Embodiments of the present disclosure relate to systems and methods for wirelessly monitoring well conditions.
Oil and gas wells are high pressure vessels drilled thousands of feet into the ground to gain access to oil and gas reservoirs. The integrity of these wells come from the steel pipes called “casings” that are lowered and lined into the wellbore to support the sides of the wellbore. The casing is designed to withstand high pressures, forces, and environmental factors it will be subjected to in a wellbore, and maintain integrity throughout the production of the well until it is sealed and abandoned. Once the casing is placed in the wellbore, a cement slurry is pumped through the casing and into the annulus to fill the space between the outer diameter of the casing and the well bore wall. Upon curing, the cement permanently seals the casing to the wellbore.
Currently there are tools available to accurately evaluate the integrity of cementing jobs. However, these tools have several limitations. This is reflected by several well statistics that show that 2-10% of wells drilled in the last 15 years have integrity issues related to casing and cementing. Casing and cementing failures can result in well blowouts, contamination of aquifers, corrosion of casing and production tubing, contamination of production oil and gas, as well as the cessation of production due to well collapse or threat of well blowout. Moreover, casing and cementing failures can also affect the downhole environment and production potential of other wells in the vicinity. The current tools evaluate cement based on acoustic techniques. The tools are lowered inside the wellbore after cementing operations are completed. The tools depend on ‘knocking on the pipe’ and ‘listening’ for a response.
Embodiments disclosed here provide a method of evaluating cement sheath integrity using passive, wireless sensors that are pumped into the wellbore with the cement slurry, and embedded in the cement sheath. The sensors provide information on the elastic constitutive properties of cement sheath such as compressive strength, and also parameters of the cement sheath environment, such as temperature, pressure, humidity, pH, and gases inside the cement sheath. The sensing is performed in situ and the results are transferred wirelessly to a reader that can be lowered into a wellbore through a wireline or as a component of a drilling assembly. Alternatively, the data can be transferred wirelessly to micro-devices that can be circulated through drilling fluids, or to devices that are permanently installed on casing collars. By identifying potential issues about the structural integrity of the cement sheath, timely warnings can be provided to perform remedial actions.
Accordingly, one example embodiment is a method for wirelessly sensing downhole cement sheath parameters. The method includes dispersing one or more wireless mobile devices in a cement slurry, pumping the cement slurry including the one or more wireless mobile devices through a casing for cementing the casing to the wellbore wall, sensing one or more cement sheath parameters by the one or more wireless mobile devices, transmitting a signal including the one or more sensed cement sheath parameters, and receiving the signal including the one or more sensed cement sheath parameters by a receiver wirelessly connected to the one or more wireless mobile devices.
Another example embodiment is a system for wirelessly sensing downhole cement sheath parameters. The system includes one or more wireless mobile devices embedded in the cement sheath between a casing and the wellbore wall of a subsurface formation. The one or more wireless mobile devices include one or more sensors configured to sense one or more cement sheath parameters. The system also includes a receiver wirelessly connected to the one or more wireless mobile devices. The receiver is configured to receive a signal including the one or more sensed cement sheath parameters.
Another example embodiment is a wireless mobile device for wirelessly sensing downhole cement sheath parameters. The device includes a sensor configured to sense a cement sheath parameter, a piezoelectric crystal configured to receive an acoustic wave and convert the acoustic wave into electric energy, and a power management unit configured to receive the electric energy and power the sensor. The device may further include a microcontroller adapted to receive measurement data from the sensor and generate an output signal including the measurement data, and a modulator adapted to receive the signal including the measurement data, and modulate the power or amplitude of the signal. The piezoelectric crystal can be further configured to transmit the modulated signal.
For simplicity and clarity of illustration, the drawing figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the discussion of the described embodiments. Additionally, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the example embodiments. Like reference numerals refer to like elements throughout the specification.
The methods and systems of the present disclosure will now be described with reference to the accompanying drawings in which embodiments are shown. The methods and systems of the present disclosure may be in many different forms and should not be construed as limited to the illustrated embodiments set forth here; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey its scope to those skilled in the art.
The term “wireless mobile device” refers to a micro-chip for sensing one or more downhole cement sheath parameters. The micro-chip may include a sensor, a microcontroller or a microprocessor, and a transceiver. The micro-chip may, in some embodiments, include at least one of a modulator, an amplifier, a power storage unit, a power management unit, a piezoelectric crystal, and a memory unit. The term “high temperature” refers to temperatures greater than 125 degrees Celsius or 257 degrees Fahrenheit unless otherwise noted. The term “high pressure” refers to pressures greater than 15,000 psi unless otherwise noted. The term “high vibration” refers to vibrations over 30 g peak at 50-1000 Hz unless otherwise noted.
Turning now to the figures,
The wireless mobile devices 102 are pumped through a casing 108 and down a wellbore 105 with the cement slurry in a coordinated manner so that sufficient wireless mobile devices 102 cover the whole column of cement sheath 104 in the wellbore 105. The cement slurry is preceded and succeeded by pumping of a drilling fluid 106, both of which flow from inside the casing 108 out into the annulus 110 between the casing 108 and the wellbore wall of the subsurface formation 112, and back to the surface. Redundancy in a given area of the cement sheath 104 is also important to nullify any attenuation of sensor signals due to irregularities in the cement sheath pathway during the wireless interrogation of sensors, and transmission of sensor signals back to the interrogator or reader. As the cement slurry hardens over a period of time, the wireless mobile devices 102 also set in place and are permanently embedded in the cement sheath 104. The wireless mobile devices 102 can be spherical or any other shape, such as a cube or a capsule, which does not affect the quality or integrity of the cement sheath 104. The wireless mobile devices 102 can include a coating (not shown) that can be a polymer such as elastomer or any material that can withstand high pressure, temperature, stress, and strain. The coating can also be made from a material that bonds well with the cement sheath 104 and does not leave any gap between the cement sheath 104 and the wireless mobile device 102.
The wireless mobile devices 102, once embedded in cement sheath 104, can remain there indefinitely and provide information about cement sheath properties. The wireless mobile devices 102 do not require a power source, such as a battery for operation, resulting in small sizes, and long lifetimes. Batteries are expensive, have finite lifetimes, and the presence of a significant number of batteries in a well is a critical hazard due to their chemical content, and the possibility of its leakage. Even though the wireless mobile devices 102 are in a difficult to access, harsh environment, they can be powered wirelessly.
Wireless mobile device 102 may also include a microcontroller 128 to receive measurement data from the sensor and generate an output signal including the measurement data. A power storage unit 132 such as a regular di-electric capacitor de-rated for use at high temperatures, a ceramic, an electrolytic, or a super capacitor can be provided in the wireless mobile device 102 for storing the energy produced. The sinusoidal electrical waveform can be rectified and conditioned by the power management circuit 126 to charge the storage unit 132. In such a case, the sensors 122 are not limited to passive LC sensors and any active, low-power commercially available sensor can be used in the wireless mobile device 102, and the power storage unit 132 can be used to provide power to the sensors 122. If the wireless mobile device 102 includes a power storage component, then active ultrasonic sensors can also be used as a method to evaluate the integrity of cement sheath 104.
The structure 152 can be linked either directly or indirectly to a metal electrode 150 that conducts electricity. Directly below this drive electrode 150 is another metal electrode, the ground electrode 160, which can be fixed. The drive electrode 150 and the ground electrode 160 act as a parallel-plate capacitor, where the drive electrode 150 and ground electrode 160 are separated by a non-conductive region. Note that the electrode 160 can also act as a drive electrode, in which case the electrode 150 will act as the ground electrode to form the parallel-plate capacitor. When a voltage is applied to the drive electrode 150 an electric field is produced between the drive electrode 150 and the ground electrode 160 and the sensor behaves as a capacitor. The capacitance between the plates increases with decreasing distance between the drive electrode 150 and the ground electrode 160. For example, if the structure 152 responds to an external stimuli by expanding as shown in
In all of the embodiments, the housing that the sensors are enclosed in must be robust enough to withstand the high temperature, high pressure, corrosive and abrasive environments. Packaging and housing is mainly done to protect the micro-chip components from mud and other fluids in the formation, which may degrade its performance. Some materials that can be used for housing include ceramic, steel, titanium, silicon carbide, aluminum silicon carbide, Inconel®, and Pyroflask® or any material that has excellent heat conduction properties and a high Young's modulus. In order to minimize vibrations in the sensors, electronics they can be mounted and installed in ways to isolate vibrations and placed in a separate compartment within the housing. Chemical coatings can be used to further protect the micro-chip and its components from the harsh downhole environment. They can be polymeric coatings, which can be used to provide a uniform and pinhole free layer on sensor and electronic boards. These coatings can withstand continuous exposure to high temperatures for long periods of time, prevents corrosion of electrodes and is an excellent dielectric. Thermal insulation significantly extends the life and durability of the sensors and electronics. The outer protective shell shields all the components inside from the environment and can be epoxy, resin-based materials, or any material that has good thermal conductivity properties.
The sensors and instrumentation system construction should also be designed to withstand the harsh environment downhole, and therefore requires proper housing/encapsulation. The most common approach is packaging the sensors/instrumentation in ceramic or custom ceramic components. The die, where the sensors/instrumentation are fabricated on, is connected to the pins of the IC by a process known as wire bonding. The die is normally silicon (Si), which has excellent thermal conductivity, but the wires used for wire bonding, the pins and the soldering between the pins and a printed circuit board (PCB) and the glue holding the die in the packaging are susceptible to failure. To minimize failure rates gold (Au) and aluminum (Al) are used for wire bonding, high temperature alloy materials are used for soldering, and epoxies or adhesives are used to glue the sensors/instrumentation inside the package. Multi-chip modules (MCMs) such as high temperature co-fired ceramic (HTCC) and alumina boards are used to combine multiple ICs into a single system level unit. They are generally plated with Al and Au for soldering and wire-bonding and the dies on these boards are processed independently and assembled into a single device as a final step. These hybrid boards are interconnected with each other in 2D or 3D layers using ceramic single inline package headers on brazed pins (BeNi contacts). BeNi is commercially available and is a standard technology for high temperature packaging. HTCC packages have excellent mechanical rigidity, thermal dissipation and hermeticity, important features in harsh, high temperature applications. To minimize flexing MCMs a stiffening component such as a bridge over the boards or side rails is incorporated into the assembly. Silicon-on-insulator (SOI) is an alternative technology Si that can be utilized for sensors and instrumentation for harsh environments. Compared to ceramic and bulk Si technology, SOI significantly reduces leakage currents and variations in device parameters, improves carrier mobility, electro-migration between interconnects and dielectric breakdown strength. Silicon carbide (SiC) based electronics is another emerging technology but has superior properties to silicon based electronics that makes it an ideal candidate for harsh environment applications, which are thermally, mechanically and chemically aggressive. One of the advantages of the disclosed embodiments include that MEMS technology has allowed the scaling down of millimeter size devices into the micro-nano range. This provides the opportunity to package and fit sensors into smaller areas, have sensor arrays that increase the resolution of measurements, and to seamlessly integrate with other electronic components, leading to ‘system on chip’ devices that can be mass produced. MEMS devices have low power requirements, and the small size of the sensors makes it more tolerant to mechanical shocks and vibrations experienced in a downhole environment. At the same time, significant advancements in material science have also paved the way for materials that change shape due to their response to stimuli. This property enables them to be self-healing, self-deployable, passive sensors and actuators.
The Specification, which includes the Summary, Brief Description of the Drawings and the Detailed Description, and the appended Claims refer to particular features (including process or method steps) of the disclosure. Those of skill in the art understand that the disclosure includes all possible combinations and uses of particular features described in the Specification. Those of skill in the art understand that the disclosure is not limited to or by the description of embodiments given in the Specification. Those of skill in the art also understand that the terminology used for describing particular embodiments does not limit the scope or breadth of the disclosure. In interpreting the Specification and appended Claims, all terms should be interpreted in the broadest possible manner consistent with the context of each term. All technical and scientific terms used in the Specification and appended Claims have the same meaning as commonly understood by one of ordinary skill in the art unless defined otherwise.
As used in the Specification and appended Claims, the singular forms “a,” “an,” and “the” include plural references unless the context clearly indicates otherwise. The verb “comprises” and its conjugated forms should be interpreted as referring to elements, components or steps in a non-exclusive manner. The referenced elements, components or steps may be present, utilized or combined with other elements, components or steps not expressly referenced. Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain implementations could include, while other implementations do not include, certain features, elements, and/or operations. Thus, such conditional language generally is not intended to imply that features, elements, and/or operations are in any way required for one or more implementations or that one or more implementations necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or operations are included or are to be performed in any particular implementation.
The systems and methods described here, therefore, are well adapted to carry out the objects and attain the ends and advantages mentioned, as well as others that may be inherent. While example embodiments of the system and method have been given for purposes of disclosure, numerous changes exist in the details of procedures for accomplishing the desired results. These and other similar modifications may readily suggest themselves to those skilled in the art, and are intended to be encompassed within the spirit of the system and method disclosed here and the scope of the appended claims.
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