Claims
- 1. A system for applying a modifying composition to a non-equidimensional substrate, comprising: a processing chamber configured for passing the non-equidimensional substrate therethrough, said processing chamber being further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber, said treatment mixture comprising the modifying agent in a carrier medium, said carrier medium being selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas, said modifying agent being applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
- 2. A system as in claim 1 wherein the processing chamber further comprises a first region, a second region, and a constricted medial region between the first region and the second region, and wherein the modifying agent is separated from the carrier medium upon a pressure drop when the treatment mixture is introduced into the constricted medial region, such that the modifying agent is applied to the substrate.
- 3. A system as in claim 2 further comprising an entry seal that essentially matches and is slightly larger than the non-equidimensional substrate.
- 4. A system as in claim 3 further comprising an exit seal that essentially matches and is slightly larger than the non-equidimensional substrate.
- 5. A system as in claim 1 wherein the non-equidimensional substrate is selected from the group consisting of sheet-like substrates, U-shaped substrates, corrugated substrates, and angled substrates.
- 6. A system as in claim 5 wherein the sheet-like substrate is selected from the group consisting of a plate, a ribbon, a sheet, a screen, and a plied material.
- 7. A system as in claim 4 wherein the non-equidimensional substrate is removed from the exit seal at the same rate that the non-equidimensional substrate is continuously fed into the chamber through the entry seal.
- 8. A system as in claim 1 further comprising at least one expansion chamber disposed between the entry seal and the processing chamber, and at least one expansion chamber between the exit seal and the processing chamber.
- 9. A system as in claim 8 wherein the entry seal and the exit seal are fluid filled chambers which maintain a pressure that is at least slightly greater than the adjacent expansion chambers.
- 10. A system as in claim 9 wherein the pressure is maintained by continuous inflow of a gas.
- 11. A system as in claim 10 wherein the gas is inert with respect to the treatment mixture.
- 12. A system as in claim 1 wherein pressure is controlled in the processing chamber by a pressure regulator.
- 13. A system as in claim 1 wherein the temperature is controlled in the processing chamber by a temperature regulator.
- 14. A system as in claim 1 further comprising a substrate feed controller configured for controlling the speed at which the substrate is passed through the system.
- 15. A system as in claim 4 wherein the entry end seal and the exit seal are adjustable to various sizes for accepting various substrates for modification.
RELATED APPLICATION
[0001] This application is a divisional application of pending U.S. patent application Ser. No. 09/677,336, filed Sep. 27, 2000 and is incorporated by reference.
CONTRACTUAL ORIGIN OF THE INVENTION
[0002] This invention was made with United States Government support under Contract No. DE-AC07-94ID13223, now Contract No. DE-AC07-99ID13727 awarded by the United States Department of Energy. The United States Government has certain rights in the invention.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09677336 |
Sep 2000 |
US |
Child |
10627530 |
Jul 2003 |
US |