Number | Name | Date | Kind |
---|---|---|---|
3453545 | Oates | Jul 1969 | |
3963985 | Geldermans | Jun 1976 | |
3968433 | Dobarganes | Jul 1976 | |
4804132 | Difrancesco | Feb 1989 | |
5015946 | Janko | May 1991 | |
5083697 | Difrancesco | Jan 1992 | |
5177436 | Lee | Jan 1993 | |
5276345 | Malloy | Jan 1994 | |
5479105 | Kim et al. | Dec 1995 | |
5497103 | Ebert et al. | Mar 1996 | |
5506510 | Blumenau | Apr 1996 |
Entry |
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Probing at Die Level, Advanced Packaging, Jan./Feb. 1995 pp. 26-28 by A.E. Corwith. |
Particle Interconnect, Exatron, 4 Pages (Unavailable Date). |
The Economics of Automatic Testing, pp. 76-99 by Brendan Davis (Unavailable Date). |
Spring Contact Probes, Everett Charles Technologies, pp. 6-9 (Unavailable Date). |
Electrical Testing of Multichip Modules, Multichip Module Technologies And Alternatives, pp. 615-795 by Thomas C. Russell and Yenting Wen, (Unavailable Date). |