The present invention relates to electret condenser microphones, and, more particularly, to a system and method for improved RF immunity of an electret condenser microphone.
Electret condenser microphones find application in a myriad of applications. For example, speakerphones and telephone handsets often use electret condenser microphones. Speakerphones generally are a high gain system that may use small electret condenser microphones and use radio frequency (“RF”) technology to transmit and receive voice data. Handsets often use lower microphone gain as the microphone is close to the desired audio source, i.e., a voice.
The RF technology often used in systems including electret condenser microphones are common RF modulation schemes, such as the global system for mobile communication (“GSM”) standard, the digital enhanced cordless telecommunications (“DECT”) standard, cellular standards, or the time division multiple access (“TDMA”) standard. These common schemes generally send data in bursts or packets over microwave frequency bands. The RF signal is demodulated at the microphone's junction field effect transistor (“JFET”) internal amplifier. This demodulation corrupts the audio output signal with objectionable noise.
More specifically, in these transmission schemes, the carrier transmits the audio in the form a digital burst or data packet that is compressed in time. Such compression causes the RF energy to be transmitted in bursts. Demodulation, by the PN junction of the JFET amplifier in the microphone of the energy bursts, can result in audible interference, and, hence, corruption of the audio output signal. Typical transmission rates for these time multiplexed packets are on the order of 5, 10, or 20 milliseconds of voice data transmitted in a much shorter duration packet each 5, 10, or 20 millisecond period.
The microphone cable, i.e., the connecting cable connected to the terminals of the microphone and the system of which the microphone is a part, normally acts like an antenna. Thus, the microphone cable picks up some of the RF energy being transmitted by the system that contains the microphone, and then conducts the picked up RF energy to the microphone terminals.
Prior art systems may be useful in applications where microphone gain is not too high, such as handset use where the microphone is close to the mouth) and does not require much amplification of the microphone's output signal. In cases, such as wireless speakerphones, that require much higher microphone gains, in addition to the placement of capacitors, are generally not effective and, thus, the microphone element usually must be shielded by using ferrite beads, conductive tape, or other methods to reduce the RF energy seen by the JFET amplifier. Such shielding assists in preservation of a reasonable signal to noise ratio, but adds significant expense to the manufacture of such electret condenser microphones.
It is desired to provide a system and method with improved RF immunity for an electret condenser microphone. It is also desired for such a system and method to be effective in systems using common RF transmission schemes. It is further desired to provide a system and method that does not introduce significant cost to the manufacture of a system including at least one electret condenser microphone.
The present invention involves the placement of capacitors in a new and novel position and geometry on the back of the electret condenser microphone. The invention allows for minimization of the RF magnetic fields seen by the internet JFET amplifier from RF energy conducted to the microphone by the microphone's connecting cable.
In one embodiment, the electret condenser microphone comprises a printed wire board, an amplifier having a longitudinal axis, and a capacitor having a longitudinal axis. The amplifier and capacitor are mounted on the printed wire board such that the longitudinal axis of the capacitor is perpendicular to the longitudinal axis of the amplifier.
In another embodiment, the electret condenser microphone comprises a printed wire board, an amplifier having a longitudinal axis mounted on the printed wire board, and a plurality of capacitors each having a longitudinal axis. The plurality of capacitors are also mounted on the printed wire board in a manner such that magnetic fields generated by RF currents flowing through each of the plurality of capacitors tend to cancel each other in the vicinity of the amplifier.
According to one method of the present invention to improve RF immunity of an electret condenser microphone, first, an electret condenser microphone comprising a single capacitor according to the present invention is provided, and, second, current is provided to the capacitor to result in creation of a magnetic field about the longitudinal axis of the capacitor. According to another method, first, an electret condenser microphone comprising a plurality of capacitors is provided, and, second, current is provided to the plurality of capacitors such that the magnetic fields generated by RF currents flowing through each of the plurality of capacitors tend to cancel each other the vicinity of the amplifier.
Another method of the present invention comprises the first step of providing a printed wire board, an amplifier having a longitudinal axis, and a capacitor having a longitudinal axis. Next, the amplifier is mounted on the printed wire board. Then, the capacitor is mounted on the printed wire board such that the longitudinal axis of the capacitor is perpendicular to the longitudinal axis of the amplifier. In another embodiment of such method, the first step involves provision of a printed wire board, an amplifier having a longitudinal axis, and a plurality of capacitors each having a longitudinal axis. The amplifier is then mounted on the printed wire board. Next, the plurality of capacitors are mounted on the printed wire board in a manner such that magnetic fields generated by RF currents flowing through each of the plurality of capacitors tend to cancel each other in the vicinity of the amplifier.
The electret condenser microphone and methods of the present invention significantly reduce the generation of magnetic fields to affect the amplifier when compared to the prior art. Thus, the RF immunity of the electret condenser microphone is improved. This advantage is realized in a cost effective manner and by the use of common electronic components and methods.
The present invention comprises a system and method for improving RF immunity of an electret condenser microphone.
Referring now to
In this embodiment of the prior art shown in
Referring now to
Referring now to
It will be appreciated by those of skill in the art that the use of two capacitors, such as in the embodiment of
It will be appreciated by those of skill in the art that the present invention uses physical capacitors for RF immunity of electret condenser microphones. Prior art microphones place capacitors across the JFET on the back of the microphone or inside the microphone in parallel with the JFET. This placement is without regard to the magnetic field that RF currents flowing through the capacitor create around the capacitor. In contrast, the present invention uses placement of the capacitors in a new geometry that minimizes the RF magnetic fields seen by the JFET amplifier.
It will be further appreciated by those of skill in the art that a “distributed” capacitance could be used in place of the discrete capacitor component. Such distributed capacitance consists of parallel plates on the printed wire board (“PWB”) that are circular in fashion, with the JFET amplifier located in the center of the circle. Such distributed capacitance is contemplated to be within the scope of the present invention.
It will be yet further appreciated that the present invention reduces the amount of electrical noise caused by demodulation of RF when the RF system uses a burst-based or packet-based transmission scheme. As shown in
It will also be appreciated that, while
In view of the many possible embodiments to which the principles of these invention may be applied, it should be recognized that the detailed embodiments are illustrative only and should be taken as limiting the scope of the invention. Rather, the invention comprises all such embodiments as may come within the scope and spirit of the invention and equivalents thereto.
This is a non-provisional patent application based on U.S. provisional patent application Ser. No. 60/631,065, filed Nov. 24, 2004.
Number | Date | Country | |
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60631065 | Nov 2004 | US |