Patent Application
20220027228
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system (IHS) generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
Use cases for information handling systems are causing progressively larger number of information handling systems to be disposed near each other. For example, rack mount systems utilize a rack structure to stack many information handling systems in a vertical arrangement. Due to the changing uses of information handling systems, chassis of information handling systems may modular. That is, a chassis may be composed of multiple enclosures that may be attached to each other to form the chassis of the information handling systems. When the multiple enclosures are attached, components of the information handling system disposed in each of the enclosures may become operably connected to each other.
In one aspect, a computing device of an information handling system in accordance with one or more embodiments of the invention includes an environmental control component and a chassis environmental manager. The chassis environmental manager obtains a temperature of an environment proximate to a component of the information handling system; obtains a humidity level of the proximate environment; obtains, based on the temperature and the humidity level, a corrosion rate of the component; makes a determination that the corrosion rate indicates a premature failure of the component based on a service life of the component; and in response to the determination: obtains an environmental control modification that mitigates the premature failure; and updates an operation of the environmental control component based on the environmental control modification.
In one aspect, a method for environmentally managing a computing device of an information handling system in accordance with one or more embodiments of the invention includes obtaining a temperature of an environment proximate to a component of the computing device; obtaining a humidity level of the proximate environment; obtaining, based on the temperature and the humidity level, a corrosion rate of the component; making a determination that the corrosion rate indicates a premature failure of the component based on a service life of the component; and in response to the determination: obtaining an environmental control modification that mitigates the premature failure; and updating an operation of an environmental control component based on the environmental control modification.
In one aspect, a non-transitory computer readable medium includes computer readable program code, which when executed by a computer processor enables the computer processor to perform a method for environmentally managing a computing device of an information handling system, the method in accordance with one or more embodiments of the invention includes obtaining a temperature of an environment proximate to a component of the computing device; obtaining a humidity level of the proximate environment; obtaining, based on the temperature and the humidity level, a corrosion rate of the component; making a determination that the corrosion rate indicates a premature failure of the component based on a service life of the component; and in response to the determination: obtaining an environmental control modification that mitigates the premature failure; and updating an operation of an environmental control component based on the environmental control modification.
Certain embodiments of the invention will be described with reference to the accompanying drawings. However, the accompanying drawings illustrate only certain aspects or implementations of the invention by way of example and are not meant to limit the scope of the claims.
Specific embodiments will now be described with reference to the accompanying figures. In the following description, numerous details are set forth as examples of the invention. It will be understood by those skilled in the art that one or more embodiments of the present invention may be practiced without these specific details and that numerous variations or modifications may be possible without departing from the scope of the invention. Certain details known to those of ordinary skill in the art are omitted to avoid obscuring the description.
In the following description of the figures, any component described with regard to a figure, in various embodiments of the invention, may be equivalent to one or more like-named components described with regard to any other figure. For brevity, descriptions of these components will not be repeated with regard to each figure. Thus, each and every embodiment of the components of each figure is incorporated by reference and assumed to be optionally present within every other figure having one or more like-named components. Additionally, in accordance with various embodiments of the invention, any description of the components of a figure is to be interpreted as an optional embodiment, which may be implemented in addition to, in conjunction with, or in place of the embodiments described with regard to a corresponding like-named component in any other figure.
In general, embodiments of the invention relate to systems, devices, and methods for managing components of an information handling system. An information handling system may be a system that provides computer implemented services. These services may include, for example, database services, electronic communication services, data storage services, etc.
To provide these services, the information handling system may include one or more computing devices. The computing devices may include any number of computing components that facilitate providing of the services of the information handling system. The computing components may include, for example, processors, memory modules, circuit cards that interconnect these components, etc.
During operation, these components may be exposed to gases that may cause the components to corrode. Corrosion may cause the components to fail prior to the computing device meeting its service life goals.
Embodiments of the invention may provide methods and systems that reduce the risk of corrosion related failures in information handling systems. To reduce the risk of corrosion related failures, the system may manage the components based, in part, on their risk of corrosion. To monitor their risk of corrosion, both the temperature and humidity level of the environment proximate to the components may be monitored. The temperature and humidity level may be used to ascertain how quickly the components are likely to be corroding. If the rate of corrosion is sufficient to risk premature failure of the components due to corrosion, the system may modify the environment proximate to the components to decrease the rate of corrosion.
To modify the environment, the system may increase the temperature of the ambient environment. For example, the system may decrease fan speeds or take other measures to cause the temperature of the environment proximate to the components to increase. Such increases may be implemented even when a component is operating outside of its nominal operating temperature range.
The system may also, for example, increase the temperature of gases being taken into the chassis of the information handling system, decrease the amount of water vapor in gases being taken into the chassis of the information handling system, or take other action to modify the temperature and/or humidity level in a manner that is likely to reduce the rate of corrosion. The rate of corrosion may be reduced to a level that the information handling system is likely to meet its service life goal prior to its components failing due to corrosion.
By doing so, a system in accordance with embodiments of the invention may be less likely to prematurely fail, be more likely to meet its service life goal, be able to accept a wider range of intake gas conditions, and/or may be less costly to operate by reducing the level of conditioning of gases taken into the chassis of the information handling systems.
The frame (110) may be a mechanical structure that enables chassis to be positioned with respect to one another. For example, the frame (110) may be a rack mount enclosure that enables chassis to be disposed within it. The frame (110) may be implemented as other types of structures adapted to house, position, orient, and/or otherwise physically, mechanically, electrically, and/or thermally manage chassis. By managing the chassis, the frame (110) may enable multiple chassis to be densely packed in space without negatively impacting the operation of the information handling system (10).
A chassis (e.g., 100A) may be a mechanical structure for housing components of an information handling system. For example, a chassis may be implemented as a rack mountable enclosure for housing components of an information handling system. The chassis may be adapted to be disposed within the frame (110) and/or utilize services provided by the frame (110) and/or other devices.
Any number of components may be disposed in each of the respective chassis (e.g., 100A, 100B, 100C). These components may be portions of computing devices that provide computer implemented services, discussed in greater detail below.
When the components provide computer implemented services, the components may generate heat. For example, the components may utilize electrical energy to perform computations and generate heat as a byproduct of performing the computations. If left unchecked, buildup of heat within a chassis may cause temperatures of the components disposed within the chassis to exceed preferred ranges.
The preferred ranges may include a nominal range in which the components respectively operate: (i) without detriment and/or (ii) are likely to be able to continue to operate through a predetermined service life of a component. Consequently, it may be desirable to maintain the temperatures of the respective components within the preferred range (e.g., a nominal range).
When a component operates outside of the preferred range, the service life of the component may be reduced, the component may not be able to perform optimally (e.g., reduced ability to provide computations, higher likelihood of error introduced into computations, etc.), and/or the component may be more likely to unexpectedly fail. The component may be subject to other undesirable behavior when operating outside of the preferred range without departing from the invention.
To operate components within the preferred range or temperature, the chassis may include air exchanges (e.g., 102). An air exchange (102) may be one or more openings in an exterior of a chassis that enables the chassis to exchange gases with an ambient environment. For example, a chassis may utilize air exchanges to: (i) vent hot gases and (ii) intake cool gases. By doing so, the temperature of the gases within the chassis may be reduced. Consequently, the temperatures of components within the chassis may be reduced by utilizing the cooler gases taken into the chassis via an air exchange.
However, utilizing gases to cool components within a chassis may be problematic. The gases may not be benign. For example, the gases may be (i) chemically reactive, (ii) include humidity, and/or (iii) otherwise interact with components disposed within the chassis in an undesirable manner. The reaction between the gases used to cool the components and the components themselves (or other components proximate to the to-be-cooled components) may negatively impact the components disposed within the chassis.
For example, if the gases include a chemically reactive component (e.g., chlorine species), the gases may react (i.e., chemically react) with portions of the components disposed within the chassis. These reactions may damage portions of the components resulting in a decreased service life of the components.
In another example, if the gases include humidity, the humidity may condense resulting in water being disposed on the surface of the components. When water is disposed on the surface of components (even at very small levels), the water may chemically react with the components forming corrosion. The aforementioned reactions with the condensed water may damage the components.
The potential reactions, discussed above, may cause numerous negative impacts. First, the reactions may impact the conductivity of various components. For example, when metals react with chemically reactive species, condensed water vapor, etc., the metals may form chemical compounds that are substantially less conductive than the pure metals. The reduced conductivities of the components may negatively impact the electrical functionality of the components (e.g., circuits) disposed within the chassis.
Second, the reactions may impact the physical size of various components. For example, when metals chemically react, the products formed by the reactions may occupy significantly larger volumes than the unreacted metals. The change in volumes of the reacted metals may negatively impact the electrical functionality of the components by, for example, forming open circuits by physically disconnecting various portions of the components.
The potential reactions may cause other negative impacts beyond those discussed herein.
To address the above and/or other potential issues, embodiments of the invention may provide methods, devices, and systems that manage environments within chassis. The environments may be managed to prevent the occurrence of reactions between gases and components that result in a reduction of the service life of (i) the component, (ii) a computing device of which the component is a member, and/or (iii) an IHS that incorporates the component.
For example, an environment within a chassis may be managed by reducing the likelihood of chemical reactions occurring due to the presence of condensed water vapor. To reduce the likelihood of chemical reactions occurring, the temperature and/or humidity level (e.g., relative humidity) may be manipulated to: (i) reduce the likelihood of condensation from occurring and/or (ii) ensure that temperatures of components are within the predetermined ranges in which the operation of the components is nominal.
To further clarify the processes of managing the environments within the chassis, a diagram of an exemplary environment in which a chassis may reside is illustrated in
Turning to
To facilitate gas management within the building (115), the information handling systems may be organized into rows (or other groupings of information handling systems). In
The supply airflow (122) may be at a lower temperature than the return airflow (124). Consequently, when information handling systems obtain portions of the supply airflow (122), the information handling systems may be able to utilize the supply airflow (122) to cool components disposed within the chassis of the information handling systems. For example, gases from the supply airflow (122) may be passed by components disposed within chassis of information handling systems that are at elevated temperatures. The gases may be at a lower temperature than the components. Consequently, thermal exchange between the gases in the components may decrease the temperature of the components.
After utilizing the gases from the supply airflow (122), the information handling systems may exhaust the gases as the return airflow (124). After being exhausted from the information handling systems, the return airflow (124) may be obtained by the airflow conditioner (120), cooled, and recirculated as the supply airflow (122).
In addition to cooling the return airflow (124), the airflow conditioner (120) may be capable of obtaining gases them other areas (e.g., outside of the building), reducing the humidity level of an airflow, and/or otherwise conditioning gases for use by information handling systems and/or other devices.
To manage the aforementioned process, a system environmental manager (130) may be disposed within the building (115) or at other locations. The system environmental manager (130) may be a computing device programmed to: (i) obtain information regarding the operation of the information handling systems and/or (ii) set the operating points of the airflow conditioner (120). By doing so, the system environmental manager (130) may cause the airflow conditioner (120) to provide gases to the information handling systems having a temperature and/or humidity level that may better enable the information handling systems to better regulate their respective environmental conditions within the chassis of the information handling systems.
The airflow conditioner (120) may include functionality to granularly, or at a macro level, modify the temperature and/or humidity level of the supply airflow (122). Consequently, different information handling systems (or groups thereof) may receive different supply airflows (e.g., 122) having different characteristics.
Conditioning the return airflow (124) or gases obtained from outside of the building (115) may be costly, consume large amount of electricity, or may otherwise be undesirable. To reduce these costs, the system environmental manager (130) may set the operating point (e.g., desired temperature/humidity levels of different portions of the supply airflow (122)) of the airflow conditioner (120) to only provide the minimum necessary characteristics. By doing so, the cost of providing the supply airflow (122) having characteristics required to meet the environmental requirements of the chassis of the information handling systems may be reduced.
To decide how to set the operating points of the airflow conditioner (120), the system environmental manager (130) may obtain and/or be providing information regarding the environmental conditions within each of the chassis. For example, the system environmental manager (130) may be operably connected to environmental managers of each of the chassis and/or the airflow conditioner (120) via any combination of wired and/or wireless networks. The respective environmental managers of the chassis may provide such information to the system environmental manager (130) and/or service requests regarding the operating points of the airflow conditioner (120) via the operable connections.
The system environmental manager (130) may be implemented as a computing device. For additional details regarding computing devices, refer to
Turning to
Because the computing device uses computing components (140) to provide services, the ability of the computing device to provide services is limited based on the number and/or quantity of computing devices that may be disposed within the chassis. For example, by adding additional processors, memory modules, and/or special purpose hardware devices, the computing device may be provided with additional computing resources which it may be used to provide services. Consequently, large number of computing components that each, respectively, generate heat may be disposed within the chassis.
To maintain the temperatures of the computing components (140) (and/or other types of components) within a nominal range, gases may be taken in through an air exchange (102). The gases may be passed by the computing components (140) to exchange heat with them. The heated gases may then be expelled out of another air exchange (102).
However, by intaking and expelling gases used for cooling purposes, the components disposed within the chassis (100A) may be subject to degradation. For example, as discussed above, the gases may include components such as humidity that may cause chemical reactions to occur. The chemical reactions may damage the structure and/or change the electrical properties of the computing components (140). These changes may negatively impact the ability of the computing device to provide its functionality.
For example, the computing device may have a service life during which it is expected that the computing device will be likely to provide its functionality. However, changes in the structure and/or electrical properties of these components due to exposure to humidity or other components of the gases used for temperature regulation purposes may cause the components to prematurely fail ahead of the service life of the computing device.
In general, embodiments of the invention provide methods, devices, and systems for managing the internal environments of chassis to reduce the likelihood of premature failure of computing components (140). By reducing the likelihood of the occurrence of premature failures of computing components, the computing devices disposed within the chassis (100A) may be more likely to meet their respective service life goal, have a lower operation cost, and/or require fewer repairs during service life. For additional details regarding the computing components (140), refer to
To manage the internal environment (104) of the chassis, the chassis (100A) may include a chassis environmental manager (150). The chassis environmental manager (150) may provide environmental management services. Environmental management services may include: (i) obtaining information regarding the temperature of components and/or airflows disposed within the chassis, (ii) obtaining information regarding the relative humidity level of the internal environment (104) of the chassis, (iii) determining, based on the obtained temperature and/or humidity level information, estimates regarding the rates of chemical changes occurring in the chassis, and (iv) modifying the operation (e.g., modifying operating points) of environmental control components (152) and/or characteristics of gases taken into the chassis to reduce the likelihood of premature failure of components disposed within the chassis (100A). For additional details regarding the chassis environmental manager (150), refer to
While illustrated in
To enable the chassis environmental manager (150) to provide its functionality, the chassis (100A) may include a humidity detector (154) and a temperature detector (156). These detectors may enable the relative humidity level and temperature within the internal environment (104) to be determined. These detectors may be implemented as sensors or other types of physical devices that are operably connected to the chassis environmental manager (150). In some embodiments of the invention, the functionality of the humidity and temperature detectors may be provided by, in all or in part, the computing components (140). For example, the computing components (140) may include functionality to report their respective temperatures and/or temperatures of the internal environment (104) of the chassis (100A).
The chassis (100A) may also include environmental control components (152). The environmental control components (152) may include physical devices that include functionality to modify characteristics (e.g., temperature, humidity level, airflow rates/directions) of the internal environment (104). The chassis (100A) may include any number of environmental control components disposed at any number of locations within the chassis.
For example, the environmental control components (152) may include gas movers such as fans. The fans may be able to modify the rate of gases being taken into and expelled from the chassis (100A) through the air exchangers (e.g., 102). The rate of intake and exhaust of gases may cause an airflow to be generated within the internal environment. The airflow may be used to modify the rate of thermal exchange between the computing components (140) and the internal environment (104).
In another example, the environmental control components (152) may include heaters. The heaters may be able to modify the temperature of the internal environment (104). For example, heaters may be disposed at a front of the chassis and/or about different locations within the chassis. These heaters may be used to generally and/or locally heat the internal environment (104). By doing so, the relative humidity level and temperature of the internal environment (104) proximate to the computing components (140) and/or different components may be controlled.
In a still further example, the environmental control components (152) may include components that are not disposed in the chassis (not shown). For example, the environmental control components may include an airflow conditioner discussed with respect to
The chassis (100A) may include any number and type of environmental control components without departing from the invention. Any of the environmental control components may be implemented using physical devices operably connected to and controllable by the chassis environmental manager (150) and/or a system environmental manager (e.g., 130,
To cooperatively operate, the chassis environmental managers and system environmental managers may be operably connected to one another (e.g., via wired and/or wireless networks). The aforementioned components may share information with one another (e.g., sensor data, operating set points of different environmental control components, etc.). These components may implement any type of model for controlling and/or delegating control of the system for temperature and/or relative humidity level management purposes. When providing their respective functionalities, these components may perform all, or a portion, of the methods illustrated in
While the chassis (100A) of
As discussed above, the chassis (100A) may house computing components (140). Turning to
The computing components (140) may include any number of hardware devices (142). The hardware devices (142) may include, for example, packaged integrated circuits (e.g., chips). The hardware devices (142) may enable any number and type of functionalities to be performed by a computing device.
The computing components (140) may also include a circuit card (144). The circuit card (144) may enable any of the hardware devices (142) to be operably connected to one another and/or other components not illustrated in
The circuit card (144) may include traces (146) that electrically interconnect various hardware devices (142) to one another and/or other components not illustrated in
Returning to the hardware devices (142), these devices may consume electrical power and generate heat as a byproduct of performing their functionality. Further, the hardware devices (142) may have some sensitivity to temperature. For example, the hardware devices (142) may only operate nominally (e.g., as designed) when the temperatures of the respective hardware devices (142) are maintained within a predetermined temperature range. Consequently, all, or a portion, of the hardware devices (142) may require some level of cooling to continue to operate nominally.
As discussed above, to facilitate cooling of the hardware devices (142), airflows within the chassis may be generated by environmental control components such as fans, heaters, etc. The airflows may cause gases that are at different temperatures and/or relative humidity levels to be taken into the chassis, used for cooling purposes, and then expelled from the chassis.
However, this processes may be problematic because the gases used for cooling purposes may also contribute to corrosion being formed on, for example, the traces (146), interconnections between the traces (146) and the hardware devices (142), etc. For example, when the traces (146) are exposed to gases that include humidity, the metals of the traces (146) may react with the gases thereby forming corrosion.
The corrosion may, if kept to a low level, not impact the ability of the hardware devices (142) to perform their functionality over the course of the desired lifetime of a computing device. In contract, if the rate of corrosion rises to a high enough level, the corrosion may negative impact the ability the hardware devices (142) to perform their respective functionalities to a level that causes the computing device to fail. Consequently, the computing device and corresponding IHS may fail prior to it meeting its desired service life.
For example, if an IHS has a desired service life of five years, corrosion may cause one of the traces (146) to fail prior to five years of service thereby causing the IHS to prematurely fail.
While the computing components (140) are illustrated in
To reduce the likelihood of premature failure of IHSs, an IHS in accordance with embodiments of the invention may include a chassis environmental manager. Turning to
As discussed above, the environmental manager (200) may provide environmental management services. Environmental management services may reduce the likelihood that IHSs may fail prematurely due to corrosion of components of the IHSs.
In one or more embodiments of the invention, the environmental manager (200) is implemented using computing devices. The computing devices may be, for example, mobile phones, tablet computers, laptop computers, desktop computers, servers, distributed computing systems, embedded computing devices, or a cloud resource. The computing devices may include one or more processors, memory (e.g., random access memory), and persistent storage (e.g., disk drives, solid state drives, etc.). The persistent storage may store computer instructions, e.g., computer code, that (when executed by the processor(s) of the computing device) cause the computing device to provide the functionality of the environmental manager (200) described through this application and all, or a portion, of the methods illustrated in
In one or more embodiments of the invention, the environmental manager (200) is implemented using distributed computing devices. As used herein, a distributed computing device refers to functionality provided by a logical device that utilizes the computing resources of one or more separate and/or distinct computing devices. For example, in one or more embodiments of the invention, the environmental manager (200) is implemented using distributed devices that include components distributed across any number of separate and/or distinct computing devices. In such a scenario, the functionality of the environmental manager (200) may be performed by multiple, different computing devices without departing from the invention.
To provide environmental management services, the environmental manager (200) may include an environmental component manager (202) and a storage (204). Each of these components are discussed below.
The environmental component manager (202) may manage the components of the chassis and/or other components that may be used to control the characteristics (e.g., temperature, humidity level, airflow rates, etc.) of the internal environment of the chassis. To manage the aforementioned components, the environmental component manager (202) may: (i) obtain information regarding the environmental conditions within the chassis, (ii) determine, using the environmental information, estimates regarding corrosion that may be occurring within the chassis, (iii) determine, using the corrosion rates, whether it is likely that an IHS will meet its service life goals, and (iv) if the IHS is unlikely to meet it service life goals, modify the characteristics of the internal environment of the chassis to improve the likelihood that the IHS will meet is service life goals.
To obtain information regarding the environmental conditions, the environmental component manager (202) may request such information from computing components (e.g., temperatures), sensors (e.g., temperature sensors and/or humidity sensors), and/or other types of devices (e.g., components external to the chassis). In response, the aforementioned components may provide the requested information to the environmental component manager (202). The environmental component manager (202) may store the aforementioned information as part of an environmental condition repository (208).
To determine the likely corrosion rates, the environmental component manager (202) may using a corrosion rate repository (210) to calculate the likely corrosion rates of various components based on the information included in the environmental condition repository (208). For example, the corrosion rate repository (210) may include tables that specify, as a function of temperature and relative humidity, the likely rate of corrosion occurring with respect to various components disposed within a chassis.
To ascertain whether a computing device is likely to prematurely fail due to corrosion, the environmental component manager (202) may determine a total amount of corrosion that has likely occurred, estimate the rate that will occur in the future based on the current environmental conditions, and use the previous amount and current rate to determine whether the computing device is likely to prematurely fail. To make this determination, the environmental component manager (202) may utilize a lifecycle repository (212). The lifecycle repository (212) may specify information that may be used to ascertain whether a premature failure will occur based on corrosion. For example, the lifecycle repository (212) may specify a total amount of corrosion that will cause various components of a computing device to fail. Based on this aggregate amount, the corrosion rate and previous amount of corrosion that has already occurred to ascertain whether the amount specified by the lifecycle repository (212) will be exceeded prior to the occurrence of the service life of the computing device occurring.
If it is determined that the computing device will prematurely fail, the environmental component manager (202) may modify the operation of one or more environmental control components to reduce the corrosion rate within the chassis. For example, the environmental component manager (202) may increase the ambient temperature within the chassis, decrease the relative humidity level, modify airflow rates within the chassis, and/or otherwise modify the internal environment of the chassis to reduce the rate that corrosion occurs in the chassis. By doing so, the point in time at which the computing device is likely to fail due to corrosion may be pushed into the future thereby reducing the likelihood that the computing device will prematurely fail ahead of its service life being completed without failure.
When providing its functionality, the environmental component manager (202) may utilize the storage (204) by storing and using previously stored data structures.
To provide the above noted functionality of the environmental component manager (202), the environmental component manager (202) may perform all, or a portion, of the methods illustrated in
In one or more embodiments of the invention, the environmental component manager (202) is implemented using a hardware device including circuitry. The environmental component manager (202) may be implemented using, for example, a digital signal processor, a field programmable gate array, or an application specific integrated circuit. The environmental component manager (202) may be implemented using other types of hardware devices without departing from the invention.
In one or more embodiments of the invention, the environmental component manager (202) is implemented using computing code stored on a persistent storage that when executed by a processor performs all, or a portion, of the functionality of the environmental component manager (202). The processor may be a hardware processor including circuitry such as, for example, a central processing unit or a microcontroller. The processor may be other types of hardware devices for processing digital information without departing from the invention.
In one or more embodiments disclosed herein, the storage (204) is implemented using devices that provide data storage services (e.g., storing data and providing copies of previously stored data). The devices that provide data storage services may include hardware devices and/or logical devices. For example, storage (204) may include any quantity and/or combination of memory devices (i.e., volatile storage), long term storage devices (i.e., persistent storage), other types of hardware devices that may provide short term and/or long term data storage services, and/or logical storage devices (e.g., virtual persistent storage/virtual volatile storage).
For example, storage (204) may include a memory device (e.g., a dual in-line memory device) in which data is stored and from which copies of previously stored data are provided. In another example, storage (204) may include a persistent storage device (e.g., a solid state disk drive) in which data is stored and from which copies of previously stored data is provided. In a still further example, storage (204) may include: (i) a memory device (e.g., a dual in-line memory device) in which data is stored and from which copies of previously stored data are provided and (ii) a persistent storage device that stores a copy of the data stored in the memory device (e.g., to provide a copy of the data in the event that power loss or other issues with the memory device that may impact its ability to maintain the copy of the data cause the memory device to lose the data).
The storage (204) may store data structures including an environmental condition repository (208), a corrosion rate repository (210), and a lifecycle repository (212). Each of these data structures is discussed below.
The environmental condition repository (208) may include one or more data structures that include information regarding the environmental conditions within a chassis. For example, when sensor data is read from a temperature and/or humidity sensor, the read information may be stored in the environmental condition repository (208). Consequently, a historical record of the environmental conditions in the repository may be maintained.
In some embodiments of the invention, the environmental condition repository (208) may only include the most up to date information regarding the environmental conditions within the chassis. For example, only the most recent sensor readings may be stored in the environmental condition repository (208).
The environmental condition repository (208) may include any type and quantity of information regarding the environmental conditions within the repository. For example, the environmental condition repository (208) may include temperature sensor data from discrete temperature sensors and/or temperature sensors integrated into computing components (and/or other types of devices). In another example, the environmental condition repository (208) may include humidity level data from discrete or integrated humidity sensors. In a still further example, the environmental condition repository (208) may include airflow rate data regarding the flow of gases within a chassis.
In addition to the sensor data, the environmental condition repository (208) may include spatial data regarding the relative locations of components within a chassis. For example, some components may be disposed away from temperature and/or humidity sensors. Consequently, it may not be possible to directly measure the temperature and/or humidity level of the environment proximate to such components. The spatial data may be used to estimate, using measured temperatures and/or humidity levels, the likely temperature and/or humidity levels of the environment proximate to these components.
For additional details regarding the environmental condition repository (208), refer to
The corrosion rate repository (210) may include one or more data structures that include information regarding the rates at which components disposed in the chassis are likely to occur when corresponding environmental conditions occur. For example, the corrosion rate repository (210) may include tables associated with different components disposed within the chassis. Each of these tables may provide a corrosion rate based on current environmental conditions (e.g., temperature and humidity level).
In addition to including information regarding the rates at which components disposed in the chassis are likely to occur, the corrosion rate repository (210) may store information regarding the quantity of corrosion that has already likely occurred for the components disposed in a chassis. For example, when the environmental component manager (202) determines a current rate of corrosion, the environmental component manager (202) may use the rate to determine how much corrosion has likely occurred since the last time the rate of corrosion was determined (e.g., rate×time=corrosion that occurred). By doing so, a historical record of the corrosion that has occurred with respect to various components disposed in a chassis may be obtained.
The lifecycle repository (212) may include one or more data structures that include information regarding the desired life components disposed in a chassis. For example, the lifecycle repository (212) may specify how much corrosion may occur with respect to different components before the respective components are likely to fail. The aforementioned information may be used in conjunction with determined corrosion rates and quantities to determine whether it is likely that a component, computing device, and/or IHS is likely to fail prior to its desired service life.
While the data structures stored in storage (204) have been described as including a limited amount of specific information, any of the data structures stored in storage (204) may include additional, less, and/or different information without departing from the embodiments disclosed herein. Further, the aforementioned data structures may be combined, subdivided into any number of data structures, may be stored in other locations (e.g., in a storage hosted by another device), and/or spanned across any number of devices without departing from the embodiments disclosed herein. Any of these data structures may be implemented using, for example, lists, table, linked lists, databases, or any other type of data structures usable for storage of the aforementioned information.
While the environmental manager (200) of
Further, any of the components may be implemented as a service spanning multiple devices. For example, multiple computing devices housed in multiple chassis may each run respective instances of the environmental component manager (202). Each of these instances may communicate and cooperate to provide the functionality of the environmental component manager (202).
As discussed above, the environmental manager (200) may utilize an environmental condition repository when performing its functionality.
In one or more embodiments of the invention, the example environmental condition repository (300) include any of number entries (e.g., 302, 304). Each of the entries may include a location identifier (302.2), temperature data (302.4), humidity data (302.6), and corrosion data (302.8).
The location identifier (302.2) may be an identifier of the location at which the data included in the entry is associated. For example, the location identifier (302.2) may be the name of a component that provided the information included in the entry, a location at which the information included in the entry has been estimated (e.g., in a scenario in which direct measurement is not available such as for traces or other components not directly adjacent to a sensor), etc.
The temperature data (302.4) may include information regarding the temperature of the ambient environment proximate to the location identified by the location identifier (302.2).
The humidity data (302.6) may include information regarding the relative level of humidity of the ambient environment proximate to the location identified by the location identifier (302.2).
The corrosion data (302.8) may including information regarding the likely corrosion that has previously and/or is currently occurring at the location identified by the location identifier (302.2).
While the example environmental condition repository (300) has been described as including a limited amount of specific information, the example environmental condition repository (300) may include additional, less, and/or different information without departing from the embodiments disclosed herein. Further, the example environmental condition repository (300) may be combined, subdivided into any number of data structures, may be stored in other locations (e.g., in a storage hosted by another device), and/or spanned across any number of devices without departing from the embodiments disclosed herein. Additionally, while described as being implemented using a list of entries (302, 304), the example environmental condition repository (300) may be implemented using different types of data structures (e.g., databases, linked lists, tables, etc.) without departing from the invention.
Returning to
While
In step 400, a component subject to corrosion risk is identified. The component may be, for example, a computing component disposed within a chassis. The component may be identified based on a listing or other data structure of components for which an environmental manager is to provide environmental management services.
In step 402, a temperature associated with the component is monitored. The temperature associated with the component may be monitored using, for example, a sensor. The sensor may report the ambient temperature adjacent to the component or a temperature from which the ambient temperature adjacent to the component may be ascertained. The monitoring may be performed for any duration of time.
The sensor may be integrated into the component or may be separate from the component. For example, if the component includes an integrated temperature sensor, the component may provide the temperature associated with the component to an environmental manager.
In step 404, a humidity level associated with the component is monitored. The humidity level associated with the component may be monitored using, for example, a sensor. The sensor may report the relative humidity temperature level adjacent to the component or a humidity level from which the ambient temperature adjacent to the component may be ascertained. For example, if the humidity level is known at a location upstream from the component, the humidity level proximate to the component may be determined based on modeling of the changes in temperature and humidity downstream of the measured location. Further, in some embodiments, if the humidity level and a temperature is known upstream of the component and the temperature is known at the component, a highly accurate estimate of the relative humidity level at the component may be ascertained based on the change in temperature between the locations.
Like the monitoring of the temperature of step 402, the monitoring of the humidity level may be performed for any duration of time.
The sensor used to obtain the humidity level may be integrated into the component or may be separate from the component. For example, if the component includes an integrated humidity sensor, the component may provide the relative humidity level associated with the component to an environmental manager.
In step 406, a corrosion rate based on the temperature and humidity level is determined. The corrosion rate may be determined, as discussed with respect to
The aforementioned functional relationship may be ascertained via laboratory measurement. For example, a component that may be subject to corrosion risk may be exposed to different temperature and relative humidity level ratios. The quantity of corrosion that occurred during the exposure may then be used to determine the corresponding corrosion rates for the component. The aforementioned relationships may be stored in storage of the environmental manager prior to it performing its functionality disclosed herein.
In step 408, it is determined whether the corrosion rate indicates that a premature failure of the component is likely to occur based on the service life of the component.
The determination may be made by comparing the amount of corrosion of the component that has occurred and the corrosion rate to a maximum amount of corrosion that can occur before failure of the component is likely. In other words, solving the equation Cf=Cc+T*Cr where Cf is the amount of corrosion that can occur before premature failure is likely to occur, Cc is the amount of corrosion that has already occurred, Cr is the corrosion rate determined in step 406, and T is the unknown amount of time until premature failure will occur due to corrosion. If the amount of time until premature failure indicates that failure of the component will occur before the desired service life of the component occurs, it is determined that the corrosion rates indicates a premature failure of the component will occur.
In one or more embodiments of the invention, the determination is made by estimating the future rates of corrosion (and/or total amounts of corrosion) using a predictive model. The predictive model may be, for example, machine learning, a stochastic method, a regression technique (e.g., linear regression/curve fitting), or any other method of using historical data to predict future data.
The historical corrosion and/or corrosion rates obtained in steps 402-406 may be used as training data to train a predictive model. For example, the environmental conditions (e.g., temperature, relative humidity, current rates of corrosion, etc.) during a first period of time may be associated with rates of corrosion that occur in a second period of time in the future (e.g., a past/present to future relationship). Alternatively, or complementary, the rates of corrosion during a first period of time may be associated with rates of corrosion that occur in the second, future period of time. These rates may be used as the training basis for the predictive model.
After being trained, the predictive model may be used to then predict the future levels of corrosion of the component based on the historical data (e.g., using the trained model). For example, temperature, relative humidity level, and/or corrosion rates may be used as input to the trained predictive model and the predictive model may generate, based on the input, the future rates of corrosion and/or absolute amounts of corrosion that will occur over a future period of time. The predicted future levels of corrosion may specify, for example, the amount of corrosion of the component at different points in the future and/or the rates of change of the corrosion at different points in time in the future based on environmental conditions and/or rates of corrosion that have been measured.
These predictions may be used to ascertain when the corrosion risk of the component indicates a premature failure (e.g., whether the component will fail prior to meeting service life goals). If the component will not meet is service life goals based on the prediction, the corrosion risk may indicate the premature failure of the component.
If it is determined that a premature failure will occur, the method may proceed to step 410 in
Turning to
In step 410, an environmental control modification that mitigates the premature failure is determined.
In one or more embodiments of the invention, the environmental control modification is an increase in the temperature of the internal environment of the chassis. Generally, the rate of corrosion of a component increases greatly as the relative level of humidity in the environment proximate to the component increases. The relative level of humidity in the environment proximate to the component may be decreased by increasing the temperature of the environment while keeping the quantity of water suspended in the ambient environment constant.
In one or more embodiments of the invention, the environment control modification is implemented when a temperature of the component has exceeded a preferred temperature range. For example, when the component's temperature is elevated due to its usage to a degree that conventional environmental management systems may increase the flow of gases within the internal environment. In contrast to this approach, embodiments of the invention may, even when a component is at an elevated temperature, further increase the ambient temperature to reduce the risk of corrosion while accepting potential negative impacts on the component due to elevated temperatures.
For example, while the corrosion risk is determined as low, an environmental manager in accordance with embodiments of the invention may manage the temperature of the internal environment in accordance with nominal temperatures ranges for which the components are rated. When components exceed the nominal temperature range, gas flow within a chassis may be increased to decrease the temperatures of the components to nominal. However, when the risk for corrosion is high, the environmental manager may allow the temperatures of the components to stay elevated or further increase to limit the potential for corrosion.
In one or more embodiments of the invention, the environmental control modification is implemented by a decreasing an airflow rate proximate to the component. For example, a fan or other gas flow control component may reduce the airflow rate proximate to the component thereby increasing the ambient temperature proximate to the component.
In one or more embodiments of the invention, the environmental control modification includes heating gases within or being taken into a chassis. For example, a heater (e.g., an environmental control), airflow conditioner, or other type of operable environmental control may be utilized to heat the gases that will pass by a component that is at risk of corrosion. By doing so, the risk of corrosion may be reduced thereby reducing the potential for the component prematurely failing due to corrosion. Increases in airflow rates may be implemented in parallel to mitigate the impact of the increased temperature of the airflows. Consequently, the risk of corrosion related premature failures may be mitigated while also mitigating the risk of temperature related premature failures.
In one or more embodiments of the invention, the environmental control modification that mitigates the premature failure is identified using the method illustrated in
In step 412, the operation of at least one environmental control component is updated based on the environmental control modification. For example, the operating point of the at least one environmental control component may be updated to cause the environmental control modification determined in step 410 to be implemented.
The method may end following step 412.
Using the method illustrated in
Turning to
While
In step 420, an airflow temperature increase that will reduce the corrosion rate to a level that prevents the premature failure is identified. For example, as discussed with respect to step 408, the rate of corrosion may be reduced by increasing the temperature of the ambient environment proximate to a component and/or the temperature of the component itself. The temperature increase may be calculated using the information included in the corrosion rate repository (210,
For example, the equation discussed with respect to step 408 may be used to determine the corrosion rate (e.g., set the corrosion rate so that the failure time coincides with the occurrence of the service life or the service life minus a factor of safety). The corrosion rate may then be used to determine, using the corrosion rate repository (210) the temperature required to meet that corrosion rate.
In step 422, it is determined whether the airflow temperature increase will cause a second premature failure of any component. For example, by increasing the temperature of the gases inside the chassis, other components may be impacted that each have their own sets of nominal operating temperatures. The nominal operating temperatures may be compared to the likely temperature impact of implementing the airflow temperature increase identified in step 420. If any component is likely to exceed its nominal temperature range for operating while also being actively cooled by airflows, it may be determined that the second premature failure of the other component will be caused by the airflow temperature increase.
If the airflow temperature increase is determined as being likely to cause a second premature failure, the method may proceed to step 426. If the airflow temperature increase is determined as being unlikely to cause a second premature failure, the method may proceed to step 424.
In step 424, the temperature increase is schedule for implementation. For example, a new operating point of one or more airflow control components may be determined based on the temperature increase. The change in airflow rate may, based on the scheduling, be implemented in the same as described in step 412 of
The method may end following step 424.
Returning to step 426, the method may proceed to step 426 when it is determined that the airflow temperature increase will cause a second premature failure.
In step 426, an administrator is alerted that the premature failure will occur. The administrator may be alerted by sending an email, an instant message, or some other type of communication to a computing device (e.g., a cell phone, laptop, personal computer, etc.) associated with the administrator. The administrator may then take appropriate action to address the premature failure.
The method may end following step 426.
Using the method illustrated in
To further clarify embodiments of the invention, a non-limiting example is provided in
Consider a scenario as illustrated in
To provide their functionalities, the processor (502) and the memory modules (504) may consume electricity and produce heat as a byproduct. Consequently, if left unchecked, the heat produced by these components may increase the temperatures of these components outside of their nominal operating ranges.
To manage the temperatures of these components, the chassis (500) may include fans (510). The fans (510) may have an adjustable rotation rate (512) that enables them to produce in airflow (516) of variable-rate. The operation of the fans (510) may be controlled by an environmental manager (not shown).
The airflow (516) may cause gases from an unconditioned air source (514) to flow into the chassis (500), passed by the computing components, and then exit the rear of the chassis as illustrated by the arrow having a dashed tail. However, because the gases are being obtained from an unconditioned air source (514), the absolute quantity of water vapor in the airflow (516) may vary as the ambient conditions change. For example, as humid air enters a region in which the chassis (500) is disposed, the amount of water vapor in the airflow (516) may increase.
Due to the presence of the water vapor in the airflow (516), the corrosion sensitive traces (508) may corrode at different rates depending on the quantity of water vapor in the airflow (516). Consequently, if the quantity of water vapor in the airflow (516) in conjunction with the temperature of the airflow (516) causes the relative level of humidity proximate to the corrosion sensitive traces (508) to exceed 55%, the corrosion sensitive traces (508) may begin to corrode at a rate that is likely to cause the traces to fail prior to the occurrence of the end of the service life of the computing components disposed in chassis (500).
To mitigate this potential risk, the environmental manager may utilize a humidity sensor (520) and temperature sensors embedded in the processor (502) to monitor the likelihood for the occurrence of corrosion.
For example, consider that a first point in time the temperature in the chassis (500) is determined to be 70° F. and the relative humidity level is determined to be 30%. In this example, the environmental manager may not take any action with respect to the risk of corrosion of the corrosion sensitive traces (508).
Now consider that a second point in time a storm front goes into the area thereby greatly increasing the amount of humidity in the unconditioned air source (514). At the second point in time, the increase in the amount of humidity because the relative level of humidity the increase to 70% inside the chassis (500). At the second point in time, the environmental manager may begin to take action because of the high rate of corrosion of the corrosion sensitive traces (508) based on these environmental conditions within the chassis (500).
Turning to
As the temperature of the ambient environment proximate to the corrosion sensitive traces (508) increases, the relative level of humidity in the ambient environment proximate to the corrosion sensitive traces (508) decreases to 40% by virtue of the increase in temperature even though the absolute quantity of water vapor in the environment proximate to the corrosion sensitive traces (508) remained the same. Consequently, the rate of corrosion of the corrosion sensitive traces (508) greatly decreases in environmental manager determines that the risk of premature failure of the corrosion sensitive traces has been mitigated.
Now consider, that at a third point in time illustrated in
Based on the increase the temperature of the processor (502), the environmental manager determines that the processor (502) will fail if it's increase in temperature is left unchecked. However, due to the increased quantity of water vapor in the ambient environment, the environmental manager is unable to simply increase the rotation rate (512) of the fans to address the increased temperature of the processor (502) because it would cause an unacceptable rate of corrosion of the corrosion sensitive traces (508).
Referring to
By increasing the rotation rate of the fans, the temperature of the processor is returned to nominal. By heating the air source, the temperature of the gases used to generate the airflow is increased. Consequently, the warmer gases of the airflow, albeit at a greater flow rate, do not result in a change in the temperature of ambient environment proximate to the corrosion sensitive traces. Accordingly, the relative level of humidity is at least maintained and does not result in increased corrosion rates of the corrosion sensitive traces.
Lastly, the amount of humidity in the conditioned air source (514) is reduced thereby enabling the environmental manager to further increase the rotation rate, if necessary in the future, without negatively impacting the corrosion rate of the corrosion sensitive traces (508).
Any of the components of
Additionally, as discussed above, embodiments of the invention may be implemented using a computing device.
In one embodiment of the invention, the computer processor(s) (602) may be an integrated circuit for processing instructions. For example, the computer processor(s) may be one or more cores or micro-cores of a processor. The computing device (600) may also include one or more input devices (610), such as a touchscreen, keyboard, mouse, microphone, touchpad, electronic pen, or any other type of input device. Further, the communication interface (612) may include an integrated circuit for connecting the computing device (600) to a network (not shown) (e.g., a local area network (LAN), a wide area network (WAN) such as the Internet, mobile network, or any other type of network) and/or to another device, such as another computing device.
In one embodiment of the invention, the computing device (600) may include one or more output devices (608), such as a screen (e.g., a liquid crystal display (LCD), a plasma display, touchscreen, cathode ray tube (CRT) monitor, projector, or other display device), a printer, external storage, or any other output device. One or more of the output devices may be the same or different from the input device(s). The input and output device(s) may be locally or remotely connected to the computer processor(s) (602), non-persistent storage (604), and persistent storage (606). Many different types of computing devices exist, and the aforementioned input and output device(s) may take other forms.
Embodiments of the invention may provide an improved method for managing components of an information handling system. Specifically, embodiments of the invention may provide a method and device for managing an environment in which components of an IHS may reside. To do so, embodiments of the invention may manage the environment based on the risk of corrosion and temperature sensitivities. By doing so, premature failures due to corrosion and temperature may be reduced. Consequently, an IHS in accordance with embodiments of the invention may be more likely to meet their service life goals.
Thus, embodiments of the invention may address the problem of environments that may cause premature failures of devices due to corrosion. Specifically, embodiments of the invention may provide a method of managing both the temperature and humidity level of the environment in a manner that reduces premature failure risks.
The problems discussed above should be understood as being examples of problems solved by embodiments of the invention disclosed herein and the invention should not be limited to solving the same/similar problems. The disclosed invention is broadly applicable to address a range of problems beyond those discussed herein.
One or more embodiments of the invention may be implemented using instructions executed by one or more processors of the data management device. Further, such instructions may correspond to computer readable instructions that are stored on one or more non-transitory computer readable mediums.
While the invention has been described above with respect to a limited number of embodiments, those skilled in the art, having the benefit of this disclosure, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.
