Claims
- 1. A System-on-Chip (SOC) apparatus having a latency-tolerant architecture, comprising:
a processor core; one or more peripherals; and a first internal bus that couples said processor core to said peripheral(s) and carries signals from signal initiators to signal targets, said first internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 2. The System-on-Chip (SOC) apparatus of claim 1 wherein said one or more peripherals further comprises one or more DMA-type peripherals, and said apparatus further comprises:
a memory subsystem; and a second internal bus that couples said processor core to said memory subsystem and to said DMA-type peripherals, said second internal bus carries signals from signal initiators to signal targets, said second internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 3. The System-on-Chip (SOC) apparatus of claim 1 or claim 2, wherein said signals are point-to-point and registered signals, and said latency tolerant signal protocol further comprises full handshaking.
- 4. The System-on-Chip (SOC) apparatus of claim 1 or claim 2, wherein said pipeline stages further comprise one or more of the following: flip-flop, multiplexing router, or decoding router.
- 5. The System-on-Chip (SOC) apparatus of claim 2, wherein said first internal bus and said second internal bus have overlapping topologies, each topology further comprising one or more of the following topologies: matrix fabric (or woven) topology, point-to-point topology, bridged topology, or bussed topology.
- 6. A System-on-Chip (SOC) system having a latency-tolerant architecture, comprising:
a processor core; one or more peripherals; and a first internal bus that couples said processor core to said peripheral(s) and carries signals from signal initiators to signal targets, said first internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 7. The System-on-Chip (SOC) system of claim 6 wherein said one or more peripherals further comprises one or more DMA-type peripherals, and said system further comprises:
a memory subsystem; and a second internal bus that couples said processor core to said memory subsystem and to said DMA-type peripherals, said second internal bus carries signals from signal initiators to signal targets, said second internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 8. The System-on-Chip (SOC) system of claim 6 or claim 7, wherein said signals are point-to-point and registered signals, and said latency tolerant signal protocol further comprises full handshaking.
- 9. The System-on-Chip (SOC) system of claim 6 or claim 7, wherein said pipeline stages further comprise one or more of the following: flip-flop, multiplexing router, or decoding router.
- 10. The System-on-Chip (SOC) system of claim 7, wherein said first internal bus and said second internal bus have overlapping topologies, each topology further comprising one or more of the following topologies: matrix fabric (or woven) topology, point-to-point topology, bridged topology, or bussed topology.
- 11. A method to manufacture a System-on-Chip (SOC) apparatus having a latency- tolerant architecture, comprising:
providing a processor core; providing one or more peripherals; and coupling a first internal bus to said processor core and to said peripheral(s), said first internal bus carries signals from signal initiators to signal targets, said first internal bus has a latency blerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 12. The method of claim 11 wherein said one or more peripherals further comprises one or more DMA-type peripherals, and said method further comprises:
providing a memory subsystem; and coupling a second internal bus to said processor core, to said memory subsystem, and to said DMA-type peripherals, said second internal bus carries signals from signal initiators to signal targets, said second internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 13. The method of claim 11 or claim 12, wherein said signals are point-to-point and registered signals, and said latency tolerant signal protocol further comprises full handshaking.
- 14. The method of claim 11 or claim 12, wherein said pipeline stages further comprise one or more of the following: flip-flop, multiplexing router, or decoding router.
- 15. The method of claim 12, wherein said first internal bus and said second internal bus have overlapping topologies, each topology further comprising one or more of the following topologies: matrix fabric (or woven) topology, point-to-point topology, bridged topology, or bussed topology.
- 16. A method of using a System-on-Chip (SOC) apparatus having a latency-tolerant architecture, comprising:
providing a processor core; providing one or more peripherals; and carrying signals from signal initiators to signal targets over a first internal bus that couples said processor core to said peripheral(s), said first internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 17. The method of claim 16 wherein said one or more peripherals further comprises one or more DMA-type peripherals, and said method further comprises:
providing a memory subsystem; and carrying signals from signal initiators to signal targets over a second internal bus that couples said processor core to said memory subsystem and to said DMA-type peripherals, said second internal bus has a latency tolerant signal protocol that allows an arbitrary number of pipeline stages between any signal initiator and any signal target.
- 18. The method of claim 16 or claim 17, wherein said signals are point-to-point and registered signals, and said latency tolerant signal protocol further comprises full handshaking.
- 19. The method of claim 16 or claim 17, wherein said pipeline stages further comprise one or more of the following: flip-flop, multiplexing router, or decoding router.
- 20. The method of claim 17, wherein said first internal bus and said second internal bus have overlapping topologies, each topology further comprising one or more of the following topologies: matrix fabric (or woven) topology, point-to-point topology, bridged topology, or bussed topology.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefits of the earlier filed U.S. Provisional Application Serial No. 60/300,709, filed Jun. 26, 2001 (26.06.2001), which is incorporated by reference for all purposes into this specification.
[0002] Additionally, this application claims the benefits of the earlier filed U.S. Provisional Application Serial No. 60/302,864, filed Jul. 5, 2001 (05.07.2001), which is incorporated by reference for all purposes into this specification.
[0003] Additionally, this application claims the benefits of the earlier filed U.S. Provisional Application Serial No. 60/304,909, filed Jul. 11, 2001 (11.07.2001), which is incorporated by reference for all purposes into this specification.
[0004] Additionally, this application claims the benefits of the earlier filed U.S. Provisional Application Serial No. 60/390,501, filed Jun. 21, 2002 (21.06.2002), which is incorporated by reference for all purposes into this specification.
[0005] Additionally, this application is a continuation of the earlier filed U.S. patent application Ser. No. 10/180,866, filed Jun. 26, 2002 (26.06.2002), which is incorporated by reference for all purposes into this specification.
Provisional Applications (4)
|
Number |
Date |
Country |
|
60300709 |
Jun 2001 |
US |
|
60302864 |
Jul 2001 |
US |
|
60304909 |
Jul 2001 |
US |
|
60390501 |
Jun 2002 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
10180866 |
Jun 2002 |
US |
Child |
10602581 |
Jun 2003 |
US |