The present invention relates to a process and a device for removing deep sub-micron particles from water, particularly the removal of deep sub-micro particles in waste water discharged from the chemical mechanical polishing, grinding and dicing saw of wafers in the semiconductor fabrication and encapsulation processes.
Along with the trend of highly integration and miniaturization of line width in the semiconductor, the influence on the mass production of wafers caused by the micro-pollutions of metals, micro particles and organic compounds in the ultra-pure water also increases dramatically. Therefore, “how to remove micro-pollutions” will be a key issue in elevating the production level of the next generation chips. In the removal of micro particles, the size of the micro particles concerned has decreased from the micron level to the deep sub-micron level. Therefore, the technology of removing deep sub-micron particles from water has become one of the bottleneck technologies in producing a next generation high integration semiconductor chips.
Moreover, the importance of removing deep sub-micron particles in water in the recovery of waste water from the semiconductor industry is gradually becoming more significant. Due to the mass production of wafers in recent years, a large amount of waste water is produced and contains a high concentration of deep sub-micron particles, which is difficult to be treated, during grinding and dicing saw prior to the encapsulation operation of the chips. The similar situation has occurred in the semiconductor device fabrication industry. A large amount of waste water containing deep sub-micron particles is also generated due to the introduction of chemical mechanical polishing (CMP). Statistic data shows that in 1998, the CMP processes produced about 225 million gallons of waste water contaminated by deep sub-micron particles. Based on estimation, after 2000, the water consumption by the CMP processes will be 30% to 40% of the total water consumption by the semiconductor device fabrication industry, and the amount of waste water is expected to exceed 450 million gallons in 2006.
The conventional methods in separating particles from water include the chemical coagulation and flocculation methods by chemical mechanisms, and the distillation and membrane filtration methods by physical mechanisms. While applied on the removal of deep sub-micron particles, the former methods require the use of a large amount of coagulants and flocculants to achieve the desired results, generating a relatively large amount of sludge, and the amount of water recovered can only reach about 60%. The latter methods generally can obtain a high percentage and a high quality of water recovery. However, a distillation method requires a massive energy consumption, which is not practically acceptable to the industry; and a membrane filtration method often faces the problems of membrane fouling and low production of water per membrane unit area.
Based on the experiences over the years on the production of ultra-pure water and the recovery of waste water for the semiconductor industry, as well as on the understandings of the properties of the waste water from chemical mechanical polishing, the inventors of the present invention will disclose in the following an electrocoagulation module, which combines electrocoagulation and electro-oxidation mechanisms, and can further link to an ultra-filtration module, to effectively and successfully treat the waste water containing a large amount of deep sub-micron particles discharged from a semiconductor device fabrication and encapsulation processes.
The following table compares the present invention with prior arts regarding the functions, means and results of the treatment:
A primary objective of the present invention is to provide a process and an apparatus for removing deep sub-micron particles from water by combining electrocoagulation and electro-oxidation mechanisms. The present invention can be applied to the treatment and recovery of waste water containing deep sub-micron particles, e.g. waste water discharged from a semiconductor production and encapsulation process. A module constructed according to the present invention for removing deep sub-micron particles from water comprises:
Preferably, the module of the present invention further comprises an air injector for providing a sufficient mixing between the effluent from said front adjustment tank and air prior to said effluent entering said electrocoagulation reaction tank.
Preferably, the module of the present invention further comprises a recycling mechanism, which comprises a recycling pipeline for recycling a portion of the effluent of said electrocoagulation reaction tank to merge with the effluent of said front adjustment tank; an outflow pipeline for discharging the other portion of said effluent of said electrocoagulation reaction tank to said rear adjustment tank; and one or more valves for controlling the flow rate ratio of the recycled portion to the discharged other portion.
Preferably, said recycling mechanism in the invented module comprises a flow control valve located on said outflow pipeline; another flow control valve and a check valve located on said recycling pipeline.
Preferably, the module of the present invention further comprises an addition pump for adding a H2O2 solution to said front adjustment tank, said electrocoagulation tank, or said recycling pipeline.
Preferably, said sedimentation reservoir of the module according to the present invention comprises an overflow trough with an adjustable height for adjusting the residence time.
Preferably, the module of the present invention further comprises one or more auxiliary electrocoagulation reaction tanks connected in series or in parallel to said electrocoagulation reaction tank.
The present invention also discloses a system for removing deep sub-micron particles from water, which comprises the abovementioned module of the present invention and one or more auxiliary purification components connected in series. Said auxiliary purification components are a membrane processing component, an ion exchange component, an activated carbon adsorption component, a degassing component, a filtration component, or an ultra-filtration membrane component, for further purifying an effluent from a previous stage thereof.
The present invention also discloses a system for removing deep sub-micron particles from water, which comprises a plurality of the abovementioned modules of the present invention connected in series and, optionally, one or more auxiliary purification components connected in series between two adjacent modules. Said auxiliary purification components are a membrane processing component, an ion exchange component, an activated carbon adsorption component, a degassing component, a filtration component, or an ultra-filtration membrane component, for further purifying the effluent from a previous stage thereof.
The present invention also discloses a method for removing deep sub-micron particles from water, which comprises the following steps:
(d) applying a sedimentation, centrifugation and/or filtration treatments on the adjusted water from Step (c) to remove deep sub-micron particles from the adjusted water.
Preferably, the concentration of H2O2 in Step (a) is 35% or H2O2 is replaced by an equivalent oxidation agent.
Preferably, Step (d) of the method according to the present invention comprises sedimentation, pre-filtration, and ultra-filtration membrane filtration treatments.
Preferably, Step (b) of the method according to the present invention further comprises recycling a portion of an effluent from said electrocoagulation reaction tank to said electrocoagulation reaction tank.
Preferably, the method according to the present invention further comprises mixing the resulting water from Step (a) with air to form a gas-liquid mixture before performing Step (b).
Preferably, in Step (b) of the method according to the present invention, a residence time of the resulting water from Step (a) in said electrocoagulation reaction tank is 1˜30 minutes.
The removal of deep sub-micron particles from water according to the present invention uses a new technology where an oxidation agent such as H2O2 is added into an electrocoagulation reaction tank so that the oxidation decomposition of an organic dispersing agent is carried out concurrently to the electrocoagulation reaction. The slurry composition used by the chemical mechanical polishing, grinding of wafer surface, and dicing saw operations in a semiconductor production and encapsulation process often contains such an organic dispersing agent. Such an organic dispersing agent is one of the major reasons of the difficulties in removing deep sub-micron particles from the process waste water. The present invention uses a double mechanism of a combination of electrocoagulation and electro oxidation to enable deep sub-micron particles forming large particles of flocculation which are precipitated by gravity, and uses a rear treatment step together with an ultra-filtration module, etc. to achieve the removal of deep sub-micron particles from water.
A waste water containing deep sub-micron particles can be re-generated into pure water free of deep sub-micron particles by the abovementioned steps and process. A lot of the waste water containing deep sub-micron particles from industrial processes can be recycled by a process and a device for removing deep sub-micron particles from water according to the present invention.
A preferred embodiment of a module for removing deep sub-micron particles from waste water according to the present invention is shown in
A module as shown in
The front adjustment tank adjusted the pH value of the waste water to 4 and the conductivity to 0.5 ms/cm. H2O2 was added into the waste water at a ratio of 1:0.005 (water:H2O2 aqueous solution). The current in the electrocoagulation reaction tank was controlled at 1 A. The recycled flow and the effluent were controlled so that the residence time of the waste water in the electrocoagulation reaction tank was maintained at 15 minutes. The rear adjustment tank adjusted the pH value of the effluent from the electrocoagulation reaction tank from 8.8 to 4.5. The residence time of the sedimentation reservoir was set to be 3 hours. After the abovementioned steps, the effluent contained 0.003% of deep sub-micron particles, and had a removal rate of 98.5%. The effluent was processed by an ultra-filtration module operated at a filtration rate of 2 m/sec, a pressure difference of 25 psi. The filtered water flow was 18.7 liter/minute. The filtrate measured contained no deep sub-micron particles. The removal rate in the entire process was 100%.
Number | Date | Country | Kind |
---|---|---|---|
90131953 | Dec 2001 | TW | national |
Number | Date | Country | |
---|---|---|---|
Parent | 10310875 | Dec 2002 | US |
Child | 10962616 | Oct 2004 | US |