL maximum volume dispense process. In this case, some of the less effective region must be used. Therefore, the diaphragm home position can be set to provide a maximum allowable volume of 8 mL (represented at 210) for both processes (i.e., can be set at a position to allow for 8 mL of fluid). In this case, the smaller volume dispense process will occur entirely within the effective range.


In the example of FIG. 4B, the home position is selected to utilize the lower-volume less effective region (i.e., the less-effective region that occurs when the pump is closer to empty). In other embodiments, the home position can be in the higher-volume less effective region. However, this will mean that part of the lower volume dispense will occur in the less-effective region and, in the example of FIG. 4B, there will be some hold-up volume.


In the third example of FIG. 4C, the dispense pump runs a 9 mL maximum volume dispense process and a 4 mL maximum volume dispense process. Again, a portion of the process will occur in the less effective range. The dispense diaphragm, in this example, can be set to a home position to provide a maximum allowable volume of 9 mL (e.g., represented at 215). If, as described above, the same home position is used for each recipe, a portion of the 4 mL dispense process will occur in the less effective range. According to other embodiments, the home position can reset for the smaller dispense process into the effective region.


In the above examples, there is some hold-up volume for the smaller volume dispense processes to prevent use of the less effective region in the pump. The pump can be setup so that the pump only uses the less effective region for larger volume dispense processes where flow precision is less critical. These features make it possible to optimize the combination of (i) low volume with higher precision and (ii) high volume with lower precision. The effective range can then be balanced with the desired hold-up volume.


As discussed in conjunction with FIG. 2, dispense pump 180 can include a dispense motor 200 with a position sensor 203 (e.g., a rotary encoder). Position sensor 203 can provide feedback of the position of lead screw 195 and, hence, the position of lead screw 195 will correspond to a particular available volume in dispense chamber 185 as the lead screw displaces diaphragm. Consequently, the pump controller can select a position for the lead screw such that the volume in the dispense chamber is at least VDmax.


According to another embodiment, the home position can be user selected or user programmed. For example, using a graphical user interface or other interface, a user can program a user selected volume that is sufficient to carry out the various dispense processes or active dispense process by the multi-stage pump. According to one embodiment, if the user selected volume is less than VDispense+VPurge, an error can be returned. The pump controller (e.g., pump controller 20) can add an error volume to the user specified volume. For example, if the user selects 5 cc as the user specified volume, pump controller 20 can add 1 cc to account for errors. Thus, pump controller will select a home position for dispense pump 180 that has corresponding available volume of 6 cc.


This can be converted into a corresponding lead screw position that can be stored at pump controller 20 or an onboard controller. Using the feedback from position sensor 203, dispense pump 180 can be accurately controlled such that at the end of the filtration cycle, dispense pump 180 is at its home position (i.e., its position having the greatest available volume for the dispense cycle). It should be noted that feed pump 150 can be controlled in a similar manner using a position sensor.


According to another embodiment, dispense pump 180 and/or feed pump 150 can be driven by a stepper motor without a position sensor. Each step or count of a stepper motor will correspond to a particular displacement of the diaphragm. Using the example of FIG. 2, each count of dispense motor 200 will displace dispense diaphragm 190 a particular amount and therefore displace a particular amount of fluid from dispense chamber 185. If CfullstrokeD is the counts to displace dispense diaphragm from the position in which dispense chamber 185 has its maximum volume (e.g., 20 mL) to 0 mL (i.e., the number of counts to move dispense diaphragm 190 through its maximum range of motion), CP is the number of counts to displace VP and CD is the number of counts to displace VD, then the home position of stepper motor 200 can be:

CHomeD=CfullstrokeD−(CP+CD+Ce1)  [EQN 3]


where Ce1 is a number of counts corresponding to an error volume.


Similarly, if CfullstrokeF is the counts to displace feed diaphragm 160 from the position in which dispense chamber 155 has its maximum volume (e.g., 20 mL) to 0 mL (i.e., the number of counts to move dispense diaphragm 160 through its maximum range of motion), CS is the number of counts at the feed motor 175 corresponding to Vsuckback recovered at dispense pump 180 and CV is the number of counts at feed motor 175 to displace VV, the home position of feed motor 175 can be:

CHomeF=CfullstrokeF−(CP+CD−CS+Ce2)  [EQN 4]


where Ce2 is a number of counts corresponding to an error volume.



FIGS. 5A-5K provide diagrammatic representations of various segments for a multi-stage pump 500 according to another embodiment of the invention. Multi-stage pump 500, according to one embodiment, includes a feed stage pump 501 (“feed pump 501”), a dispense stage pump 502 (“dispense pump 502”), a filter 504, an inlet valve 506 and an outlet valve 508. Inlet valve 506 and outlet valve 508 can be three-way valves. As will be described below, this allows inlet valve 506 to be used both as an inlet valve and isolation valve and outlet valve 508 to be used as an outlet valve and purge valve.


Feed pump 501 and dispense pump 502 can be motor driven pumps (e.g., stepper motors, brushless DC motors or other motor). Shown at 510 and 512, respectively, are the motor positions for the feed pump 501 and dispense pump 502. The motor positions are indicated by the corresponding amount of fluid available in the feed chamber or dispense chamber of the respective pump. In the example of FIGS. 5A-5K, each pump has a maximum available volume of 20 cc. For each segment, the fluid movement is depicted by the arrows.



FIG. 5A is a diagrammatic representation of multi-stage pump 500 at the ready segment. In this example, feed pump 501 has a motor position that provides for 7 cc of available volume and dispense pump 502 has a motor position that provides for 6 cc of available volume. During the dispense segment (depicted in FIG. 5B), the motor of dispense pump 502 moves to displace 5.5 cc of fluid through outlet valve 508. The dispense pump recovers 0.5 cc of fluid during the suckback segment (depicted in FIG. 5C). During the purge segment (shown in FIG. 5D), dispense pump 502 displaces 1 cc of fluid through outlet valve 508. During the purge segment, the motor of dispense pump 502 can be driven to a hard stop (i.e., to 0 cc of available volume). This can ensure that the motor is backed the appropriate number of steps in subsequent segments.


In the vent segment (shown in FIG. 5E), feed pump 501 can push a small amount of fluid through filter 502. During the dispense pump delay segment (shown in FIG. 5F), feed pump 501 can begin pushing fluid to dispense pump 502 before dispense pump 502 recharges. This slightly pressurizes fluid to help fill dispense pump 502 and prevents negative pressure in filter 504. Excess fluid can be purged through outlet valve 508.


During the filtration segment (shown in FIG. 5G), outlet valve 508 is closed and fluid fills dispense pump 502. In the example shown, 6 cc of fluid is moved by feed pump 501 to dispense pump 502. Feed pump 501 can continue to assert pressure on the fluid after the dispense motor has stopped (e.g., as shown in the feed delay segment of FIG. 5H). In the example of FIG. 5H, there is approximately 0.5 cc of fluid left in feed pump 501. According to one embodiment, feed pump 501 can be driven to a hard stop (e.g., with 0 cc of available volume), as shown in FIG. 5I. During the feed segment (depicted in FIG. 5J), feed pump 501 is recharged with fluid and multi-stage pump 500 returns to the ready segment (shown in FIGS. 5K and 5A).


In the example of FIG. 5A-5K the purge segment occurs immediately after the suckback segment to bring dispense pump 502 to a hardstop, rather than after the vent segment as in the embodiment of FIG. 2. The dispense volume is 5.5 cc, the suckback volume 0.5 cc and purge volume 1 cc. Based on the sequence of segments, the largest volume required by dispense pump 502 is:

VDMax=VDispense+VPurge−VSuckback+e1  [EQN 5]


If dispense pump 502 utilizes a stepper motor, a specific number of counts will result in a displacement of VDMax. By backing the motor from a hardstop position (e.g., 0 counts) the number of counts corresponding to VDMax, dispense pump will have an available volume of VDMax.


For feed pump 501, VVent is 0.5 cc, and there is an additional error volume of 0.5 cc to bring feed pump 501 to a hardstop. According to EQN 2:

VFmax=5.5+1+0.5−0.5+0.5


In this example, VFMax is 7 cc. If feed pump 501 uses a stepper motor, the stepper motor, during the recharge segment can be backed from the hardstop position the number of counts corresponding to 7 cc. In this example, feed pump 501 utilized 7 cc of a maximum 20 cc and feed pump 502 utilized 6 cc of a maximum 20 cc, thereby saving 27 cc of hold-up volume.



FIG. 6 is a diagrammatic representation illustrating a user interface 600 for entering a user defined volume. In the example of FIG. 6, a user, at field 602, can enter a user defined volume, here 10.000 mL. An error volume can be added to this (e.g., 1 mL), such that the home position of the dispense pump has a corresponding available volume of 11 mL. While FIG. 6 only depicts setting a user selected volume for the dispense pump, the user, in other embodiments, can also select a volume for the feed pump.



FIG. 7 is a diagrammatic representation of one embodiment of a method for controlling a pump to reduce the hold-up volume. Embodiments of the invention can be implemented, for example, as software programming executable by a computer processor to control the feed pump and dispense pump.


At step 702, the user enters one or more parameters for a dispense operation, which may include multiple dispense cycles, including, for example, the dispense volume, purge volume, vent volume, user specified volumes for the dispense pump volume and/or feed pump and other parameters. The parameters can include parameters for various recipes for different dispense cycles. The pump controller (e.g., pump controller 20 of FIG. 1) can determine the home position of the dispense pump based on a user specified volume, dispense volume, purge volume or other parameter associated with the dispense cycle. Additionally, the choice of home position can be based on the effective range of motion of the dispense diaphragm. Similarly, the pump controller can determine the feed pump home position.


During a feed segment, the feed pump can be controlled to fill with a process fluid. According to one embodiment, the feed pump can be filled to its maximum capacity. According to another embodiment, the feed pump can be filled to a feed pump home position (step 704). During the vent segment the feed pump can be further controlled to vent fluid having a vent volume (step 706).


During the filtration segment, the feed pump is controlled to assert pressure on the process fluid to fill the dispense pump until the dispense pump reaches its home position. The dispense diaphragm in the dispense pump is moved until the dispense pump reaches the home position to partially fill the dispense pump (i.e., to fill the dispense pump to an available volume that is less than the maximum available volume of the dispense pump) (step 708). If the dispense pump uses a stepper motor, the dispense diaphragm can first be brought to a hard stop and the stepper motor reversed a number of counts corresponding to the dispense pump home position. If the dispense pump uses a position sensor (e.g., a rotary encoder), the position of the diaphragm can be controlled using feedback from the position sensor.


The dispense pump can then be directed purge a small amount of fluid (step 710). The dispense pump can be further controlled to dispense a predefined amount of fluid (e.g., the dispense volume) (step 712). The dispense pump can be further controlled to suckback a small amount of fluid or fluid can be removed from a dispense nozzle by another pump, vacuum or other suitable mechanism. It should be noted that steps of FIG. 7 can be performed in a different order and repeated as needed or desired.


While primarily discussed in terms of a multi-stage pump, embodiments of the invention can also be utilized in single stage pumps. FIG. 8 is a diagrammatic representation of one embodiment of a single stage pump 800. Single stage pump 800 includes a dispense pump 802 and filter 820 between dispense pump 802 and the dispense nozzle 804 to filter impurities from the process fluid. A number of valves can control fluid flow through single stage pump 800 including, for example, purge valve 840 and outlet valve 847.


Dispense pump 802 can include, for example, a dispense chamber 855 to collect fluid, a diaphragm 860 to move within dispense chamber 855 and displace fluid, a piston 865 to move dispense stage diaphragm 860, a lead screw 870 and a dispense motor 875. Lead screw 870 couples to motor 875 through a nut, gear or other mechanism for imparting energy from the motor to lead screw 870. According to one embodiment, feed motor 875 rotates a nut that, in turn, rotates lead screw 870, causing piston 865 to actuate. According to other embodiments, dispense pump 802 can include a variety of other pumps including pneumatically actuated pumps, hydraulic pumps or other pumps.


Dispense motor 875 can be any suitable motor. According to one embodiment, dispense motor 875 is a PMSM with a position sensor 880. The PMSM can be controlled by a DSP FOC at motor 875, a controller onboard pump 800 or a separate pump controller (e.g. as shown in FIG. 1). Position sensor 880 can be an encoder (e.g., a fine line rotary position encoder) for real time feedback of motor 875's position. The use of position sensor 880 gives accurate and repeatable control of the position of dispense pump 802.


The valves of single stage pump 800 are opened or closed to allow or restrict fluid flow to various portions of single stage pump 800. According to one embodiment, these valves can be pneumatically actuated (i.e., gas driven) diaphragm valves that open or close depending on whether pressure or a vacuum is asserted. However, in other embodiments of the invention, any suitable valve can be used.


In operation, the dispense cycle of single stage pump 100 can include a ready segment, filtration/dispense segment, vent/purge segment and static purge segment. Additional segments can also be included to account for delays in valve openings and closings. In other embodiments the dispense cycle (i.e., the series of segments between when single stage pump 800 is ready to dispense to a wafer to when single stage pump 800 is again ready to dispense to wafer after a previous dispense) may require more or fewer segments and various segments can be performed in different orders.


During the feed segment, inlet valve 825 is opened and dispense pump 802 moves (e.g., pulls) diaphragm 860 to draw fluid into dispense chamber 855. Once a sufficient amount of fluid has filled dispense chamber 855, inlet valve 825 is closed. During the dispense/filtration segment, pump 802 moves diaphragm 860 to displace fluid from dispense chamber 855. Outlet valve 847 is opened to allow fluid to flow through filter 820 out nozzle 804. Outlet valve 847 can be opened before, after or simultaneous to pump 802 beginning dispense.


At the beginning of the purge/vent segment, purge valve 840 is opened and outlet valve 847 closed. Dispense pump 802 applies pressure to the fluid to move fluid through open purge valve 840. The fluid can be routed out of single stage pump 800 or returned to the fluid supply or dispense pump 802. During the static purge segment, dispense pump 802 is stopped, but purge valve 140 remains open to relieve pressure built up during the purge segment.


An additional suckback segment can be performed in which excess fluid in the dispense nozzle is removed by pulling the fluid back. During the suckback segment, outlet valve 847 can close and a secondary motor or vacuum can be used to suck excess fluid out of the outlet nozzle 804. Alternatively, outlet valve 847 can remain open and dispense motor 875 can be reversed to suck fluid back into the dispense chamber. The suckback segment helps prevent dripping of excess fluid onto the wafer.


It should be noted that other segments of a dispense cycle can also be performed and the single stage pump is not limited to performing the segments described above in the order described above. For example, if dispense motor 875 is a stepper motor, a segment can be added to bring the motor to a hard stop before the feed segment. Moreover, the combined segments (e.g., purge/vent) can be performed as separate segments. According to other embodiments, the pump may not perform the suckback segment. Additionally, the single stage pump can have different configurations. For example, the single stage pump may not include a filter or rather than having a purge valve, can have a check valve for outlet valve 147.


According to one embodiment of the invention, during the fill segment, dispense pump 802 can be filled to home position such that dispense chamber 855 has sufficient volume to perform each of the segments of the dispense cycle. In the example given above, the available volume corresponding to the home position would be at least the dispense volume plus the purge volume (i.e., the volume released during the purge/vent segment and static purge segment). Any suckback volume recovered into dispense chamber 855 can be subtracted from the dispense volume and purge volume. As with the multi-stage pump, the home position can be determined based on one or more recipes or a user specified volume. The available volume corresponding to the dispense pump home position is less than the maximum available volume of the dispense pump and is the greatest available volume for the dispense pump in a dispense cycle.


While the invention has been described with reference to particular embodiments, it should be understood that the embodiments are illustrative and that the scope of the invention is not limited to these embodiments. Many variations, modifications, additions and improvements to the embodiments described above are possible. It is contemplated that these variations, modifications, additions and improvements fall within the scope of the invention as detailed in the following claims.

Claims
  • 1. A pumping system, comprising: a pump having a chamber and a diaphragm, the chamber having a fluid capacity; anda pump controller coupled to the pump, the pump controller being operable to: determine a position for the diaphragm in the chamber based on a set of factors affecting a dispense operation, the set of factors comprising a dispense volume and a desired hold-up volume; andprior to dispensing a fluid from the pumping system, control the pump to move the diaphragm in the chamber to the position that has been determined based on the set of factors affecting the dispense operation, the position of the diaphragm in the chamber defining a maximum volume in the chamber for a dispense cycle, wherein the maximum volume in the chamber for the dispense cycle includes the dispense volume and the desired hold-up volume and wherein the maximum volume in the chamber for the dispense cycle is less than the fluid capacity of the chamber.
  • 2. The pumping system of claim 1, wherein the pump is a single stage pump.
  • 3. The pumping system of claim 1, wherein the pump is a multi-stage pump.
  • 4. The pumping system of claim 1, wherein the pump is a dispense pump.
  • 5. The pumping system of claim 4, further comprising a feed pump having a feed chamber and a feed stage diaphragm to move within the feed chamber, a piston to move the feed stage diaphragm, and a feed motor to drive the piston, the feed motor being controlled by the pump controller.
  • 6. The pumping system of claim 1, wherein the pump is a feed pump.
  • 7. The pumping system of claim 6, further comprising a dispense pump having a dispense chamber and a dispense stage diaphragm to move within the dispense chamber, a piston to move the dispense stage diaphragm, and a dispense motor to drive the piston, the dispense motor being controlled by the pump controller.
  • 8. The pumping system of claim 1, wherein the set of factors affecting the dispense operation further comprises an error volume, a dispense rate, dispense time, a purge volume, a suckback volume, a vent volume, a predispense rate, a predispense volume, an effective range of the pump, a user defined volume, or a combination thereof.
  • 9. The pumping system of claim 1, wherein the set of factors affecting the dispense operation further comprises a number of counts to displace the dispense volume, each count corresponding to a displacement of the diaphragm.
  • 10. The pumping system of claim 1, wherein the pump is controlled by the pump controller to move the diaphragm in the chamber to the position after a filtration cycle has ended.
  • 11. The pumping system of claim 1, wherein the pump further comprises a motor and wherein the diaphragm is driven by the motor, the motor being controlled by the pump controller.
  • 12. The pumping system of claim 11, wherein the pump further comprises a position sensor, the motor being controlled by the pump controller utilizing real time feedback from the position sensor.
  • 13. A method for reducing a hold-up volume of a pump, comprising: determining a position for a diaphragm in a chamber of the pump based on a set of factors affecting a dispense operation, the set of factors comprising a dispense volume and a desired hold-up volume, the chamber having a fluid capacity; andprior to dispensing a fluid, controlling the pump to move the diaphragm in the chamber to the position that has been determined based on the set of factors affecting the dispense operation, the position of the diaphragm in the chamber defining a maximum volume in the chamber for a dispense cycle, wherein the maximum volume in the chamber for the dispense cycle includes the dispense volume and the desired hold-up volume and wherein the maximum volume in the chamber for the dispense cycle is less than the fluid capacity of the chamber.
  • 14. The method of claim 13, wherein the desired hold-up volume corresponds to a volume of the pump that is outside an effective range of the pump.
  • 15. The method of claim 13, wherein the pump is a single stage pump.
  • 16. The method of claim 13, wherein the pump is a multi-stage pump.
  • 17. The method of claim 13, wherein the set of factors affecting the dispense operation further comprises an error volume, a dispense rate, dispense time, a purge volume, a suckback volume, a vent volume, a predispense rate, a predispense volume, an effective range of the pump, a user defined volume, or a combination thereof.
  • 18. The method of claim 13, wherein the set of factors affecting the dispense operation further comprises a number of counts to displace the dispense volume, each count corresponding to a displacement of the diaphragm.
  • 19. The method of claim 13, wherein the pump is controlled by the pump controller to move the diaphragm in the chamber to the position after a filtration cycle has ended.
  • 20. The method of claim 13, wherein the pump further comprises a motor and a position sensor, and wherein the diaphragm is driven by the motor, the motor being controlled by the pump controller utilizing real time feedback from the position sensor.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims a benefit of priority under 35 U.S.C. §120 to U.S. patent application Ser. No. 11/666,124, filed Apr. 24, 2007, now allowed, entitled “SYSTEM AND METHOD FOR A VARIABLE HOME POSITION DISPENSE SYSTEM,” which claims priority under 35 U.S.C. §371 to International Application No. PCT/US2005/042127, filed Nov. 21, 2005, entitled “SYSTEM AND METHOD FOR A VARIABLE HOME POSITION DISPENSE SYSTEM,” which claims the benefit and priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 60/630,384, filed Nov. 23, 2004, entitled “SYSTEM AND METHOD FOR A VARIABLE HOME POSITION DISPENSE SYSTEM.” All applications referenced in this paragraph are hereby fully incorporated by reference herein.

US Referenced Citations (232)
Number Name Date Kind
269626 Bodel et al. Dec 1882 A
826018 Concoff Jul 1906 A
1664125 Lowrey Mar 1928 A
2153664 Freedlander Apr 1939 A
2215505 Hollander Sep 1940 A
2328468 Laffly Aug 1943 A
2457384 Krenz Dec 1948 A
2631538 Johnson Mar 1953 A
2673522 Dickey Mar 1954 A
2757966 Samiran Aug 1956 A
3072058 Christopher et al. Jan 1963 A
3227279 Bockelman Jan 1966 A
3250225 Taplin May 1966 A
3327635 Sachnik Jun 1967 A
3623661 Wagner Nov 1971 A
3741298 Canton Jun 1973 A
3895748 Klingenberg Jul 1975 A
3954352 Sakai May 1976 A
4023592 Patzke May 1977 A
4093403 Schrimpf Jun 1978 A
4420811 Tarnay et al. Dec 1983 A
4452265 Lonnebring Jun 1984 A
4475818 Bialkowski Oct 1984 A
4483665 Hauser Nov 1984 A
4541455 Hauser Sep 1985 A
4597719 Tano Jul 1986 A
4597721 Santefort Jul 1986 A
4601409 DiRegolo Jul 1986 A
4614438 Kobayashi Sep 1986 A
4671545 Miyazaki Jun 1987 A
4690621 Swain Sep 1987 A
4705461 Clements Nov 1987 A
4739923 Tsutsui et al. Apr 1988 A
4797834 Honganen et al. Jan 1989 A
4808077 Kan et al. Feb 1989 A
4810168 Nogami et al. Mar 1989 A
4821997 Zdeblick Apr 1989 A
4824073 Zdeblick Apr 1989 A
4865525 Kern Sep 1989 A
4875623 Garris Oct 1989 A
4913624 Seki et al. Apr 1990 A
4915126 Gyllinder Apr 1990 A
4915160 Reynolds Apr 1990 A
4943032 Zdeblick Jul 1990 A
4950134 Bailey et al. Aug 1990 A
4952386 Davison Aug 1990 A
4966646 Zdeblick Oct 1990 A
4969598 Garris Nov 1990 A
5050062 Hass Sep 1991 A
5061156 Kuehne Oct 1991 A
5061574 Henager, Jr. Oct 1991 A
5062770 Story Nov 1991 A
5134962 Amada Aug 1992 A
5135031 Burgess Aug 1992 A
5167837 Snodgrass Dec 1992 A
5170361 Reed Dec 1992 A
5192198 Gebauer Mar 1993 A
5230445 Rusnak Jul 1993 A
5261442 Kingsford Nov 1993 A
5262068 Bowers Nov 1993 A
5312233 Tanny et al. May 1994 A
5316181 Burch May 1994 A
5318413 Bertoncini Jun 1994 A
5332311 Volk, Jr. et al. Jul 1994 A
5336884 Khoshnevisan et al. Aug 1994 A
5344195 Parimore, Jr. et al. Sep 1994 A
5350200 Peterson et al. Sep 1994 A
5380019 Hillery Jan 1995 A
5434774 Seberger Jul 1995 A
5476004 Kingsford Dec 1995 A
5490765 Bailey Feb 1996 A
5511797 Nikirk Apr 1996 A
5516429 Snodgrass May 1996 A
5527161 Bailey Jun 1996 A
5546009 Raphael Aug 1996 A
5575311 Kingsford Nov 1996 A
5580103 Hall Dec 1996 A
5599100 Jackson et al. Feb 1997 A
5599394 Yabe Feb 1997 A
5645301 Kingsford Jul 1997 A
5652391 Kingsford Jul 1997 A
5653251 Handler Aug 1997 A
5743293 Kelly Apr 1998 A
5762795 Bailey Jun 1998 A
5772899 Snodgrass Jun 1998 A
5784573 Szczepanek et al. Jul 1998 A
5785508 Bolt Jul 1998 A
5793754 Houldsworth et al. Aug 1998 A
5839828 Glanville Nov 1998 A
5846056 Dhindsa et al. Dec 1998 A
5848605 Bailey Dec 1998 A
RE36178 Freudinger et al. Apr 1999 E
5947702 Biederstadt Sep 1999 A
5971723 Bolt Oct 1999 A
5991279 Haugli et al. Nov 1999 A
6033302 Ahmed et al. Mar 2000 A
6045331 Gehm et al. Apr 2000 A
6105829 Snodgrass Aug 2000 A
6190565 Bailey Feb 2001 B1
6203759 Pelc et al. Mar 2001 B1
6210745 Gaughan et al. Apr 2001 B1
6238576 Yajima May 2001 B1
6250502 Cote Jun 2001 B1
6251293 Snodgrass Jun 2001 B1
6298941 Spadafora Oct 2001 B1
6302660 Kurita Oct 2001 B1
6318971 Ota Nov 2001 B1
6319317 Takamori Nov 2001 B1
6325032 Sekiya et al. Dec 2001 B1
6325932 Gibson Dec 2001 B1
6330517 Dobrowskli Dec 2001 B1
6348098 McLoughlin et al. Feb 2002 B1
6348124 Garbett Feb 2002 B1
6474949 Arai et al. Nov 2002 B1
6474950 Waldo Nov 2002 B1
6478547 Savard Nov 2002 B1
6497817 Liang Dec 2002 B1
6506030 Kottke Jan 2003 B1
6520519 Howard Feb 2003 B2
6540265 Turk Apr 2003 B2
6554579 Martin Apr 2003 B2
6572255 Husher Jun 2003 B2
6575264 Spadafora Jun 2003 B2
6592825 Pelc Jul 2003 B2
6635183 Gibson Oct 2003 B2
6722530 King et al. Apr 2004 B1
6729501 Peterson May 2004 B2
6742992 Davis Jun 2004 B2
6742993 Savard Jun 2004 B2
6766810 Van Cleemput Jul 2004 B1
6767877 Kuo Jul 2004 B2
6837484 Kingsford Jan 2005 B2
6901791 Frenz et al. Jun 2005 B1
6923568 Wilmer et al. Aug 2005 B2
6925072 Grohn Aug 2005 B1
6952618 Davlin et al. Oct 2005 B2
7013223 Zhang et al. Mar 2006 B1
7029238 Zagars et al. Apr 2006 B1
7063785 Hiraku et al. Jun 2006 B2
7083202 Eberle et al. Aug 2006 B2
7156115 Everett et al. Jan 2007 B2
7175397 Claude et al. Feb 2007 B2
7247245 Proulx et al. Jul 2007 B1
7249628 Pillion et al. Jul 2007 B2
7272452 Coogan et al. Sep 2007 B2
7383967 Gibson Jun 2008 B2
7454317 Karasawa Nov 2008 B2
7476087 Zagars et al. Jan 2009 B2
7494265 Niermeyer et al. Feb 2009 B2
7547049 Gashgaee Jun 2009 B2
7660648 Dykstra Feb 2010 B2
7684446 McLoughlin Mar 2010 B2
7878765 Gonnella et al. Feb 2011 B2
7897196 Cedrone et al. Mar 2011 B2
8025486 Gonnella et al. Sep 2011 B2
8029247 Cedrone et al. Oct 2011 B2
8083498 Gonnella et al. Dec 2011 B2
8087429 Cedrone et al. Jan 2012 B2
8172546 Cedrone et al. May 2012 B2
8292598 Laverdiere et al. Oct 2012 B2
8322994 Claude et al. Dec 2012 B2
8382444 Gonnella et al. Feb 2013 B2
8651823 Cedrone et al. Feb 2014 B2
8662859 Gonnella et al. Mar 2014 B2
8678775 Gonnella et al. Mar 2014 B2
8753097 Cedrone et al. Jun 2014 B2
20010000865 Gaughan et al. May 2001 A1
20010014477 Pelc Aug 2001 A1
20020044536 Izumi et al. Apr 2002 A1
20020095240 Sickinger Jul 2002 A1
20030033052 Hillen et al. Feb 2003 A1
20030040881 Steger Feb 2003 A1
20030062382 Savard et al. Apr 2003 A1
20030148759 Leliveid Aug 2003 A1
20030222798 Floros Dec 2003 A1
20040041854 Saito et al. Mar 2004 A1
20040050771 Gibson Mar 2004 A1
20040057334 Wilmer et al. Mar 2004 A1
20040072450 Collins Apr 2004 A1
20040076526 Fukano et al. Apr 2004 A1
20040133728 Ellerbrock et al. Jul 2004 A1
20040172229 Aragones et al. Sep 2004 A1
20040208750 Masuda Oct 2004 A1
20040265151 Bertram Dec 2004 A1
20050025634 Bernard et al. Feb 2005 A1
20050042127 Ohtsuka et al. Feb 2005 A1
20050061722 Takao et al. Mar 2005 A1
20050113941 Ii et al. May 2005 A1
20050126985 Campbell Jun 2005 A1
20050151802 Neese et al. Jul 2005 A1
20050173458 Hiranaga et al. Aug 2005 A1
20050173463 Wesner Aug 2005 A1
20050182497 Nakano Aug 2005 A1
20050184087 Zagars Aug 2005 A1
20050197722 Varone et al. Sep 2005 A1
20050232296 Schultze et al. Oct 2005 A1
20050238497 Holst Oct 2005 A1
20050244276 Pfister et al. Nov 2005 A1
20060015294 Yetter et al. Jan 2006 A1
20060070960 Gibson Apr 2006 A1
20060083259 Metcalf et al. Apr 2006 A1
20060184264 Willis et al. Aug 2006 A1
20060257707 Kaschmitter et al. Nov 2006 A1
20070104586 Cedrone May 2007 A1
20070125796 Cedrone Jun 2007 A1
20070125797 Cedrone Jun 2007 A1
20070126233 Gashgaee Jun 2007 A1
20070127511 Cedrone Jun 2007 A1
20070128046 Gonella Jun 2007 A1
20070128047 Gonella Jun 2007 A1
20070128048 Gonella Jun 2007 A1
20070128050 Cedrone Jun 2007 A1
20070206436 Niermeyer et al. Sep 2007 A1
20070217442 McLoughlin Sep 2007 A1
20070251596 Scherzer et al. Nov 2007 A1
20070254092 Lin et al. Nov 2007 A1
20080036985 Clark et al. Feb 2008 A1
20080089361 Metcalf et al. Apr 2008 A1
20080131290 Magoon et al. Jun 2008 A1
20090047143 Cedrone Feb 2009 A1
20090116334 Niermeyer et al. May 2009 A1
20090132094 Laverdiere et al. May 2009 A1
20090157229 Rulkens et al. Jun 2009 A1
20110051576 Ashizawa et al. Mar 2011 A1
20110098864 Gonnella et al. Apr 2011 A1
20120057990 Cedrone et al. Mar 2012 A1
20120070311 Cedrone et al. Mar 2012 A1
20120070313 Gonnella et al. Mar 2012 A1
20120091165 Cedrone et al. Apr 2012 A1
20130004340 Gonnella et al. Jan 2013 A1
20140044570 Cedrone et al. Feb 2014 A1
20140127034 Gonnella et al. May 2014 A1
Foreign Referenced Citations (83)
Number Date Country
B-7887287 Apr 1988 AU
1 271 140 Jul 1990 CA
2246826 Mar 1999 CA
1331783 Jan 2002 CN
1434557 Aug 2003 CN
1526950 Sep 2004 CN
1582203 Feb 2005 CN
1590761 Mar 2005 CN
1685156 Oct 2005 CN
1695009 Nov 2005 CN
299 09 100 Aug 1999 DE
199 33 202 Jan 2001 DE
0 249 655 Dec 1987 EP
0 410 394 Jan 1991 EP
0513843 Nov 1992 EP
0 261 972 Dec 1992 EP
0577104 Jan 1994 EP
0 863 538 Sep 1998 EP
0 867 649 Sep 1998 EP
0 892 204 Jan 1999 EP
1 133 639 Jun 2004 EP
1 462 652 Sep 2004 EP
661 522 Nov 1951 GB
54-081119 Jun 1979 JP
54-165812 Nov 1979 JP
55-073563 Jun 1980 JP
58-119983 Jul 1983 JP
58-203340 Nov 1983 JP
61-178582 Aug 1986 JP
63-255575 Oct 1988 JP
02-013184 Jan 1990 JP
02-091485 Mar 1990 JP
H02-227794 Sep 1990 JP
04-167916 Jun 1992 JP
05-184827 Jul 1993 JP
51-081413 Jul 1993 JP
06-058246 Mar 1994 JP
06-103688 Apr 1994 JP
H07-253081 Oct 1995 JP
08-016563 Jan 1996 JP
08-061246 Mar 1996 JP
2633005 Apr 1997 JP
10-169566 Jun 1998 JP
11-26430 Jan 1999 JP
11-076394 Mar 1999 JP
2963514 Aug 1999 JP
11-356081 Dec 1999 JP
2001-203196 Jul 2001 JP
2001-304650 Oct 2001 JP
2001-342989 Dec 2001 JP
2002-106467 Apr 2002 JP
2002-305890 Oct 2002 JP
2003-021069 Jan 2003 JP
2003-516820 May 2003 JP
2003-293958 Oct 2003 JP
2004-032916 Jan 2004 JP
2004-052748 Feb 2004 JP
2004-143960 May 2004 JP
2004-225672 Aug 2004 JP
2004-232616 Aug 2004 JP
2004-293443 Oct 2004 JP
2005-090410 Apr 2005 JP
2006-504035 Feb 2006 JP
2006-161677 Jun 2006 JP
2009-517601 Apr 2009 JP
2009-517618 Apr 2009 JP
2009-517778 Apr 2009 JP
2009-517888 Apr 2009 JP
2009-521636 Jun 2009 JP
466301 Dec 2001 TW
477862 Mar 2002 TW
593888 Jun 2004 TW
I225908 Jan 2005 TW
WO 9635876 Nov 1996 WO
WO 9937435 Jul 1999 WO
WO 9966415 Dec 1999 WO
WO 0031416 Jun 2000 WO
WO 0140646 Jun 2001 WO
WO 0143798 Jun 2001 WO
WO 02090771 Nov 2002 WO
WO 2006057957 Jun 2006 WO
WO 2007067359 Jun 2007 WO
WO 2009059324 May 2009 WO
Non-Patent Literature Citations (196)
Entry
Office Action for Taiwanese Patent Application No. 095142926, issued Aug. 9, 2012, 12 pgs. (with English translation).
Office Action (with English translation) for Taiwan Patent Application No. 095142923, dated Aug. 29, 2012, 9 pgs.
Office Action (with English translation) for Taiwan Patent Application No. 096106723, dated Sep. 21, 2012, 8 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-541407, mailed Dec. 21, 2012, Japanese Patent Office, 7 pgs.
Notice of Allowance for U.S. Appl. No. 12/218,325, mailed Jan. 24, 2013, 4 pgs.
Office Action (with English translation) for Korean Patent Application No. 10-2008-7015528, dated Apr. 22, 2013, 15 pgs., Korean Patent Office.
Office Action for U.S. Appl. No. 11/948,585, mailed May 10, 2013, 12 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2011-168830, mailed Jul. 23, 2013, 6 pgs., Japanese Patent Office.
Office Action (with English translation) for Japanese Patent Application No. 2012-059979, mailed Jul. 23, 2013, 6 pgs., Japanese Patent Office.
Brochure describing a Chempure Pump—A Furon Product, 1996, Furon Company, Anaheim, CA 92806, USA, 2 pgs.
Krishna et al.,“Characterization of Low Viscosity Photoresist Coating,” Advances in Resist Tech. and Processing XV (Proceedings of SPIE (The Int'l Society of Optical Engineering), 2/23-25/98, Santa Clara, CA, vol. 3333 (Part Two of Two Parts), 15 pgs.
English translation of Chinese Patent Office Official Action, Chinese Patent Application No. 200410079193.0, mailed Mar. 23, 2007, 5 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/045127 mailed May 23, 2007, 7 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/044908 mailed Jul. 16, 2007, 10 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/045175 mailed Jul. 25, 2007, 8 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/044907 mailed Aug. 8, 2007, 9 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/045177 mailed Aug. 9, 2007, 7 pgs.
European Search Report, European Patent Application No. 00982386.5, dated Sep. 4, 2007, 8 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/044906 mailed Sep. 5, 2007, 8 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2005/042127 mailed Sep. 26, 2007, 8 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/044980 mailed Oct. 4, 2007, 9 pgs.
Office Action for U.S. Appl. No. 11/051,576, mailed Dec. 13, 2007, 10 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2006/045176, mailed Apr. 21, 2008, 9 pgs.
Office Action for U.S. Appl. No. 11/602,513, mailed May 22, 2008, 10 pgs.
International Search Report and Written Opinion, for International Patent Application No. PCT/US2007/05377, mailed Jun. 4, 2008, 13 pgs.
Chinese Patent Office Official Action (with English translation) for Chinese Patent Application No. 2005101088364, issued May 23, 2008, 6 pgs.
International Search Report and Written Opinion for International Patent Application No. PCT/US06/44985, mailed Jun. 23, 2008, 7 pgs.
International Search Report and Written Opinion for International Patent Application No. PCT/US07/17017, mailed Jul. 3, 2008, 9 pgs.
International Search Report and Written Opinion for International Patent Application No. PCT/US06/44981, mailed Aug. 8, 2008, 10 pgs.
Office Action for U.S. Appl. No. 11/365,395, mailed Aug. 19, 2008, 19 pgs.
Office Action for U.S. Appl. No. 11/292,559 mailed Aug. 28, 2008, 19 pgs.
Office Action for U.S. Appl. No. 11/602,513, mailed Nov. 14, 2008, 7 pgs.
Office Action for U.S. Appl. No. 11/364,286, mailed Nov. 14, 2008, 11 pgs.
International Preliminary Report on Patentability, Chap. II, for International Patent Application No. PCT/US07/17017, mailed Jan. 13, 2009, 8 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/044981, mailed Nov. 6, 2008, 7 pgs.
International Preliminary Report on Patentability, Chap. II, for International Patent Application No. PCT/US2006/044981, mailed Feb. 2, 2009, 9 pgs.
Office Action for U.S. Appl. No. 11/365,395, mailed Feb. 2, 2009, 18 pgs.
Office Action for U.S. Appl. No. 11/292,559, mailed Dec. 24, 2008, 18 pgs.
International Preliminary Report on Patentability, Ch. I, for International Patent Application No. PCT/US2006/044985, mailed Apr. 9, 2009, 5 pgs.
Office Action for U.S. Appl. No. 11/292,559, mailed Apr. 17, 2009, 20 pgs.
Office Action for U.S. Appl. No. 11/273,091, mailed Feb. 17, 2006, 8 pgs.
Office Action for U.S. Appl. No. 11/273,091, mailed Jul. 3, 2006, 8 pgs.
Office Action for U.S. Appl. No. 11/273,091 mailed Oct. 13, 2006, 8 pgs.
Office Action for U.S. Appl. No. 11/273,091 mailed Feb. 23, 2007, 6 pgs.
Office Action for U.S. Appl. No. 11/273,091 mailed Oct. 15, 2007, 8 pgs.
Office Action for U.S. Appl. No. 11/386,427 mailed Nov. 13, 2007, 11 pgs.
Office Action for U.S. Appl. No. 11/364,286 mailed Jun. 1, 2009, 14 pgs.
International Preliminary Report on Patentability, Ch. I, for International Patent Application No. PCT/US2006/045176, issued on Mar. 31, 2009, 5 pgs.
Intellectual Property Office of Singapore, Written Opinion for Patent Application No. 200803948-9 dated Jul. 2, 2009, 10 pgs.
International Search Report for International Patent Application No. PCT/US99/28002, mailed Mar. 14, 2000, 5 pgs.
Written Opinion for International Patent Application No. PCT/US99/28002, mailed Oct. 25, 2000, 8 pgs.
International Preliminary Examination Report for International Patent Application No. PCT/US99/28002, mailed Feb. 21, 2001, 9 pgs.
International Search Report and Written Opinion for International Patent Application No. PCT/US06/44907, mailed Aug. 8, 2007, 9 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US06/044906, mailed Jun. 5, 2008, 7 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/044907, mailed Jun. 5, 2008, 7 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/044980, mailed Jun. 12, 2008, 7 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/044908, mailed Jun. 12, 2008, 8 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/045175, mailed Jun. 12, 2008, 6 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/045127, mailed Jun. 12, 2008, 8 pgs.
International Preliminary Report on Patentability, Chap. I, for International Patent Application No. PCT/US2006/045177, mailed Jun. 19, 2008, 5 pgs.
International Preliminary Report on Patentability, Chap. II, for International Patent Application No. PCT/US07/05377, mailed Oct. 14, 2008, 14 pgs.
European Search Report for European Application No. 06838223.3, European Patent Office, dated Aug. 12, 2009, 18 pgs.
Japanese Laid Open Publication No. JP-2009-528631, published Aug. 6, 2009, with International Search Report, Japanese Patent Office, 38 pgs.
Office Action for U.S. Appl. No. 09/447,504 mailed Feb. 27, 2001, 4 pgs.
Office Action for U.S. Appl. No. 09/447,504 mailed Nov. 18, 2003, 4 pgs.
Office Action for U.S. Appl. No. 09/447,504 mailed Jul. 13, 2004, 5 pgs.
Japanese Laid Open Publication No. JP-2009-529847, published Aug. 20, 2009, with International Search Report, Japanese Patent Office, 21 pgs.
Intellectual Property Office of Singapore, Examination Report for Patent Application No. 200703671-8 dated Jul. 28, 2009, 4 pgs.
Chinese Patent Office Official Action, Chinese Patent Application No. 200580039961.2, dated Aug. 21, 2009 with English translation, 33 pgs.
Intellectual Property Office of Singapore, Written Opinion for Patent Application No. 200806425-5 dated Oct. 14, 2009, 8 pgs.
Office Action for U.S. Appl. No. 11/602,507 mailed Oct. 28, 2009, 12 pgs.
Office Action for U.S. Appl. No. 11/292,559 mailed Nov. 3, 2009, 17 pgs.
Office Action for U.S. Appl. No. 11/364,286 mailed Nov. 9, 2009, 19 pgs.
Intellectual Property Office of Singapore, Written Opinion for Patent Application No. 200803948-9 dated Jan. 19, 2010, 10 pgs.
Office Action (with English translation) for Chinese Patent Appl. No. 200680050665.7, dated Mar. 11, 2010, 6 pgs.
Office Action for U.S. Appl. No. 11/364,286 mailed Apr. 7, 2010, 22 pgs.
Office Action for U.S. Appl. No. 11/292,559 mailed Apr. 14, 2010, 20 pgs.
Office Action for U.S. Appl. No. 11/602,508 mailed Apr. 15, 2010, 20 pgs.
Office Action (with English translation) for Chinese Patent Application No. CN 200680050801.2, mailed Mar. 26, 2010, 13 pgs.
Office Action for U.S. Appl. No. 12/350,688 mailed Apr. 26, 2010, 10 pgs.
Supplementary European Search Report and European Written Opinion in Application No. EP06838071.6, dated Apr. 28, 2010, 5 pgs.
Office Action for U.S. Appl. No. 11/602,485 mailed Jun. 9, 2010, 9 pgs.
Office Action for U.S. Appl. No. 11/602,507 mailed Jun. 14, 2010, 13 pgs.
Office Action for U.S. Appl. No. 11/602,472 mailed Jun. 18, 2010, 13 pgs.
Office Action for U.S. Appl. No. 11/602,465 mailed Jun. 18, 2010, 14 pgs.
Office Action for U.S. Appl. No. 11/602,464 mailed Jun. 21, 2010, 19 pgs.
Office Action (with English translation) for Chinese Patent Application No. CN 200680045074.0, mailed Jun. 7, 2010, 8 pgs.
Office Action (with English translation) for Chinese Patent Application No. CN 200680050814.X, mailed Aug. 6, 2010, 10 pgs.
Notice of Allowance for U.S. Appl. No. 11/364,286 mailed Sep. 21, 2010, 11 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,507 mailed Oct. 14, 2010, 8 pgs.
Office Action (with English translation) for Chinese Patent Application No. CN 200780046952.5, mailed Sep. 27, 2010, 8 pgs.
Office Action for U.S. Appl. No. 11/602,485 mailed Nov. 19, 2010, 9 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,508, mailed Dec. 14, 2010, 10 pgs.
Official Action (with English translation) for Chinese Patent Application No. 200680051448.X, mailed Dec. 1, 2010, 20 pgs.
Office Action for U.S. Appl. No. 11/602,464 mailed Jan. 5, 2011, 12 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,465, mailed Jan. 12, 2011, 19 pgs.
Office Action for Chinese Patent Application No. 200680050801.2, dated Jan. 6, 2011, with English translation, 7 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,508, mailed Mar. 4, 2011, 8 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2007-543342, dated Feb. 25, 2011, mailed Mar. 1, 2011, Japanese Patent Office, 12 pgs.
Office Action for U.S. Appl. No. 11/602,472, mailed Mar. 21, 2011, 11 pgs.
European Search Report and Written Opinion for European Patent Application No. 06838070.8, dated Mar. 18, 2011, 7 pgs.
European Office Action for European Patent Application No. 06838071.6, dated Mar. 18, 2011, 5 pgs.
Office Action for U.S. Appl. No. 11/602,485, mailed Apr. 27, 2011, 10 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680050665.7 mailed Apr. 26, 2011, Chinese Patent Office, 11 pgs.
Office Action for U.S. Appl. No. 11/948,585, mailed May 19, 2011, 10 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,465, mailed Jun. 8, 2011, 6 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680045074.0, Chinese Patent Office, dated Jun. 2, 2011, 10 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,464, mailed Jul. 11, 2011, 5 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,508, mailed Jul. 20, 2011, 4 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680043297.3, Chinese Patent Office, dated Jul. 27, 2011, 8 pgs.
Office Action for Chinese Patent Application No. 200580039961.2, Chinese Patent Office, dated Aug. 9, 2011, 6 pgs.
European Search Report for European Patent Application No. 06844456.1, European Patent Office, dated Jun. 28, 2011, 9 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,472, mailed Sep. 8, 2011, 7 pgs.
English translation of Office Action for Chinese Patent Application No. 200680050801.2 dated Chinese Patent Office, Aug. 31, 2011, 5 pgs.
European Search Report for European Patent Application No. 07836336.3, European Patent Office, dated Sep. 19, 2011, 5 pgs.
English translation of Office Action for Chinese Patent Application No. 200680051205.6, dated Oct. 10, 2011, State Intellectual Property Office of the People's Republic of China, 9 pgs.
Office Action for Korean Patent Application No. 10-2007-7014324, dated Oct. 31, 2011, Korean Patent Office, 18 pgs.
English translation of Office Action for Chinese Patent Application No. 200680050665.7 dated Nov. 23, 2011, 7 pgs.
Office Action for U.S. Appl. No. 12/218,325, mailed Dec. 13, 2011, 10 pgs.
English translation of Office Action for Chinese Patent Application No. 200680050801.2 dated Dec. 1, 2011, 3 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543354, mailed Dec. 22, 2011, Japanese Patent Office, 7 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680050814.X, dated Dec. 23, 2011, State Intellectual Property Office of the People's Republic of China, 6 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543355, mailed Jan. 5, 2012, Japanese Patent Office, 5 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-541406, mailed Jan. 10, 2012, Japanese Patent Office, 11 pgs.
Office Action for U.S. Appl. No. 11/948,585, mailed Jan. 19, 2012, 11 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543344, mailed Feb. 2, 2012, Japanese Patent Office, 2 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-544358, mailed Feb. 1, 2012, Japanese Patent Office, 3 pgs.
Office Action for Chinese Patent Application No. 200680051448.X, dated Feb. 21, 2012, 3 pgs., Chinese Patent Office.
Final Rejection (with English translation) for Japanese Patent Application No. 2007-543342, mailed Feb. 21, 2012, 8 pgs.
English translation for Office Action for Chinese Patent Application No. 200780046952.5, mailed Feb. 28, 2012, 5 pages.
Office Action issued for U.S. Appl. No. 11/948,585, mailed Mar. 14, 2012, 14 pgs.
Notice of Allowance for U.S. Appl. No. 11/602,472, mailed Mar. 29, 2012, 4 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-541407, Japanese Patent Office, mailed Mar. 27, 2012, 7 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543343, Japanese Patent Office, mailed Mar. 27, 2012, 7 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200580039961.2, dated Apr. 12, 2012, 6 pgs.
Notice of Allowability for U.S. Appl. No. 11/666,124, mailed May 8, 2012, 9 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2009-539238, mailed Apr. 24, 2012, 7 pgs.
Office Action (with English translation) for Taiwan Patent Application No. 094140888, mailed Mar. 20, 2012, 5 pgs.
Office Action (with English translation) for Korea Patent Application No. 10-2007-7014324, mailed May 18, 2012, 6 pgs.
Office Action for European Patent Application No. 07836336.3, mailed May 15, 2012, 5 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680051205.6, mailed May 24, 2012, 7 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543342, mailed Jun. 5, 2012, 8 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200680050665.7, mailed Jul. 4, 2012, 12 pgs.
Notice of Allowance for U.S. Appl. No. 12/983,737, mailed Jul. 30, 2012, 9 pgs.
Notice of Allowance for Japanese Patent Application No. 2007-543342, dated Jul. 31, 2007, 3 pgs., Japanese Patent Office.
Office Action for Japanese Patent Application No. 2008-543354, mailed Jul. 24, 2012, 6 pgs. (with English translation).
Office Action and Search Report for Taiwan Patent Application No. 095142929, issued Aug. 17, 2012, from the Intellectual Property Office of Taiwan, 7 pgs. (with English translation).
Office Action for U.S. Appl. No. 12/218,325, mailed Aug. 28, 2012, 9 pgs.
Office Action for U.S. Appl. No. 11/948,585, mailed Sep. 28, 2012, 17 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-544358, mailed Nov. 13, 2012, 2 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543344, mailed Nov. 13, 2012, 4 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543355, mailed Nov. 13, 2012, 4 pgs.
Notice of Allowance for U.S. Appl. No. 12/983,737, mailed Dec. 6, 2012, 5 pgs.
Office Action (with English translation) for Chinese Patent Application No. 200780046952.5, dated Dec. 4, 2012, 5 pgs.
Office Action (with English translation) for Taiwanese Patent Application No. 094140888, dated Nov. 19, 2012, 6 pgs.
Office Action for U.S. Appl. No. 13/615,926, mailed Jun. 19, 2013, 17 pgs.
Notice of Allowance for Taiwan Application No. 095142923, dated Jun. 26, 2013, 5 pgs. (with English translation of search report only), Taiwan Intellectual Property Office.
Notice of Allowance for Taiwan Application No. 095142926, dated Jun. 27, 2013, 5 pgs. (with English translation of search report only), Taiwan Intellectual Property Office.
Notice of Allowance for Japanese Patent Application No. 2008-541406, dated Jul. 9, 2013, 3 pgs., Japanese Patent Office.
Notice of Allowance for Japanese Patent Application No. 2008-541407, dated Jul. 9, 2013, 3 pgs., Japanese Patent Office.
Notice of Allowance for Japanese Patent Application No. 2008-544358, dated Jul. 16, 2013, 3 pgs., Japanese Patent Office.
Office Action (with English translation) for Taiwan Patent Application No. 095143263, dated Aug. 17, 2012, 9 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-541406, mailed Oct. 16, 2012, 7 pgs.
Office Action for U.S. Appl. No. 13/216,944, mailed Oct. 25, 2012, 12 pgs.
Notice of Allowance for U.S. Appl. No. 12/983,737, mailed Nov. 1, 2012, 7 pgs.
Office Action for Chinese Patent Application No. 200680051448.X, dated Nov. 2, 2012, 3 pgs.
Office Action for Taiwanese Patent Application No. 095142932, issued Aug. 17, 2012, 9 pgs. (with English translation).
Office Action for Taiwanese Patent Application No. 095142928, issued Aug. 17, 2012, 9 pgs. (with English translation).
Office Action for U.S. Appl. No. 13/301,516, mailed Jun. 4, 2013, 8 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2009-539238, mailed Jan. 29, 2013, 5 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2008-543354, mailed Jan. 29, 2013, 6 pgs.
Office Action (English translation only) for Korean Patent Application No. 10-2008-7015803, dated Feb. 13, 2013, 3 pgs.
Office Action (with English translation) for Korean Patent Application No. 10-2008-7013326, dated Feb. 13, 2013, 6 pgs.
Office Action for U.S. Appl. No. 13/615,926, mailed Mar. 15, 2013, 17 pgs.
Notice of Allowance for U.S. Appl. No. 13/216,944, mailed Mar. 19, 2013, 2 pgs.
Notice of Allowance for Japanese Patent Application No. 2012-085238, dated Mar. 10, 2014, 3 pages.
Office Action for U.S. Appl. No. 13/251,976, mailed Oct. 17, 2013, 11 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2012-087168, mailed Sep. 24, 2013, 6 pgs., Japanese Patent Office.
Corrected Notice of Allowability for U.S. Appl. No. 13/615,926, mailed Feb. 4, 2014, 6 pgs.
Office Action for U.S. Patent Application No. 13/251,976, mailed Oct. 17, 2013, 11 pgs.
Office Action (with English translation) for Taiwanese Patent Application No. 095142930, issued Sep. 18, 2013, 8 pgs.
Office Action for U.S. Appl. No. 13/316,093, mailed Oct. 29, 2013, 7 pgs.
Notice of Allowance for U.S. Appl. No. 13/615,926, mailed Nov. 20, 2013, 5 pgs.
Notice of Allowance for U.S. Appl. No. 13/301,516, mailed Nov. 21, 2013, 5 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2009-539238, mailed Dec. 3, 2013, 3 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2013-018339, mailed Dec. 3, 2013, 7 pgs.
Notice of Allowance for U.S. Appl. No. 11/948,585, mailed Dec. 19, 2013, 5 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2012-059979, mailed Dec. 17, 2013, 4 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2013-086392, mailed Mar. 3, 2014, 8 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2012-085238, mailed Aug. 20, 2013, 7 pgs., Japanese Patent Office.
Office Action for Chinese Patent Application No. 201210151908.3, dated Apr. 30, 2014, 19 pgs.
Office Action (with English translation) for U.S. Appl. No. 13/316,093, mailed Jun. 23, 2014, 8 pgs.
Notice of Allowance for Japanese Patent Application No. 2009-539238, dated Jun. 23, 2014, 3 pgs.
Notice of Allowance for Japanese Patent Application No. 2012-059979, dated Jun. 16, 2014, 3 pgs.
Office Action (with English translation) for Japanese Patent Application No. 2011-168830, mailed Jun. 2, 2014, 9 pgs.
Notice of Allowance for U.S. Appl. No. 13/251,976, mailed Jun. 6, 2014, 5 pgs.
Related Publications (1)
Number Date Country
20120288379 A1 Nov 2012 US
Provisional Applications (1)
Number Date Country
60630384 Nov 2004 US
Continuations (1)
Number Date Country
Parent 11666124 US
Child 13554746 US