Patent Application
20130078890
1. Field of the Disclosure
The present invention relates in general to disk drives and, in particular, to a system, method and apparatus for the enhanced cleaning and polishing of magnetic recording disks for disk drives.
2. Description of the Related Art
Magnetic recording disks are polished as part of the manufacturing process. The quality of cleaning and polishing determines the viability of a magnetic disk product by providing a sufficient product yield for an acceptable value added. Particles that are on the incoming disk are removed to avoid scratching the disk during polishing. Particles formed from asperities and by overcoat wear are also removed. Particles that remain on the disk after polishing interact with the glide test slider and are detrimental to disk yield and manufacturing throughput. Thus, improvements in the cleaning and polishing of magnetic recording disks prior to assembly in hard disk drives continue to be of interest.
Embodiments of a system, method and apparatus for cleaning or polishing magnetic recording media (MRM) are disclosed. One embodiment of a method may comprise mounting and rotating the MRM on a spindle; circulating a tape adjacent to a surface of the MRM; and applying an electrostatic (ES) voltage to the tape and attracting particles located on the MRM to the tape. The ES voltage may apply an ES load to the tape to force the tape into contact with the surface of the MRM. In some embodiments, no mechanical load is applied to the tape to force the tape into contact with the surface of the MRM. In other embodiments, a mechanical load may be additionally applied to the tape to force the tape into contact with the surface of the MRM.
The foregoing and other objects and advantages of these embodiments will be apparent to those of ordinary skill in the art in view of the following detailed description, taken in conjunction with the appended claims and the accompanying drawings.
So that the manner in which the features and advantages of the embodiments are attained and can be understood in more detail, a more particular description may be had by reference to the embodiments thereof that are illustrated in the appended drawings. However, the drawings illustrate only some embodiments and therefore are not to be considered limiting in scope as there may be other equally effective embodiments.
The use of the same reference symbols in different drawings indicates similar or identical items.
Embodiments of a system, method and apparatus for cleaning and polishing of magnetic recording disks prior to assembly in hard disk drives are disclosed. Some embodiments provide enhanced particle removal during the final tape polishing (FTP) process, or during other intermediate steps of manufacture. An electrostatic charge imparted to the support film of the polishing or cleaning tape increases the attractive force between undesirable particles and the tape. The electrostatic charge may be induced in the tape by an electrostatic generator with minimal alteration of conventional manufacturing processes with a commercially available electrode.
Presently some of the particles on incoming disks are removed by a wiping tape pass which is done before the polishing pass. The wiping tape may comprise a non-abrasive particle composite binder on a MYLAR® film support. The wiping tape removes large particles but adds very small particles to the disk surface. Hard particles often form scratches in the disk while being removed during the wipe pass across the rotating disk.
More particles are removed from the disks during the polishing process. The polishing tape abrasive composite topography comprises conventional Benard cells, which are typically concave recesses in the tape that are about 100 μm in diameter and about 5 μm in depth.
Airflow into the Benard cells acts to lift particles from the disk and into a recirculation zone within the concave region. The recirculation zone is shown in a finite element model of the Benard cell in
In addition to the particles on the disks that are incoming to the polishing process, particles are generated from the disk surface during the polishing process. These tribologically-formed particles include flakes of carbon overcoat, carbon overcoat surface wear debris, and metallic spit particles formed during sputtering from a target. Electrostatic-enhanced cleaning of the disk applies equally well to particles formed in-situ during the polishing process. The problem of overcoat wear debris formed in-situ during polishing increases in severity as the lubricant and overcoat thickness are decreased to improve the soft error rate (SER).
Manufacturing yield is lost and throughput is decreased when particles remain on the disk after polishing. Further disk yield and hard disk drive (HDD) yield is lost to scratches made by hard particles on the disks during wiping and polishing. The electrostatic enhancement of particle removal during polishing significantly reduces the number of particles remaining after disk polishing. This also reduces the probability that a particle remains adhered to the disk instead of being picked up on the tape.
Removal of loosely attached particles from disk substrates after wash and just prior to sputtering is similarly enhanced to decrease the occurrence of so-called pre-sputter defects.
Hard particles on disks in the patterned media process also decrease yield through tenting of the photoresist. Tenting is caused by the formation of a non-uniform spacing gap in the photoresist thickness between the rigid disk and the template. Removal of loose particles from disks after sputter and before nanoimprint lithography is enhanced by application of an electrostatically charged cleaning tape.
Some embodiments of the polishing and cleaning tape may comprise a MYLAR® substrate or film having a thickness of about 25 to 50 μm. The thickness of the binder on the substrate may have a thickness of about 7 to 10 μm. The width of the tape may be about ⅜ of an inch. Normally the binder side of the tape is pressed onto the surface of the spinning disk by a soft elastomer or elastomeric pad under a load applied to the back side of the substrate portion of the tape. The electrostatically enhanced polishing and cleaning process may be implemented by application of an electrostatic charge to the substrate backing of the tape binder. In some cases the electrostatic force between the tape and the disk is comparable to conventional external loading forces.
In some embodiments, the electrostatic charge may be applied to the tape by an electrostatic generator and an electrode. This equipment may be used for electrostatic enhanced polishing and cleaning of disks by incorporating it with conventional manufacturing processes.
For example, a schematic diagram of an electrostatic (ES) enhanced cleaning and polishing process for magnetic recording disks is shown in
An external loading configuration is shown in
In this example, the disk cleaning and polishing tape is demonstrated in the self-loading configuration. There is no externally applied load as shown in
Histograms of the particle areal density versus particle size before and after the self-loaded ES enhanced process are shown in
The first two sample disks were contaminated by exposure to ambient atmospheric particles, while the third sample disk was contaminated by twice polishing a thin layer of lubrication on the disk (e.g., 0.2 nm of ZTMD).
A bench top friction tester was set up to operate with the load externally applied to the Mylar back of the tape with a foam pad mounted on an air slide which was attached to an air cylinder. The externally loaded configuration (with ES voltage=0) is conventionally used in disk manufacturing. The ES charge electrode was positioned near the assembly as shown in
The maximum friction force during each test with several different values of ES voltage is shown in
Embodiments of a read/write slider 110 may be moved across the disk surface by an actuator assembly 106, allowing the slider 110 to read and/or write magnetic data to a particular track 113. The actuator assembly 106 may pivot on a pivot 114. The actuator assembly 106 may form part of a closed loop feedback system, known as servo control, which dynamically positions the read/write slider 110 to compensate for thermal expansion of the magnetic recording media 111 as well as vibrations and other disturbances or irregularities. Also involved in the servo control system is a complex computational algorithm executed by a microprocessor, digital signal processor, or analog signal processor 116 that receives data address information from a computer, converts it to a location on the disk 111, and moves the read/write slider 110 accordingly.
In some embodiments of hard disk drive systems, read/write heads 110 periodically reference servo patterns recorded on the disk to ensure accurate slider 110 positioning. Servo patterns may be used to ensure a read/write slider 110 follows a particular track 113 accurately, and to control and monitor transition of the slider 110 from one track to another. Upon referencing a servo pattern, the read/write slider 110 obtains head position information that enables the control circuitry 116 to subsequently realign the slider 110 to correct any detected error.
Servo patterns or servo sectors may be contained in engineered servo sections 112 that are embedded within a plurality of data tracks 113 to allow frequent sampling of the servo patterns for improved disk drive performance, in some embodiments. In a typical magnetic recording media 111, embedded servo sections 112 may extend substantially radially from the center of the magnetic recording media 111, like spokes from the center of a wheel. Unlike spokes however, servo sections 112 form a subtle, arc-shaped path calibrated to substantially match the range of motion of the read/write slider 110.
In some embodiments, a method for cleaning or polishing magnetic recording media (MRM) may comprise mounting and rotating the MRM on a spindle; circulating a tape adjacent to a surface of the MRM; and applying an electrostatic (ES) voltage to the tape and attracting particles located on the MRM to the tape.
The ES voltage may apply an ES load to the tape to force the tape into contact with the surface of the MRM, and the ES load may be in a range of about 50 g to about 150 g. In some embodiments, no mechanical load is applied to the tape to force the tape into contact with the surface of the MRM, while in other embodiments a mechanical load is applied to the tape to force the tape into contact with the surface of the MRM. The tape may comprise a laminate having a layer of MYLAR® or polyethylene terephthalate (PET), and the layer may have a thickness of about 25 μm to about 50 μm. The laminate may further comprise a coating comprising a particle composite in a polymeric binder, and the coating has a thickness of about 5 μm to about 10 μm.
In some embodiments, the method comprises sputtering the disk, and cleaning the MRM prior to discrete track or bit patterning of photoresist. In other embodiments the method comprises final tape polishing (FTP) the MRM. The spindle may comprise a spindle cap and bolt for securing the MRM to the spindle, and the spindle cap and bolt may be formed an electrically insulative material to avoid grounding the ES voltage.
This written description uses examples to disclose the embodiments, including the best mode, and also to enable those of ordinary skill in the art to make and use the invention. The patentable scope is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
Note that not all of the activities described above in the general description or the examples are required, that a portion of a specific activity may not be required, and that one or more further activities may be performed in addition to those described. Still further, the order in which activities are listed are not necessarily the order in which they are performed.
In the foregoing specification, the concepts have been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of invention.
As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of features is not necessarily limited only to those features but may include other features not expressly listed or inherent to such process, method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive-or and not to an exclusive-or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
Also, the use of “a” or “an” are employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims.
After reading the specification, skilled artisans will appreciate that certain features are, for clarity, described herein in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombination. Further, references to values stated in ranges include each and every value within that range.
