Patent Application
20170238902
Embodiments of the present specification relate generally to an ultrasound transducer probe, and more particularly to a system for reducing a footprint of the ultrasound transducer probe.
Medical diagnostic ultrasound is an imaging modality that employs ultrasound waves to probe acoustic properties of biological tissues and produces corresponding images. Particularly, ultrasound systems are used to provide an accurate visualization of muscles, tendons, and other internal organs to assess their size, structure, movement, and/or pathological conditions using near real-time images. Moreover, owing to the ability to image underlying tissues without use of ionizing radiation, ultrasound systems find extensive use in angiography and prenatal scanning.
Conventional ultrasound systems employ various components, such as a transducer probe that houses an acoustic stack, an interconnect, and an application specific integrated circuit (ASIC). These components are used to transmit and receive ultrasound signals from a target volume in a patient or a subject. However, in these systems, a lateral size of the ASIC and a lateral size of the interconnect are substantially larger than a lateral size of the acoustic stack in the transducer probe. As a result, a footprint of the transducer probe extends beyond the lateral size of the acoustic stack. As will be appreciated, while scanning, transducer probes with smaller footprints are relatively easier to maneuver. By way of example, a transducer probe, such as a transthoracic probe, needs to be positioned in small acoustic windows available between ribs of the patient for cardiac imaging. However, it is difficult to position a conventional transducer probe in these small windows due to the large footprint of the transducer probe.
In accordance with aspects of the present specification, a transducer probe is presented. The transducer probe includes a housing having a probe surface at a first end. Further, the transducer probe includes an acoustic array having an array aperture, wherein the acoustic array is disposed adjacent the probe surface of the housing, and wherein the acoustic array is configured to transmit ultrasound signals towards a target volume. Also, the transducer probe includes a flex interconnect configured to electrically couple the acoustic array to at least one electronic unit. Furthermore, the transducer probe includes an electrical standoff disposed between the acoustic array and the flex interconnect to reduce a footprint of the transducer probe to a first value, wherein the first value is proximate to a lateral size of the array aperture.
In accordance with a further aspect of the present specification, a system for ultrasound imaging is presented. The system includes an acquisition subsystem configured to obtain image data corresponding to a target volume in an object of interest and including an ultrasound probe, wherein the ultrasound probe includes a housing having a first end and a second end, wherein the first end includes a probe surface, and wherein the second end is coupled to a probe cable, an acoustic array having an array aperture, wherein the acoustic array is disposed adjacent the probe surface of the housing, and wherein the acoustic array is configured to transmit ultrasound signals towards a target volume, a flex interconnect configured to electrically couple the acoustic array to at least one electronic unit, and an electrical standoff disposed between the acoustic array and the flex interconnect to reduce a footprint of the transducer probe to a first value, wherein the first value is proximate to a lateral size of the array aperture. Further, the system includes a processing subsystem in operative association with the acquisition subsystem and configured to process the acquired image data to generate one or more images corresponding to the target volume in the object of interest.
In accordance with another aspect of the present specification, a transducer probe is presented. The transducer probe includes a housing having a probe surface at a first end. Further, the transducer probe includes an acoustic array having an array aperture, wherein the acoustic array is disposed adjacent the probe surface of the housing, and wherein the acoustic array is configured to transmit ultrasound signals towards a target volume. Also, the transducer probe includes at least one ASIC configured to electrically couple the acoustic array and configured to receive the ultrasound signals reflected from the target volume. In addition, the transducer probe includes an electrical standoff disposed between the acoustic array and the at least one ASIC to reduce a footprint of the transducer probe to a first value, wherein the first value is proximate to a lateral size of the array.
These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
As will be described in detail hereinafter, various embodiments of an ultrasound transducer probe for reducing a footprint of the ultrasound transducer probe are presented. In particular, the ultrasound transducer probe and methods presented herein employ an electrical standoff to reduce the footprint of the ultrasound transducer probe. In addition to reducing the footprint of the transducer probe, the electrical standoff may also be used to attenuate ultrasound signals emitted from an acoustic array towards a flex interconnect disposed in the transducer probe. Further, the electrical standoff may be used to manage heat generated in the ultrasound transducer probe.
Although the following description includes embodiments relating to ultrasound imaging, these embodiments may also be implemented in other medical imaging systems that employ devices such as ultrasound and/or interventional probes during imaging. These systems, for example, may include magnetic resonance imaging (MRI) systems, computed-tomography (CT) systems, and systems that monitor targeted drug and gene delivery. Further, these medical imaging systems may be used for accurate diagnosis and staging of coronary artery disease and monitoring of therapies including high-intensity focused ultrasound (HIFU), radiofrequency ablation (RFA), and brachytherapy. An exemplary environment that is suitable for practising various implementations of the present system is described in the following sections with reference to
In certain embodiments, the system 100 includes an acquisition subsystem 103 and a processing subsystem 105. The acquisition subsystem 103 is configured to obtain image data corresponding to the target volume 101. Further, the processing subsystem 105 is configured to process the acquired image data to generate one or more images corresponding to the target volume 101 in the object of interest. The acquisition subsystem 103 includes transmit circuitry 102, receive circuitry 110, and a beamformer 112. The processing subsystem 105 includes a processing unit 114, a memory device 118, and input-output devices 120.
In a presently contemplated configuration, the transmit circuitry 102 generates a pulsed waveform to drive an acoustic array 104 housed within a transducer probe 108. In accordance with embodiments of the present specification, the transducer probe 108 includes an electrical standoff to reduce a footprint of the transducer probe 108. Particularly, the pulsed waveform drives acoustic elements 106 in the acoustic array 104 to transmit ultrasonic pulses into the target volume 101. The acoustic elements 106, for example, may include piezoelectric, piezoceramic, capacitive, and/or microfabricated crystals. At least a portion of the ultrasonic pulses generated by the acoustic elements 106 is back-scattered from the target volume 101 to produce echoes that return to the acoustic array 104 and are received by receive circuitry 110 for further processing. It may be noted that the terms “ultrasonic” and “ultrasound” may be used interchangeably in the following description.
Also, in the embodiment illustrated in
In addition to receiving and processing the RF signals, in certain embodiments, the processing unit 114 also provides control and timing signals for configuring one or more imaging parameters for imaging the target volume 101 in the subject. Furthermore, in one embodiment, the processing unit 114 stores the delivery sequence, frequency, time delay, and/or beam intensity, for example, in a memory device 118 for use in imaging the target volume 101. The memory device 118 includes storage devices such as a random access memory, a read only memory, a disc drive, solid-state memory device, and/or a flash memory. In one embodiment, the processing unit 114 uses the stored information for configuring the acoustic elements 106 to direct one or more groups of pulse sequences toward the target volume 101. Subsequently, the processing unit 114 tracks displacements in the target volume 101 caused in response to the incident pulses to determine corresponding tissue characteristics. The displacements and tissues characteristics, thus determined, may be stored in the memory device 118. The displacements and tissues characteristics may also be communicated to a medical practitioner, such as a radiologist, for further diagnosis.
In some embodiments, the processing unit 114 may be further coupled to one or more user input-output devices 120 for receiving commands and inputs from an operator, such as the medical practitioner. The input-output devices 120, for example, may include devices such as a keyboard, a touchscreen, a microphone, a mouse, a control panel, a display device 122, a foot switch, a hand switch, and/or a button. In one embodiment, the processing unit 114 processes the RF signal data to prepare image frames and to generate the requested medically relevant information based on user input. Particularly, the processing unit 114 may be configured to process the RF signal data to generate two-dimensional (2D) and/or three-dimensional (3D) datasets corresponding to different imaging modes.
Further, the processing unit 114 may be configured to reconstruct desired images from the 2D or 3D datasets. Subsequently, the processing unit 114 may be configured to display the desired images on the associated display device 122 that may be communicatively coupled to the processing unit 114. The display device 122, for example, may be a local device. Alternatively, in one embodiment, the display device 122 may be remotely located to allow a remotely located medical practitioner to access the reconstructed images and/or medically relevant information corresponding to the target volume 101 in the subject/patient.
Referring to
Further, the housing 202 may have a probe surface 206 at a first end 207 and an opening 208 at a second end 209 of the housing 202. The probe surface 206 may be a smooth closed surface that is configured to be in physical contact with the subject being scanned. In one example, the probe surface 206 may be formed using one or more materials that are used to provide mechanical protection at the first end 207 of the housing 202. In another example, the probe surface 206 may be formed using a smooth curved material that acts as a lens in the transducer probe 200.
In addition, the probe surface 206 may be configured to allow optimal positioning of the transducer probe 200 on surfaces, such as the chest, breast, and/or abdominal regions of a patient. Further, the opening 208 at the second end 209 of the housing 202 is configured to receive at least a portion of the probe cable 204 that is coupled to the housing 202, as depicted in
In addition to the housing 202 and the probe cable 204, the transducer probe 200 includes an acoustic array 210, a flex interconnect 212, a sub-cable 214, and one or more application specific integrated circuit (ASIC) 216. It may be noted that the transducer probe 200 may include other components, and is not limited to the components shown in
Further, these acoustic elements 226 are arranged to form an array aperture 227 adjacent the probe surface 206 of the transducer probe 200. The array aperture 227 may have a lateral size 228. In one example, the lateral size 228 of the array aperture 227 is same as a lateral size of the acoustic array 210. Also, these acoustic elements 226 are used to transmit ultrasound signals towards the target volume 101 in the subject via the array aperture 227. In one example, the acoustic elements 226 may include a piezoelectric layer that is driven by electrical pulses to transmit the ultrasound signals towards the target volume 101. It may be noted that the number of acoustic elements 226 included in the acoustic array 210 may vary depending upon the transducer design and/or type of imaging that is to be performed.
Further, the flex interconnect 212 may include interconnects that are flexible and adaptable to provide electrical connection between the acoustic array 210, the ASIC 216, and one or more electronic units 252 in the probe 200. Further, the one or more electronic units 252 may be electrically coupled to the probe cable 204 via the sub-cable 214. The flex interconnect 212 is configured to electrically couple the acoustic array 210 to the electronic units 252. In one example, the flex interconnect 212 may be used to communicate the ultrasonic/electrical pulses between the piezoelectric layer in the acoustic elements 226 and the electronic units 252 in the probe 200. In one embodiment, the electronic units 252 may be positioned outside the transducer probe 200.
Further, the ASIC 216 is positioned adjacent the flex interconnect 212 to receive one or more ultrasound signals that are reflected from the target volume 101 in the subject. Also, the ASIC 216 may process and communicate these reflected ultrasound signals to the electronic units 252.
In addition, the ASIC 216 may include one or more input-output (I/O) connections 250 disposed along a periphery of the ASIC 216, as depicted in
Existing probes may include a stacked structure consisting of an acoustic array, an interconnect, and and one or more ASICs. Also, this stacked structure is positioned adjacent a probe surface of the transducer probe. Further, a lateral size of the ASICs and a lateral size of the interconnect are substantially larger than a lateral size of the acoustic stack in the transducer probe. As a result, a footprint of the transducer probe extends beyond the lateral size of the acoustic stack. As will be appreciated, a transducer probe with such a large footprint is particularly undesirable in applications where the transducer probe needs to be maneuvered in relatively small spaces.
In accordance with aspects of the present specification, the exemplary transducer probe 200 is configured to overcome the above shortcomings. In particular, the exemplary transducer probe 200 may employ an electrical standoff 230 to reduce a footprint 232 of the transducer probe 200 to a first value. In one example, the first value is proximate to a lateral size 228 of the array aperture 227. The footprint 232 may be representative of an outer width of the transducer probe 200 at a determined depth 234 from the probe surface 206. In one example, the determined depth 234 is in a range from about 1 mm to about 4 mm.
As depicted in
In the embodiment of
Further, the standoff elements 238 may be fabricated from one or more electrical and thermal conductors. In one embodiment, the gaps 242 may be filled with one or more electrical insulators to isolate the standoff elements 238 from one another. Also, each of these standoff elements 238 may be aligned with a corresponding acoustic element in the acoustic array 210. In one example, each of the standoff elements 238 may be electrically coupled to at least one of the acoustic elements 226 in the acoustic array 210.
Furthermore, the flex interconnect 212 may include a plurality of pass-through connections 244. The pass-through connections 244 are used for electrically coupling the one or more standoff elements 238 in the electrical standoff 230 to the ASIC 216. In one embodiment, each of these pass-through connections 244 may be aligned with a corresponding standoff element 238 in the electrical standoff 230. In one embodiment, the ASIC 216 may include one or more ASIC bumps 248 that are used to electrically couple the ASIC 216 to the standoff elements 238 via the pass-through connections 244. Thus, the ASIC 216 is electrically coupled to the acoustic elements 226 in the acoustic array 210 through the ASIC bumps 248, the pass-through connections 244, and the standoff elements 238.
In an exemplary embodiment, the electrical standoff 230 may be used to attenuate at least a portion of the ultrasound signals transmitted towards the flex interconnect 212. Particularly, while transmitting the ultrasound signals towards the target volume, the acoustic elements 226 may transmit a portion of the ultrasound signals towards the flex interconnect 212 and the ASIC 216 in the ultrasound probe 200. These ultrasound signals may cause spurious reflections with the ultrasound signals received from the target volume 101. As a result, image artifacts may be obtained in an ultrasound image of the target volume 101. To avoid these problems, the standoff elements 238 in the electrical standoff 230 are used to absorb the ultrasound signals transmitted by the acoustic elements 226 towards the flex interconnect 212. This in turn prevents spurious reflections in the transducer probe 200.
In addition, the electrical standoff 230 may be used to manage heat generated in the ultrasound probe 200. In one example, the ASIC 216 may generate heat while processing the ultrasound signals received from the target volume 101. However, this heat may propagate towards the probe surface/lens 206 and may cause the probe 200 to overheat, which in turn may deactivate/shutdown the probe 200. To avoid this problem, the standoff elements 238 may include one or more low thermal conductive materials to thermally isolate the lens/probe surface 206 from the ASIC 216, which in turn prevents heating of the lens/probe surface 206. In another embodiment, the electrical standoff 230 may be used to remove heat generated by the acoustic array 210 and the lens/probe surface 206. Particularly, the electrical standoff 230 may provide a thermal path for the heat generated by the acoustic array 210 to propagate towards the ASIC 216, or any other thermal management components in the transducer probe 200.
Also, in one embodiment, the electrical standoff 230 may include a low parasitic capacitance that allows for reduced power consumption during transmission of the ultrasonic/electrical pulses to the acoustic elements 226 in the acoustic array 210. Further, this low parasitic capacitance may reduce noise while receiving the ultrasound signals from the target volume 101.
Thus, by employing the electrical standoff 230 in the ultrasound transducer probe 200, the footprint 232 of the transducer probe 200 is reduced to more closely match with the array aperture 227 of the acoustic array 210. Also, the footprint 232 of the transducer probe 200 is reduced without minimizing the array aperture 227 of the acoustic array 210. Furthermore, the electrical standoff 230 may aid in attenuating the ultrasound signals transmitted by the acoustic array 210, which in turn reduces spurious reflections in the ultrasound probe 200. In addition, the electrical standoff 230 may aid in managing the heat generated in the ultrasound probe 200.
Further, the exemplary transducer probe 302 and the conventional transducer probe 304 are illustrated at a same scale and are symmetrically positioned along a vertical axis 314, as depicted in
Referring to
In a similar manner, ASIC bumps 412 that are coupled to an ASIC (shown in
In certain embodiments, the first interposer 402 is positioned between the electrical standoff 404 and the ASIC bumps 412 to facilitate coupling between the electrical standoff 404 and the ASIC bumps 412. In particular, the first interposer 402 is used to electrically couple the electrical standoff 404 having the first pitch 410 to the ASIC bumps 412 having the second pitch 414. In one example, the first interposer 402 may include a plurality of electrical lines 416 that facilitate connecting each of the ASIC bumps 412 with a corresponding standoff element 406 in the electrical standoff 404, as depicted in
Referring now to
As depicted in
In certain embodiments, the first interposer 502 is used to electrically couple the electrical standoff 504 having the first pitch 512 to the pass-through connections 510 of the flex interconnect 506 having the second pitch 514. In one example, the first interposer 502 may include a plurality of electrical lines 516 that facilitate connecting each of the pass-through connections 510 with a corresponding standoff element 518 of the electrical standoff 504, as depicted in
Referring now to
Advantageously, as illustrated in the embodiment of
Although not illustrated, various other embodiments are envisioned. By way of example, in one embodiment, the first interposer may be positioned between the electrical standoff and the flex interconnect or the ASIC bumps. Further, in the same embodiment, the second interposer may be positioned between the electrical standoff and the acoustic array.
Referring to
Referring now to
In the embodiment of
In the embodiment of
Further, in the embodiment of
The various embodiments of the exemplary system aid in reducing the footprint of the transducer probe without minimizing the array aperture of the acoustic array. Also, the footprint of the transducer probe is more closely matched with the array aperture of the acoustic array. In addition, the ultrasound signals transmitted by the acoustic array towards the flex interconnect are attenuated to minimize spurious reflections in the transducer probe. Moreover, the heat generated in the transducer probe may be conducted away from the lens/probe surface, or prevented from being conducted towards the lens/probe surface, which in turn prevents the acoustic array and the lens/probe surface from overheating during operation of the ultrasound probe.
While only certain features of the present disclosure have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the present disclosure.
