Claims
- 1. A mammalian implant assembly comprising:a wire having an axis, a proximal end, and a distal end, a distal portion of the wire comprising a discrete metallic link that is susceptible to electrolytic disintegration in an ionic medium, a section of the wire proximal of said link being insulated so as to not be susceptible to electrolytic disintegration in the ionic medium; and a detachable implant coupled to the wire by a solder-less attachment at a location that is distal to the discrete metallic link, the implant comprised of a material not susceptible to electrolytic disintegration in an ionic medium.
- 2. The assembly of claim 1 where the distal end of the wire has a constant diameter.
- 3. The assembly of claim 1 additionally comprising means for providing column strength to the distal section of the wire.
- 4. The assembly of claim 1, wherein the distal end of the wire is tapered.
- 5. A mammalian implant assembly, comprising:a wire having an axis, a proximal end, and a distal end, a distal portion of the wire comprising a discrete metallic link that is susceptible to electrolytic disintegration in an ionic medium, a section of the wire proximal of said link being insulated so as to not be susceptible to electrolytic disintegration in the ionic medium; a detachable implant joined to the wire without solder, the implant comprised of a material not susceptible to electrolytic disintegration in an ionic medium; and a sleeve comprised of a material not susceptible to electrolytic disintegration in an ionic medium, the sleeve joining the wire to the implant.
- 6. The assembly of claim 5 where the sleeve is metallic.
- 7. The assembly of claim 5, wherein the detachable implant is welded to the sleeve.
- 8. The assembly of claim 5, wherein the detachable implant is crimped onto the sleeve.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of U.S. patent application Ser. No. 08/743,494, filed Nov. 4, 1996, now U.S. Pat. No. 6,123,714, which is a continuation of U.S. patent application Ser. No. 08/485,502, filed Jun. 7, 1995, now abandoned, which in turn is a divisional of U.S. patent application Ser. No. 08/367,061, filed Dec. 30, 1994, now abandoned, the entirety of which are hereby incorporated by reference.
US Referenced Citations (15)
Foreign Referenced Citations (2)
Number |
Date |
Country |
WO 9416632 |
Aug 1994 |
WO |
WO 9512367 |
May 1995 |
WO |
Continuations (2)
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Number |
Date |
Country |
Parent |
08/743494 |
Nov 1996 |
US |
Child |
09/428297 |
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US |
Parent |
08/485502 |
Jun 1995 |
US |
Child |
08/743494 |
|
US |