The present disclosure relates to systems and methods for making glass structures, and more particularly to systems and methods having for producing a consolidated glass structure with a metallized outer surface coating formed thereon, which has excellent adhesion.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Glass is a material with many desirable properties (transparency, chemical inertness, low thermal expansion, etc.). In previous work at Lawrence Livermore National Laboratory, 3D printing of transparent glass of single and multi-material compositions to produce complex shapes and optics (Nguyen et al., Advanced Materials 2017, Dudukovic et al. ACS Applied Nano Materials 2018, Dylla-Spears et al. Science Advances 2020) has been demonstrated. Coating glasses with metals, however, can be challenging and time-consuming.
Chemical or physical vapor deposition processes (e.g., sputtering, e-beam deposition) tend to be line-of-sight methods and expensive. Solution-based electroless deposition can be used as a cheaper and shape-conformal alternative. However, electroless deposition suffers from poor adhesion, and typically requires many time-consuming pretreatment steps.
Previous work in this area has shown that a series of glass surface functionalization steps, including the addition of titania (TiO2) to improve adhesion and palladium (Pd) to activate the surface, enabled uniform electroless deposition of copper with good adhesion. For example, see Miller, Alexander, et al., “Electrochemical copper metallization of glass substrates mediated by solution-phase deposition of adhesion-promoting layers”, Journal of The Electrochemical Society 162.14 (2015): D630.
In spite of recent developments involving the coating of glass, there remains a need for systems and methods which enable coatings to be applied to glass without the above described limitations and drawbacks.
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
In one aspect the present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The method may further include treating the structure to remove substantially all solvents and organic components contained in the first flowable material. The method may further include exposing the structure to a bath containing a metal salt during which nucleation occurs and a metallic surface coating is formed on at least a portion of an outer surface of the structure.
In another aspect the present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise carrying out an additive manufacturing operation to form a structure using a flowable first material and a second flowable material, wherein the first flowable material includes SiO2 and the second flowable material differs from the first material and includes a metal salt mixture. The second flowable material is applied to form at least a designated portion of an outer surface of the structure. The method further may include treating the structure to remove substantially all solvents and organic components contained in the first flowable material, and then exposing the structure to a bath of a metal salt solution. Exposure to the metal salt solution causes nucleation to occur, which forms a metallized surface coating on at least the designated portion of the outer surface of the structure.
In still another aspect the present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise carrying out an additive manufacturing operation to form a structure using a first flowable material and a second flowable material, wherein the first flowable material includes SiO2 and the second flowable material differs from the first flowable material and includes a metal salt mixture, and wherein the second flowable material is applied to form at least a designated portion of an outer surface of the structure and the first flowable material forms a remainder of the structure. The method may further include heating the structure during a drying/burnout operation to remove substantially all solvents and organic components contained in the first flowable material. The method may further include sintering the structure to produce a consolidated structure, and then exposing the consolidated structure to a bath of a metal salt solution. During the exposure to the metal salt solution, nucleation occurs and a metallized surface coating is formed on the designated portion of the outer surface of the structure.
Further areas of applicability will become apparent from the description provided herein. It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
Example embodiments will now be described more fully with reference to the accompanying drawings.
The present disclosure overcomes the limitation of previous systems and methods with a new approach that incorporates dopants (including but not limited to TiO2 and Pd) into slurries and inks for 3D printing of glass components, which can then be directly plated. By using slurries and inks, this provides the ability to spatially control the composition of the glass, and one can then 3D print glass with prescribed patterns of doped composition (e.g., a silica glass where certain regions are doped with TiO2 and Pd). When the entire glass construct is placed in the electroless plating bath, only the doped regions are metallized.
Referring now to
1) Direct ink writing (DIW), which is illustrated at operation 102 in
2) Light-based methods such as stereolithography, in which a light pattern is projected to polymerize a photosensitive resin that can later be processed to glass. The process is repeated layer by layer until a 3D object is produced. The light source can be, for example, a digital light projector or a laser. The printed green body may then be subsequently treated to produce glass.
3) Direct melting methods, in which a glass powder, rod, fiber or other source material is melted using a laser or a high-temperature nozzle to pattern a desired shape.
4) Binder jetting methods, in which a bed of glass powder is patterned with a binder, layer by layer, to produce a 3D object. The printed construct is then thermally treated to remove the binder or other organics and sintered to full density.
All of the 3D AM printing methods described above can be adapted to produce multi-material constructs from the feedstock materials. By 3D printing a shape in which multiple different materials are patterned, one can produce a glass part or structure with a spatially varying composition throughout its thickness and/or volume. In this way, the printed glass part or structure can be printed to contain areas that are plating-ready, and areas that are plating-inert (for example, silica glass doped with TiO2/Pd and undoped silica glass, respectively).
Print operation 102 in
It will be appreciated that an important factor that will enable the plating of a metal is the inclusion of Pd in the flowable first ink 102a1, which acts as the catalyst that will trigger a metal deposition reaction. The TiO2 will act more as an adhesion promoter. Besides Pd, other metals can serve as “auto-catalysts”. In other words, if one were to incorporate copper ions or particles in the printed glass, one may possibly be able to achieve subsequent deposition of a copper metal film. Similarly, printing a nickel-containing glass may enable one to achieve deposition of a nickel metal film onto the glass. Accordingly, it will be appreciated that the present disclosure is not limited to any particular metals as an additive for the flowable first ink 102a1.
Referring further to
Referring further to
Referring further to
It will be appreciated then that to enable direct plating of glass products with good adhesion, the feedstock should contain additives or catalysts that allow the nucleation of metal deposits. These additives or catalysts can include, but are not limited to: palladium, copper, nickel, gold, silver, carbon, etc., which can be added as particles, salts, or as part of metal-organic polymers. Coatings on silica-based glass generally suffer from poor adhesion, so adhesion promoters (for example, titanium oxide, aluminum oxide, etc.) can be included in the 3D printable glass formulation (i.e., in the ink 102a2) to better enable the deposited metal film to remain on the glass surface and improve damage resistance.
Devices with complex 3D shapes in which the properties of glass, such as transparency, chemical inertness, low thermal expansion, and the properties of metals (e.g., electrical conductivity, thermal conductivity, catalytic activity) are highly beneficial. Examples applications of the present system and method are expected to include, but are not limited to: glass microfluidic devices with conductive traces for electrical sensing or electrowetting; glass electrochemical reactors with catalytically active metal electrodes; lightweight glass optics with reflective metallic coatings, etc.
Referring to
While the foregoing discussion has focused on using two types of inks, it will be appreciated that a plated structure could be formed simply by using one ink, for example ink 102a2, which is doped to include both SiO2 and additional components such as Pd. In this instance the entire outer surface of the printed structure could be plated using the herein described electroless plating methods.
Referring briefly to
The present disclosure thus describes various methods for the design and fabrication of glass surfaces with patterned metallic traces or surface portions. Either a portion or all of the surface may be plated with the chosen metallic material or metallic mixture. The present disclosure overcomes the limitations with previous coating methods, in which silicate glasses are typically difficult to plate, and require many pretreatment steps to ensure uniform deposition and adequate adhesion. Introducing dopants into 3D-printable silica glass preform formulations which include one or more metallic particles or components, enables the fabrication of glass components that can be directly plated via electroless deposition of metals and metal alloys. By using multi-material 3D printing, components with spatially varying glass composition can be produced, such that only selective portions of the glass components are plated during the electroless deposition process. The incorporation of metallic surfaces and patterns allows a wide range of important functionalities such as electrical conductivity, thermal conductivity, and catalytic activity, just to name a few, which can enable the design and fabrication of functional glass devices such as microfluidic circuits, electrochemical reactors, spectroscopy windows, mirrors, and other devices and structures.
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
This invention was made with Government support under Contract No. DE-AC52-07NA27344 awarded by the United States Department of Energy. The Government has certain rights in the invention.