The present disclosure relates generally to wireless communication and, more particularly, to reducing temperature- and process-dependent frequency variation of oscillator circuits.
Wireless communications systems are used in a variety of telecommunications systems, television, radio and other media systems, data communication networks, and other systems to convey information between remote points using wireless transmitters and wireless receivers. A transmitter is an electronic device which, usually with the aid of an antenna, propagates an electromagnetic signal such as radio, television, or other telecommunications. Transmitters often include signal amplifiers which receive a radio-frequency or other signal, amplify the signal by a predetermined gain, and communicate the amplified signal. On the other hand, a receiver is an electronic device which, also usually with the aid of an antenna, receives and processes a wireless electromagnetic signal. In certain instances, a transmitter and receiver may be combined into a single device called a transceiver.
Transmitters, receivers, and transceivers often include components known as oscillators. An oscillator may serve many functions in a transmitter, receiver, and/or transceiver, including generating local oscillator signal (usually in a radio-frequency range) for upconverting baseband signals onto a radio-frequency (RF) carrier and performing modulation for transmission of signals, and/or for downconverting RF signals to baseband signals and performing demodulation of received signals.
To achieve desired functionality, such oscillators must often have designs that produce precise operating characteristics. For example, it is often critical that oscillator circuits operate independently of variations in manufacturing/fabrication process, and operate independently of the temperature of the oscillator circuit. However, in many existing oscillator circuits, variations in process and temperature may lead to undesired variations in the frequency of oscillation of an oscillator circuit.
In accordance with some embodiments of the present disclosure, an oscillator may include a crystal resonator, an active element coupled in parallel with the crystal resonator and configured to produce at its output a waveform with an approximate 180-degree phase shift from its input, a voltage regulator a voltage regulator coupled to the active element, a sum of thresholds circuit coupled to the input of the voltage regulator, and a temperature-dependent current source coupled to the input of the voltage regulator. The voltage regulator may be configured to supply a supply voltage to the active element, the supply voltage a function of a reference voltage received at an input of the voltage regulator. The sum of thresholds circuit may be configured to generate the reference voltage such that the reference voltage is process-dependent. The temperature-dependent current source may be configured to generate a temperature-dependent current such that the reference voltage is temperature-dependent.
Technical advantages of one or more embodiments of the present disclosure may include a mechanism to generate a process-dependent and temperature-dependent supply voltage to an active element of an oscillator circuit, thereby reducing or eliminating process and/or temperature dependence of performance of the active element.
It will be understood that the various embodiments of the present disclosure may include some, all, or none of the enumerated technical advantages. In addition, other technical advantages of the present disclosure may be readily apparent to one skilled in the art from the figures, description and claims included herein.
For a more complete understanding of the present disclosure and its features and advantages, reference is now made to the following description, taken in conjunction with the accompanying drawings, in which:
A terminal 110 may or may not be capable of receiving signals from satellites 130. Satellites 130 may belong to a satellite positioning system such as the well-known Global Positioning System (GPS). Each GPS satellite may transmit a GPS signal encoded with information that allows GPS receivers on earth to measure the time of arrival of the GPS signal. Measurements for a sufficient number of GPS satellites may be used to accurately estimate a three-dimensional position of a GPS receiver. A terminal 110 may also be capable of receiving signals from other types of transmitting sources such as a Bluetooth transmitter, a Wireless Fidelity (Wi-Fi) transmitter, a wireless local area network (WLAN) transmitter, an IEEE 802.11 transmitter, and any other suitable transmitter.
In
System 100 may be a Code Division Multiple Access (CDMA) system, a Time Division Multiple Access (TDMA) system, or some other wireless communication system. A CDMA system may implement one or more CDMA standards such as IS-95, IS-2000 (also commonly known as “1x”), IS-856 (also commonly known as “1 xEV-DO”), Wideband-CDMA (W-CDMA), and so on. A TDMA system may implement one or more TDMA standards such as Global System for Mobile Communications (GSM). The W-CDMA standard is defined by a consortium known as 3GPP, and the IS-2000 and IS-856 standards are defined by a consortium known as 3GPP2.
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Transmit path 201 may include a digital-to-analog converter (DAC) 204. DAC 204 may be configured to receive a digital signal from digital circuitry 202 and convert such digital signal into an analog signal. Such analog signal may then be passed to one or more other components of transmit path 201, including upconverter 208.
Upconverter 208 may be configured to frequency upconvert an analog signal received from DAC 204 to a wireless communication signal at a radio frequency based on an oscillator signal provided by oscillator 210. Oscillator 210 may be any suitable device, system, or apparatus configured to produce an analog waveform of a particular frequency for modulation or upconversion of an analog signal to a wireless communication signal, or for demodulation or downconversion of a wireless communication signal to an analog signal. In some embodiments, oscillator 210 may be a digitally-controlled crystal oscillator. Oscillator 210 may be described in greater detail below with reference to
Transmit path 201 may include a variable-gain amplifier (VGA) 214 to amplify an upconverted signal for transmission, and a bandpass filter 216 configured to receive an amplified signal VGA 214 and pass signal components in the band of interest and remove out-of-band noise and undesired signals. The bandpass filtered signal may be received by power amplifier 220 where it is amplified for transmission via antenna 218. Antenna 218 may receive the amplified and transmit such signal (e.g., to one or more of a terminal 110, a base station 120, and/or a satellite 130).
Receive path 221 may include a bandpass filter 236 configured to receive a wireless communication signal (e.g., from a terminal 110, a base station 120, and/or a satellite 130) via antenna 218. Bandpass filter 236 may pass signal components in the band of interest and remove out-of-band noise and undesired signals. In addition, receive path 221 may include a low-noise amplifiers (LNA) 224 to amplify a signal received from bandpass filter 236.
Receive path 221 may also include a downconverter 228. Downconverter 228 may be configured to frequency downconvert a wireless communication signal received via antenna 218 and amplified by LNA 234 by an oscillator signal provided by oscillator 210 (e.g., downconvert to a baseband signal). Receive path 221 may further include a filter 238, which may be configured to filter a downconverted wireless communication signal in order to pass the signal components within a radio-frequency channel of interest and/or to remove noise and undesired signals that may be generated by the downconversion process. In addition, receive path 221 may include an analog-to-digital converter (ADC) 224 configured to receive an analog signal from filter 238 and convert such analog signal into a digital signal. Such digital signal may then be passed to digital circuitry 202 for processing.
Active element 312 may include any system, device or apparatus configured to produce at its output a waveform with an approximate 180-degree phase shift from its input. In some embodiments, active element 312 may include an inverter, as depicted in
Each terminal of crystal resonator 310 may also be coupled to one or more capacitors 314. Although each terminal of crystal resonator 310 is depicted as being coupled to one capacitor 314, in some embodiments each terminal of crystal resonator 310 may be coupled to a “capacitor bank” of two or more capacitors. In such embodiments, all or a portion of such capacitors may be switched capacitors, therein allowing tuning of the effective capacitance of each capacitor bank and ultimately, tuning of the output frequency of oscillator 210. In many instances, any such capacitor banks of oscillator 210 may be substantially identical.
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The input of voltage regulator 324 may be coupled as depicted in
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In oscillator circuits, performance of active elements (e.g., active element 312) is often dependent upon process variations of the oscillator circuits and variation in temperature during operation. Such process and temperature variations may cause changes in the performance of such active elements (e.g., gains, delays, etc.) that may lead to variance in the oscillation frequency of oscillator 210, or other undesirable effects.
The presence of sum of thresholds circuit 316 and programmable current source 328 may reduce such variations. For example, process variations present in components of sum of thresholds circuit 316 may be similar to process variations that may occur in components of active element 312. Accordingly, variation in reference voltage VREF generated by sum of thresholds circuit 320 may vary across processes, thus allowing voltage regulator 324 to generate a process-dependent active element supply voltage VB. Consequently, process-dependent variations of elements of active element 312 may be offset by the process-dependent supply voltage VB.
In addition, temperature sensor 322 may be configured to detect a temperature of active element 312 or one or its components, or proximate to active element 312 or one or its components, and communicate a signal to control module 326 indicative of the detected temperature. Based on such signal, control module 326 may communicate a current control signal to programmable current source 328 such that current source 328 generates a temperature-dependent current. Changes in the temperature-dependent current may cause changes in the current reference VREF, thus rendering VREF dependent upon temperature in addition to process, thus allowing voltage regulator 324 to generate a temperature-dependent active element supply voltage VB. Accordingly, temperature-dependent variations of elements of active element 312 may be offset by the temperature-dependent supply voltage VB.
Operational amplifier 402 may receive a voltage Vbandgap at its positive input terminal, and will thus produce an output of approximately Vbandgap on its negative input terminal. Vbandgap may be a process and temperature voltage generated by any appropriate components of programmable current source 328 or other component of element 200.
Each selectively enabled transistor 408 may be coupled between a corresponding resistor 406 and a ground voltage. Based on a control signal communicated by control module 326 (e.g., by reference to lookup table 330), one of selectively enabled transistors 408 may be enabled (thus coupling a terminal of its corresponding resistor 406 to ground) while all other selectively enabled transistors 408 may be disabled (thus leaving an open circuit on terminals of each of the resistors 406 corresponding to the disabled transistors 408). Accordingly, the current I passing through pass transistor 404 and current mirror transistor 410a may be approximately equal to the voltage Vbandgap divided by the resistor 406 corresponding to the enabled transistor 406. The current mirror formed by current mirror transistors 410a and 410b may cause the current I passing through transistor 410a to be mirrored by transistor 410b, and such current I may be output to sum of thresholds circuit 316 depicted in
Modifications, additions, or omissions may be made to system 100 from the scope of the disclosure. The components of system 100 may be integrated or separated. Moreover, the operations of system 100 may be performed by more, fewer, or other components. As used in this document, “each” refers to each member of a set or each member of a subset of a set.
Although the present disclosure has been described with several embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims.