It is often desired to construct a cross-sectional view (layer or slice) and/or three-dimensional (3D) view of an object for which actually presenting such views is impossible, such as due to irreparably damaging the object. For example, imaging systems are utilized in the medical arts to provide a view of a slice through a living human's body and to provide 3D views of organs therein. Similarly, imaging systems are utilized in the manufacturing and inspection of industrial products, such as electronic circuit boards and/or components, to provide layer views and 3D views for inspection thereof.
Images are often provided through reconstruction techniques which use multiple two-dimensional (2D) radiographic images. These images may be captured on a suitable film, or electronic detector, using various forms of penetrating radiation, such as X-ray, ultrasound, neutron or positron radiation. The technique of reconstructing a desired image or view of an object (be it a 3D image, a cross-sectional image, and/or the like) from multiple projections (e.g., different detector images) is broadly referred to as tomography. When reconstruction of a cross-sectional image is performed with the aid of a processor-based device (or “computer”), the technique is broadly referred to as computed (or computerized) tomography (CT). In a typical example application, a radiation source projects X-ray radiation through an object onto an electronic sensor array thereby providing a detector image. By providing relative movement between one or more of the object, the source, and the sensor array, multiple views (multiple detector images having different perspectives) may be obtained. An image of a slice through the object or a three-dimensional 3D image of the object may then be approximated by use of proper mathematical transforms of the multiple views. That is, cross-sectional images of an object may be reconstructed, and in certain applications such cross-sectional images may be combined to form a 3D image of the object.
Within the field of tomography, a number of imaging techniques can be used for reconstruction of cross-sectional slices. One imaging technique is known as laminography. In laminography, the radiation source and sensor are moved in a coordinated fashion relative to the object to be viewed so that portions of an object outside a selected focal plane lead to a blurred image at the (see, for example, U.S. Pat. No. 4,926,452). Focal plane images are reconstructed in an analog averaging process. An example of a laminography system that may be utilized for electronics inspection is described further in U.S. Pat. No. 6,201,850 entitled “ENHANCED THICKNESS CALIBRATION AND SHADING CORRECTION FOR AUTOMATIC X-RAY INSPECTION.” An advantage of laminography is that extensive computer processing of ray equations is not required for image reconstruction.
Another imaging technique is known as tomosynthesis. Tomosynthesis is an approximation to laminography in which multiple projections (or views) are acquired and combined. As the number of views becomes large, the resulting combined image generally becomes identical to that obtained using laminography with the same geometry. A major advantage of tomosynthesis over laminography is that the focal plane to be viewed can be selected after the projections are obtained by shifting the projected images prior to recombination. Tomosynthesis may be performed as an analog method, for example, by superimposing sheets of exposed film. Tomosynthesis may, also, be performed as a digital method. In digital tomosynthesis, the individual views are divided into pixels, and digitized and combined via computer software.
Tomosynthesis is of interest in automated inspection of industrial products. For instance, reconstruction of cross-sectional images from radiographic images has been utilized in quality control inspection systems for inspecting a manufactured product, such as electronic devices (e.g., printed circuit boards). Tomosynthesis may be used in an automated inspection system to reconstruct images of one or more planes (which may be referred to herein as “depth layers” or “cross-sections”) of an object under study in order to evaluate the quality of the object (or portion thereof). A penetrating radiation imaging system may create 2-dimensional detector images (layers, or slices) of a circuit board at various locations and at various orientations. Primarily, one is interested in images that lie in the same plane as the circuit board. In order to obtain these images at a given region of interest, raw detector images may be mathematically processed using a reconstruction algorithm.
For instance, a printed circuit board (or other object under study) may comprise various depth layers of interest for inspection. As a relatively simple example, a dual-sided printed circuit board may comprise solder joints on both sides of the board. Thus, each side of the circuit board on which the solder joints are arranged may comprise a separate layer of the board. Further, the circuit board may comprise surface mounts (e.g., a ball grid array of solder) on each of its sides, thus resulting in further layers of the board. The object under study may be imaged from various different angles (e.g., by exposure to radiation at various different angles) resulting in radiographic images of the object, and such radiographic images may be processed to reconstruct an image of a layer (or “slice”) of the object. Thereafter, the resulting cross-sectional image(s) may, in some inspection systems, be displayed layer by layer, and/or such cross-sectional images may be used to reconstruct a full 3D visualization of the object under inspection.
In Laminography, only one layer may be reconstructed at a time. A potential advantage of Tomosynthesis is that many different layers may be reconstructed from a given set of projection (detector) image data. However, only a few of those layers may be of interest, such as those corresponding to the top and bottom surfaces of a circuit board. The location of those layers may be obtained in advance, as must be done in laminography, using an appropriate locating system, or, for Tomosynthesis, may be done after data acquisition using an appropriate analysis of image layers. In the latter case, the selected image may be one that maximizes some constraint, such as image sharpness. An example of such a system is U.S. Published Patent Application No. 2003/0118245, AUTOMATIC FOCUSING OF AN IMAGING SYSTEM. When this analysis is automated using a processing unit, e.g., a digital computer, it is broadly referred to as “auto-focusing.”
In pending U.S. patent application “SYSTEM AND METHOD FOR PERFORMING AUTO-FOCUSED TOMOSYNTHESIS”, (U.S. Published Patent Application No. 20050047636 A1), which is assigned to the same assignee as the assignee of the present application, and which application (20050047636 A1) is incorporated herein by reference in its entirety, a method for auto-focusing is described, that reduces the computational burden of the reconstruction process and image analysis. This is achieved using a “multi-level” or “multi-resolution” algorithm that reconstructs images on a plurality of levels or resolutions. In particular, coarse-resolution representations of the projection (detector) images may be used to generate an initial analysis of the sharpness of layers. Once a collection of layers has been identified as possibly being the sharpest using this analysis, a fine-resolution analysis may be used to refine the estimated location of the sharpest layer. Accordingly, the algorithm may be organized in a hierarchical manner. This approach substantially reduces the computational burden on the processing unit (e.g., computer).
An embodiment herein provides a method for measuring the accuracy and reliability of the multi-resolution auto-focusing method in U.S. Published Patent Application No. 20050047636 A1, and for using this information as feedback in the algorithm itself, for optimization and verification. An embodiment herein addresses a number of issues. First, due to a number of factors, including variations in radiation type used in the imaging system (e.g., X-ray, ultrasound, etc.), imaging noise, the feature size of parts under test, and the imaging algorithms, the multi-resolution auto-focusing algorithm will have different behavior on different resolution levels. For example, the signal-to-noise ratio of images and auto-focus data may be different at different resolution levels. As another example, while one might assume that the highest resolution level gives the best results, in fact the auto-focusing algorithm may give optimal results on a lower resolution level, because the feature size of the part under test matches the imaging operations at that level. This leads to the second potential benefit of an embodiment, further reduction of computational burden. The computational burden can sometimes be further reduced by not visiting higher resolution levels in cases where a lower resolution level offers a satisfactory result. Thus, one significant benefit of an embodiment herein, is the identification of, and quantification of satisfactory results or a good result.
In “SYSTEM AND METHOD FOR PERFORMING AUTO-FOCUSED TOMOSYNTHESIS”, (U.S. Published Patent Application No. 20050047636 A1) a method for auto-focusing is described which reduces the computational burden of the reconstruction process and image analysis. One issue with the approach described in the U.S. Published Patent Application No. 20050047636 A1 is that the algorithm does not provide a method for measuring or quantifying the accuracy of its results. Thus, when the algorithm returns a value for “sharpest layer”, there is no confidence measure associated with that value, so that the user does not know whether the value is reasonable or not. Another benefit of an embodiment herein is that there is a process for recognizing that given several resolution levels to choose from, the highest resolution level may not be the best, as was sometimes assumed in the past. Thus, the accuracy of results may be improved if the best level can be determined, and the computational burden may be reduced, if computations are stopped at that level, where the best level is based on accuracy and reliability factors as described in more detail below.
In the embodiment of the system 100 shown in
In the embodiment of
In the embodiment shown in
In this manner, the result of processing the image data 104 with wavelet transform 106 provides gradient-based information in a hierarchy of resolutions. An embodiment of the present invention may use this hierarchy of resolutions of gradient-based image data to perform the auto-focusing operation. For instance, in the embodiment 100 of
As shown in the example of
It should be recognized that the gradients of layers 0, 8, 16, 24, and 32 are reconstructed directly from the relatively low-resolution image data 108 of the wavelet transform 106. Thus, the computational cost of reconstructing the gradient of such layers 0, 8, 16, 24, and 32 directly from this low-resolution data 108 is much less than first tomosynthetically reconstructing a cross-sectional image from the captured image data 104 and then computing the gradient from such reconstructed cross-sectional image. The process of identifying the one layer out of every eighth layer of layers 101 that is closest to (or is most nearly) the layer of interest (e.g., the sharpest layer) may be referred to as the first level of the hierarchical auto-focusing technique.
Once the layer of the first level of the hierarchical auto-focusing technique that has the maximum sharpness is determined (layer 8 in the example of
It should be recognized that the gradients of layers 4, 8, and 12 are reconstructed directly from the gradient-based image data 110 of the wavelet transform 106. Thus, the computational cost of reconstructing the gradient of such layers 4, 8, and 12 directly from this data 110 is much less than first tomosynthetically reconstructing a cross-sectional image from the captured image data 104 and then computing the gradient from such reconstructed cross-sectional image. The process of identifying the one layer out of layers 4, 8, and 12 of layers 101 that is closest to (or is most nearly) the layer of interest (e.g., the sharpest layer) may be referred to as the second level of the hierarchical auto-focusing technique.
Once the layer of the second level of the hierarchical auto-focusing technique having the maximum sharpness is determined from analysis of the reconstructed gradients using gradient-based image data 110 (layer 4 in the example of
It should be recognized that in the above example auto-focusing process of
Any number of depth layers 101 may be evaluated by the auto-focusing application in alternative implementations, and any number of levels of processing may be included in the hierarchy in alternative implementations (and thus are not limited solely to the example of three levels of hierarchical processing described with
Control module 105 is provided to further refine the hierarchical auto-focus process. The control module 105 can include the functions described in more detail below, which include determining accuracy confidence limits, and reliability scores for different resolution levels. The control module 105 can operate to analyze image data to determine high and low frequency noise qualities in the image data. The control module can also control the wavelet transformation process, to determine which level of resolution is most appropriate, for a given imaging situation.
In embodiment 100 the control module 105, and the wavelet transform module 106 could be implemented in computer, and these modules could be implemented in a processor which are programmed to perform the functions described herein. Further, the computer system could also include a display and the processor would also be programmed to perform the generation of images to be shown to a user of the system on the display. The processor of the computer could generate the image at selected height levels in the object, and to generate the image such that the image shows at least a part of the object being inspected. The functions herein could be implemented using a single processor, or using multiple processors.
An embodiment herein provides for constructing confidence measures for the parameters, or data, extracted from sharpness profiles (gradient data) obtained from wavelet transformation or other technique, during auto-focusing, and provides for using this confidence information as a basis for determining the reliability and accuracy of estimates at different resolution levels. Additionally, an embodiment herein can use the confidence information to identify a resolution level that is considered adequate (thus terminating the algorithm) prior to consuming unnecessary processing time associated with going to higher resolution levels.
An embodiment of a method herein provides that the noise in the sharpness profile is divided into high and low frequency qualities and analyzed. The high frequency qualities may be estimated in advance, and is used to define accuracy confidence limits, by comparing the actual image data to a model that has been fit to the data. The model may be used to extract features from the curve, such as peak location and width, edge locations, etc. Low frequency noise is tracked during run-time using carefully selected sample points, and leads to a reliability score for the results, i.e. how much the peak rises above the noise floor. These two measures: accuracy and reliability, may be used to choose which resolution level will be used during auto-focusing.
In one embodiment a first step in the method is to identify a high frequency noise quality, which is primarily due to the characteristics of the imaging system. The image-capture system, image artifacts, or shadows may all contribute to the high frequency noise. The part of noise that is indeed due to the imaging system can be measured in advance, of actual runtime operation where image data is being gathered for an object. This ability to obtain high frequency noise information in advance of actually obtaining image information for an object can be beneficial, since the high frequency noise can be very difficult to measure at run-time due to operational speed requirements, where one may need to acquire the image data for an object in a very short amount of time. Of course it should be recognized that an alternative embodiment could operate to obtain high frequency noise information at runtime, but generally such embodiments would be computationally very expensive.
There are many techniques for estimating the noise of a signal. A simple method is to first construct a smooth version of the signal, and then subtract it from the original. This is a reasonable approach for finding high frequency noise. Smoothing-splines are an example of a well-known method for computing a smooth version of a signal.
There are several metrics for computing the noise value. For example, the Root Mean Square (RMS) measure,
and also the median error,
σm=Med(|S−s′|)
are well known, and widely used. (In these equations, S is the vector of sharpness values, and s′ is the vector of smoothed sharpness values). These measures can be done for each resolution level, and for a variety of datasets, to determine a high frequency noise value.
In one embodiment a second step in the method is to fit a model to the sharpness profile. The data in
This statistic is essentially a weighted least squares measure for goodness-of-fit. To compute values using this formula, the noise value σ is pre-computed, for example using a method as described above, or an alternative method for computing such a noise values could be employed. For the simple case of one parameter, it has been shown (for example see Press, Flannery, Teukolsky, Vetterling “numerical Recipes in C”, 1998, Cambridge University Press, which is incorporated herein by reference) that a confidence interval can be represented by:
δα1=±√{square root over (Δχv2)}√{square root over (C11)}
where δα1 is the first model parameter, and C11 is the upper-left term of the covariance matrix (computed during the fitting algorithm).
The parameter δα is fundamental to assessing the value of the curve fit at each resolution level. It describes the relative accuracy with which a particular feature of interest is known. It should be noted that this score provides a relative accuracy measure in that it provides a measure to characterize how accurately different model parameters can be calculated. Thus, the term accuracy as used herein is generally meant to refer to the relative accuracy with which a model can be determined, as opposed to an absolute accuracy which would pertain to a calibration or measure of operation of the system. The parameter δα can be computed separately for all of the model parameters, leading to confidence intervals for each feature of interest. For example, if the algorithm search is for sharpest layer (which in one embodiment would correspond to a main peak in the auto-focus curve) the parameter of interest is the mean of the Gaussian curve. The confidence interval for the mean describes the accuracy that can be expected from the estimation of sharpest layer. This value can be compared across resolution levels to determine which level has the highest confidence (or the smallest confidence interval). Similar comparisons may be done with other curve parameters, such as inflection points, half-width-half-max points, edges, peak width, etc.
Measure of Low Frequency Noise
Image artifacts or shadows are the primary contributors to low frequency noise. An embodiment herein allows for determination of low frequency noise during actual runtime operation of the system, and uses image data obtained while an object under test is being imaged. In other embodiments it may be possible to provide for computing the low frequency noise prior to actual runtime operation of the system. In one embodiment herein, runtime determination of low frequency noise is achieved by utilizing the fact that in many instances the locations of artifacts are relatively constant between resolution levels. The artifact in
Using these steps, the amplitude and location of various image artifacts (low frequency noise) can be tracked during run-time. In the final step, we use these artifacts (low frequency) peaks to define a signal-to-noise ratio:
where Pmax is the max value of the main peak, Smax is the max value of the artifact extrema, and Smin is the min value of the artifact extrema. The parameter γ now represents how tall a particular sharpness peak stands above the noise peaks, and in one embodiment provides a reliability score. As such, this measure can be used as a reliability score. For example, when a sharpness peak is much larger than the artifact peaks, we have a high degree of confidence in the reliability of this measurement. Thus, the reliability score provides a data confidence measure. On the other hand, if the sharpness peak magnitude is only on the same order as the artifact peaks, then we have less confidence in its reliability. This measure can be compared on different resolution levels to estimate the reliability of each profile.
A summary of the methods of an embodiment herein used to compute the reliability score, as related to the low frequency noise is illustrated in the flowchart 600 in
Combining Accuracy and Reliability Procedures
The above discussion provides for two different measures of data which can be used in combination to characterize the accuracy and reliability of image data at different resolutions.
Referring to the auto-focus curves shown in
where a +bx is a linear baseline, μ is the mean of the Gaussian, and σ is the standard deviation (this is not the noise value, which also used the symbol σ above). The mean μ, is the location of the sharpest layer, and σ is used for edge location. The sample points found to track the low frequency artifacts are z=[10,50,150,195,220,228]. At each level of resolution the sharpness is computed at the sample point locations, and at a series of unequally spaced points in the main peak. The Gaussian function was fit to the data using Levenberg-Marquardt. In
Table 1 shows the parameters obtained at each resolution level corresponding to the auto-focus curves 202, 204, 206 and 208 shown in
Column 2, Sharpest Z, shows the height in object being viewed is determined as having the sharpest features according to the corresponding auto-focus curve. Column 3, +/± sharpest, shows the calculated accuracy confidence limit which corresponds to the δα1 calculation, described above, in connection with determining the accuracy confidence limit. Column 4, Standard dev., generally corresponds to the width of the peak of the corresponding auto-focus curve around the main peak or maximum of the auto-focus curve, or more precisely this value corresponds to the standard deviation of the Gaussian model. Column 5, +/± standard dev., corresponds to the confidence level of the standard deviation from col. 4. Column 6 corresponds to a reliability score, obtained using the reliability calculation discussed above.
It should also be noted that an embodiment herein could further provide an overall characteristic score, which combines both the accuracy confidence limit of column 3 for the above table with the reliability score of column 6 in the above table. For example, one embodiment herein can use an equation to calculate an overall reliability score “s”, where s is provided as the ratio of the reliability score to the relative accuracy. Thus, the overall score would be given by
where δα is the model parameter confidence measure (accuracy) for the various model parameters, and γ is the reliability score. Using the overall score “s” the metrics of Table 1 can be combined to provide overall scores for the different resolution levels. Column 7 of the above table shows an overall score “s” for each of the corresponding resolution levels.
Another way to combine the scores would be to use a weighted average, along the lines of:
and as one skill in the art will recognize a range of other equations and processes could be used to provide for combining the reliability score and the accuracy determinations to provide an overall score.
Although only specific embodiments of the present invention are shown and described herein, the invention is not to be limited by these embodiments. Rather, the scope of the invention is to be defined by these descriptions taken together with the attached claims and their equivalents.