The present disclosure relates in general to the field of food dispensing machines, and in particular to methods and systems for storing food products in compartments at certain temperatures prior to dispensing the food products.
Basic techniques and equipment for the storage and dispersal of food products are known in the art. While methods have been implemented to separately store and dispense food products, a systems and methods are desired to more efficiently control and centralize compartments for the storage of foods at various temperatures prior their dispersal through a machine by a consumer.
One drawback with certain implementations includes inefficient or absent heat transfer paths between the storage compartments and the sources that provide the necessary cooling or heating to ensure that the dispensed products are safe and desirable for consumption. For example, dispensing machines for frozen foods, such as soft serve ice cream, may have a refrigerated vat where the premixed ice cream product is stored before being drawn into the freezing cylinder. The vat is surrounded by copper piping, through which cold refrigerant flows. Normally, an ineffective heat transfer path between the copper pipe and the walls of the vat is established with solder. Only competent technicians with specialized welding training may be permitted to manufacture or prepare the storage chambers for food products. In addition to the high cost of labor, the materials and equipment for soldering metal components are expensive. Rather than maximizing the surface areas adjoined by soldering, insufficient amounts of solder are often applied due to the associated costs which results in ineffective heat transfer paths. Accordingly, financial concerns prohibit the production or enhancement of the systems that utilize metal alloys to establish operative heat transfer paths.
The present disclosure may be embodied in various forms, including without limitation an apparatus, system or method for the improved storage of food products in chambers or compartments that require sufficient heat transfer paths to maintain various food products at certain temperatures prior to their dispersal. In accordance with certain embodiments, a graphite-based heat transfer compound may be utilized between the walls of a storage chamber and the adjacent pipes that are adapted to indirectly cool, freeze or heat the food products as desired. For example, in an embodiment, a food dispensing system may utilize a freezing chamber for ice cream or frozen yogurt and a heating chamber for hot fudge or melted caramel. The freezing chamber may be adjoined via a graphite-based compound to a pipe that contains a cold medium adapted to receive thermal energy from the system, and the heating chamber may be adjoined via a graphite-based compound to a second pipe that contains a hot medium adapted to provide thermal energy to the system. Due to the superior thermal conductivity of the graphite-based compound, the heat transfer between the chambers and corresponding pipes may be sufficient effective to ensure that the food products are maintained at certain temperatures based on the temperature of heat transfer medium in the adjoined piping.
In certain embodiments, the temperatures for the foods products may be efficiently controlled as a result of the thermal conductivity provided by the graphite-based compound. For example, the heat transfer capabilities of the graphite-based compound, the piping and the walls of the chambers may enable control of the temperatures of the food products via adjustments to the temperatures of the heat transfer medium within the piping. In some embodiments, a controller may be configured to operably adjust the predetermined temperature ranges for the heat transfer medium within the piping. The controller may be adapted to receive a temperature reading for the stored food product within the product storage chamber, a temperature reading for the frozen food product within the freezing chamber, a temperature reading for the second food product within the heating chamber, and temperature readings for the medium within the corresponding piping that are adjoined to the chambers.
The foregoing and other objects, features, and advantages for embodiments of the present disclosure will be apparent from the following more particular description of the embodiments as illustrated in the accompanying drawings, in which reference characters refer to the same parts throughout the various views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating principles of the present disclosure.
Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings.
A benefit of the graphite-based heat transfer compound includes the inexpensive materials, equipment and labor needed to install the non-metallic compound relative to those used in soldering. Further, a graphite-based compound may readily flow within constricted cavities between chambers and piping. As a result, an advantage of the present disclosure may include the application of a graphite-based compound over greater surfaces of the storage chambers in order to increase the heat transfer path shared with adjacent piping. In turn, the increased size of the heat transfer path improves the amount of thermal energy that may be transferred between the storage chambers and the piping.
Another advantage of the graphite-based compound over solder includes the ability to apply the compound to an apparatus without the equipment and tools needed for soldering, and without the safety concerns associated with the handling of hot solder and a flame torch or a soldering iron. Most solder melt above 180° Celsius, or 356° Fahrenheit. In order to solder large areas, an iron may need to be heated above 400° Celsius or 752° Fahrenheit. Such high working temperatures may prohibit even a skilled welder from ensuring that the melted solder flows into constricted cavities in order to maximize the heat transfer path between a storage chamber and the convoluted piping wound around the chamber.
While a graphite-based compound may not be metallic, the covalent bonding for graphite permits a reliable connection with many metals. For example, graphite-based compounds may bond with steel, stainless steels, titanium, nickel, copper and aluminum alloys. In some embodiments, the bonding capability of a graphite-based compound may include the ability to secure a firm connection between a storage chamber and adjacent piping.
A further benefit of graphite-based compounds include their superior thermal conductivity. At room temperature, around 20° Celsius or 68° Fahrenheit, the thermal conductivity (symbolized by k) of natural graphite may reach 470 Watts per meter per Kelvin (denoted as W/mK), which may be as high as that of the best metals. For example, at room temperature, the thermal conductivity for pure copper may be around 400 W/mK. In contrast, the thermal conductivity for many solders (e.g., alloys comprising 63% of tin and 37% of lead) may be only around 50 W/mK.
The increased heat transfer enabled by the thermal conductivity of graphite-based compounds may provide for greater control over the desired temperatures for the food products contained within the storage compartments. The thermal conductivity of graphite-based compound may match the thermal conductivity of copper-based housing, which may be used to construct both a storage compartment and the adjacent piping. In some embodiments, the heightened and consistent thermal conductivity for the heat transfer between the medium within the piping and the food product within the storage chambers may further enable control of the temperatures of the food products via adjustments to the temperatures of the heat transfer medium within the piping. As an additional benefit appreciated by certain embodiments, such control may ensure that the dispensed food products have a desired temperature so that they are safe for consumption and appropriately frozen or melted in order to meet the expectation and satisfaction of consumers.
In accordance with certain embodiments,
In certain embodiments, the storage chamber 3 may comprise a hopper 3 located within the housing of a food dispensing machine or system 1. To provide additional context of the technical field and the food dispensing machine 1 disclosed herein, the U.S. Pat. No. 9,848,620, which issued on Dec. 26, 2017 and described a frozen food dispensing machine, is hereby incorporated by reference in its entirety. As illustrated by the embodiment in
In an embodiment, a cooling pipe 4 may be adapted to indirectly receive thermal energy from the product storage chamber 3. The product storage chamber 3 may be adapted to indirectly transfer thermal energy from the stored food product 2 to the cooling pipe 4. The cooling pipe 4 may be configured to contain a heat transfer medium 14 (not shown). In an embodiment, the medium 14 may flow through the pipe 4. The heat transfer medium 14 may be adapted to receive thermal energy from an interior surface 15 of the cooling pipe 4. In certain embodiments, the heat transfer medium 14 may comprise a propylene glycol fluid, a propylene glycerin fluid, a refrigerant or water. The heat transfer medium 14 may comprise various forms or phases, such as a liquid, a gas, any mix thereof or any intermediate state between a liquid-state and a gaseous state. The cooling pipe 4 and the storage chamber 3 may be made of metal. In an embodiment, this metal may comprise a copper alloy.
In certain embodiments, the food dispensing system 1 may further include a freezing chamber 16 that may be operably connected to the product storage chamber 3. The freezing chamber 16 may be configured to receive the stored food product 2 from the product storage chamber 3. The freezing chamber 16 may be adapted to receive thermal energy from the received food product 2′ (not shown). In some embodiments, the freezing chamber 16 may be configured to freeze the received food product 2′. In an embodiment, the freezing chamber 16 may comprise a heat exchanger or an evaporator.
A frozen food dispenser 10 may be operably connected to the freezing chamber 16, in accordance with certain embodiments. In an embodiment, the frozen food dispenser 10 may be configured to receive the frozen food product 2″ (not shown) from the freezing chamber 16. The frozen food dispenser 10 may be configured to dispense the frozen food product 2″.
A heat transfer compound 6 may adjoin or boarder an exterior surface 17 of the product storage chamber 3 and an exterior surface 18 of the cooling pipe 4. In some embodiments, wherein the cooling pipe 4 is positioned above the product storage chamber 3, the heat transfer compound 6 may abut a top surface 17 of the product storage chamber 3 and a bottom surface 18 of the cooling pipe 4. The bottom surface 18 may traverse a longitude axis 19 of the cooling pipe 4. In certain embodiment, the heat transfer compound 6 may partially fill a cavity 20. The cavity 20 may be partially defined by an exterior surface 18 of the cooling pipe 4 and an exterior surface 17 of the product storage chamber 3.
The heat transfer compound 6 may be adapted to directly transfer thermal energy from the product storage chamber 3 to the cooling pipe 4. The stored food product 2 within the product storage chamber 3 may have a stored temperature 21 based on the heat exchange between the stored food product 2 and the heat transfer medium 14 within the cooling pipe 4. In some embodiments, the heat transfer medium 14 may have a predetermined temperature range 22. The stored food product 2 within the product storage chamber 3 may have a stored temperature 21 based on the predetermined temperature range 22 of the medium 14 within the cooling pipe 4.
The heat transfer compound 6 may comprise graphite. In an embodiment, the heat transfer compound 6 may comprise thirty (30) to sixty (60) weight percent of graphite. The graphite-based heat transfer compound 6 may be water-soluble. In some embodiments, the heat transfer compound 6 may comprise a mixture of graphite, sodium silicate and clay. In certain embodiments, the heat transfer compound 6 may consist essentially of graphite, sodium silicate and clay. In an embodiment, the heat transfer compound 6 may comprise at least thirty (30) weight percent of graphite, at least thirty (30) weight percent of sodium silicate, and at least one (1) weight percent of clay. A heat transfer compound 6 may comprise thirty (30) to sixty (60) weight percent of sodium silicate. A heat transfer compound 6 may comprise one (1) to twenty (20) weight percent of clay.
In accordance with certain embodiments, the food dispensing machine 1 may further comprise a freezing pipe 23 adapted to indirectly receive thermal energy from the freezing chamber 16. The freezing chamber 16 may be adapted to indirectly transfer thermal energy from the received food product 2′ within the freezing chamber 16 to the freezing pipe 23. The freezing pipe 23 may be configured to contain a second heat transfer medium 24. The second heat transfer medium 24 may be adapted to receive thermal energy from an interior surface 25 of the freezing pipe 23. A second heat transfer compound 6′ may abut or adjoin the freezing chamber 16 and the freezing pipe 23. The second heat transfer compound 6′ may be adapted to directly transfer thermal energy from the freezing chamber 16 to the freezing pipe 23. The second heat transfer compound 6′ may comprise graphite. In an embodiment, the second heat transfer compound 6′ may comprise: thirty (30) to sixty (60) weight percent of graphite, thirty (30) to sixty (60) weight percent of sodium silicate, and one (1) to twenty (20) weight percent of clay.
In certain embodiments, the food dispensing machine 1 may further comprise a heating chamber 26 configured to store a second food product 27, which may be a warm or hot food 27. The heating chamber 26 may be operably connected to a food dispenser or dispensing assembly 10 adapted for warm food products 27. In an embodiment, the heating chamber 26 may be operably connected to the dispensing nozzle 13′ illustrated in
In some embodiments, the heat transfer compounds 6, 6′ and 6″ may comprise the same components, e.g. graphite, sodium silicate and clay. In certain embodiments, the heat transfer compounds 6, 6′ and 6″ may comprise: thirty (30) to sixty (60) weight percent of graphite, thirty (30) to fifty (50) weight percent of sodium silicate, and ten (10) to twenty (20) weight percent of clay (e.g., ball clay). In certain embodiments, the heat transfer compounds 6, 6′ and 6″ may comprise: thirty (30) to sixty (60) weight percent of graphite, thirty (30) to sixty (60) weight percent of sodium silicate, and one (1) to five (5) weight percent of clay (e.g., ball clay). The components of the heat transfer compounds 6, 6′ and 6″ may be chemically bonded. In an embodiment, the heat transfer mediums 5, 14, 24 and 29 may comprise the same substance or mixture. These mediums 5, 14, 24 and 29 may comprise water, a refrigerant, a propylene glycerin fluid, a propylene glycol fluid or an ethylene glycol fluid, such as the glycol-based heat transfer fluid known as Dowtherm SR-1 that is readily available from the Dow Chemical Company. In certain embodiments, the pipes 4, 23, 28 and the food chambers 3, 16 and 26 may be made of the same material, e.g. a copper alloy. The compounds, mediums and materials may be selected to ensure superior thermal conductivity and reliable heat transfer paths.
In embodiment, the heat transfer compounds 6, 6′ and 6″ may each comprise a flowable mixture adapted to be cured into corresponding solid compounds 6, 6′ and 6″. The first solid compound 6 may be adapted to transfer thermal energy from the product storage chamber 3 to the cooling pipe 4. The second solid compound 6′ may be adapted to transfer thermal energy from the freezing chamber 16 to the freezing pipe 23. The third solid compound 6″ may be adapted to transfer thermal energy from the heating pipe 28 to the heating chamber 26. In some embodiments, the heat transfer compounds 6, 6′ and 6″ may be adapted to be cured by air-drying at room temperature within 24 hours. The heat transfer compounds 6, 6′ and 6″ may each comprise a solid or semi-solid compound 6, 6′ and 6″ produced by curing a flowable mixture. The flowable mixture may comprising graphite. The heat transfer compounds 6, 6′ and 6″ may comprise a foam.
In certain embodiments, the food chambers 3, 16 and 26 may be thermally isolated from one another. The pipes 4, 23, 28 may also be thermally isolated from one another. Further, the frozen food dispensing nozzle 13 and the warm food dispensing nozzle 13′ may be thermally isolated from one another. The nozzles 13 and 13′ may be made of a thermally insulating material. In an embodiment, a thermally insulating material may be placed between each of the pipes 4, 23, 28 and each of the food chambers 3, 16 and 26. A thermal insulator 40 (not shown) may be positioned between each of the pipes 4, 23, 28 and between each of the food chambers 3, 16 and 26 in order to inhibit the undesired transfer of thermal energy. In certain embodiments, the thermal isolation between components (i.e., the chambers, pipes and nozzles) may be achieved by physically separating the components so that an air gap sufficiently inhibits the undesired transfer of thermal energy.
In some embodiments, each of the heat transfer mediums 5, 14, 24 and 29 may have a predetermined temperature range 22. In certain embodiments, the food dispensing system 1 may include a controller 31 configured to operably adjust the predetermined temperature ranges 22 for the heat transfer mediums 5, 14, 24 and 29. The predetermined temperature ranges 22 may be received via a user interface 41. The controller 31 may be adapted to receive a temperature reading 32 for the stored food product 2 within the product storage chamber 3, a temperature reading 32 for the frozen food product 2″ within the freezing chamber 16, a temperature reading 32 for the second food product 27 within the heating chamber 26, and temperature readings 32 for the heat transfer mediums 5, 14, 24 and 29. Referring back to
The circuitry for the controller 31 may include hardware, software, middleware, application program interfaces (APIs), and/or other components for implementing the corresponding features of the circuitry. In an embodiment, the circuitry may include a computer device on which the features of the system 1 may be executed. The computer device may include communication interfaces, system circuitry, input/output (I/O) interface circuitry, and display circuitry. The graphical user interfaces (GUIs) displayed by the display circuitry may be representative of GUIs generated by the system 1 to present a query to an enterprise application or end user, requesting temperature information. The graphical user interfaces (GUIs) displayed by the display circuitry may also be representative of GUIs generated by the system 1 to receive query inputs identifying the predetermined temperature ranges 22. The GUIs may be displayed locally using the display circuitry, or for remote visualization, e.g., as HTML, JavaScript, audio, and video output for a web browser running on a local or remote machine. Among other interface features, the GUIs may further render displays of any alerts resulting from the monitored temperatures, e.g. temperature readings 32.
The GUIs and the I/O interface circuitry may include touch sensitive displays, voice or facial recognition inputs, buttons, switches, speakers and other user interface elements. Additional examples of the I/O interface circuitry includes microphones, video and still image cameras, headset and microphone input/output jacks, Universal Serial Bus (USB) connectors, memory card slots, and other types of inputs. The I/O interface circuitry may further include magnetic or optical media interfaces (e.g., a CDROM or DVD drive), serial and parallel bus interfaces, and keyboard and mouse interfaces. The communication interfaces may include wireless transmitters and receivers (“transceivers”) and any antennas used by the transmit-and-receive circuitry of the transceivers. The transceivers and antennas may support WiFi network communications, for instance, under any version of IEEE 802.11, e.g., 802.11n or 802.11ac, or other wireless protocols such as Bluetooth, Wi-Fi, WLAN, cellular (4G, LTE/A). The communication interfaces may also include serial interfaces, such as universal serial bus (USB), serial ATA, IEEE 1394, lighting port, I2C, slimBus, or other serial interfaces. The communication interfaces may also include wireline transceivers to support wired communication protocols. The wireline transceivers may provide physical layer interfaces for any of a wide range of communication protocols, such as any type of Ethernet, Gigabit Ethernet, optical networking protocols, data over cable service interface specification (DOCSIS), digital subscriber line (DSL), Synchronous Optical Network (SONET), or other protocol.
The system circuitry may be implemented, for example, with one or more systems on a chip (SoC), application specific integrated circuits (ASIC), microprocessors, discrete analog and digital circuits, and other circuitry. The system circuitry may implement any desired functionality of the system 1. As just one example, the system circuitry may include one or more instruction processor and memory. The memory stores, for example, control instructions for executing the features of the system 1, as well as an operating system. In one implementation, the processor executes the control instructions and the operating system to carry out any desired functionality for the system 1. Control parameters may provide and specify configuration and operating options for the predetermined temperature ranges 22. The graphical user interfaces (GUIs) 41 for the controller 31 may be located on the housing 7 for the food dispensing machine 1.
In an embodiment of the present disclosure, as set forth in block 401 of
The food storage method may include the step of receiving thermal energy from an exterior surface 17 of the product storage chamber 3 via a heat transfer compound 6 (block 403). The heat transfer compound 6 may abut or boarder the exterior surface 17 of the product storage chamber 3 and an exterior surface 18 of a cooling pipe 4. The heat transfer compound 6 may comprise graphite. The method may also include the step of receiving thermal energy from the heat transfer compound 6 via the exterior surface 18 of the cooling pipe 4. The cooling pipe 4 may be configured to contain a heat transfer medium 14. The heat transfer medium 14 may be adapted to receive thermal energy from an interior surface 15 of the cooling pipe 4. The heat transfer medium 14 may have a temperature within a predetermined temperature range 22. The stored food product 2 within the product storage chamber 3 may have a stored temperature 21 based on the predetermined temperature range 22.
In accordance with some embodiments, the method for the construction, manufacture or preparation of a food dispensing machine 1 may include the step of positioning a cooling pipe 4 adjacent to a product storage chamber 3. An exterior surface 18 of the cooling pipe 4 and an exterior surface 17 of the product storage chamber 3 may define a first cavity 20. The product storage chamber 3 may be configured to store a food product 2. The product storage chamber 3 may be adapted to indirectly transfer thermal energy from the stored food product 2 to the cooling pipe 4.
The method may further include the step of filling, at least partially, the first cavity 20 with a first heat transfer compound 6. The first heat transfer compound 6 may abut or adjoin the exterior surface 18 of the cooling pipe 4 and the exterior surface 17 of the product storage chamber 3. The first heat transfer compound 6 may be adapted to directly transfer thermal energy from the product storage chamber 3 to the cooling pipe 4. The first heat transfer compound 3 may comprise graphite. The method may include the step of filling the cooling pipe 4 with a first heat transfer medium 14. The first heat transfer medium 14 may be adapted to receive thermal energy from an interior surface 15 of the cooling pipe 4. Further, the method may include the step of filling the product storage chamber 3 with the food product 2. The product storage chamber 3 may be operably connected to a freezing chamber 16 and a frozen food dispenser 10. The freezing chamber 16 may be configured to receive the stored food product 2 from the product storage chamber 3. The freezing chamber 16 may be adapted to receive thermal energy from the received food product 2′. The freezing chamber 16 may be configured to freeze the received food product 2′. The frozen food dispenser 10 may be configured to receive the frozen food product 2″ from the freezing chamber 16. The frozen food dispenser 10 may be configured to dispense the frozen food product 2″.
In some embodiments, the preparation method may further include the step of positioning a freezing pipe 23 adjacent to the freezing chamber 16. An exterior surface 34 of the freezing pipe 23 and an exterior surface 35 of the freezing chamber 16 may define a second cavity 36. The freezing chamber 16 may be adapted to indirectly transfer thermal energy from the received food product 2′ within the freezing chamber 16 to the freezing pipe 23. The method may also include the step of filling, at least partially, the second cavity 36 with a second heat transfer compound 6′. The second heat transfer compound 6′ may abut or adjoin the exterior surface 34 of the freezing pipe 23 and the exterior surface 35 of the freezing chamber 16. The second heat transfer compound 6′ may be adapted to directly transfer thermal energy from the freezing chamber 16 to the freezing pipe 23. The method may include the step of filling the freezing pipe 23 with a second heat transfer medium 24. The medium 24 may be adapted to receive thermal energy from an interior surface 25 of the freezing pipe 23.
In certain embodiments, the preparation method may further include the step of positioning a heating pipe 28 adjacent to a heating chamber 26. The heating chamber 26 may be operably connected to a warm food dispenser 10. The warm food dispenser 10 may be adjacent to the frozen food dispenser 10. The warm food dispenser 10 may be configured to dispense a second food product 27 stored within the heating chamber 26. The heating chamber 26 may be adapted to transfer thermal energy from the heating pipe 28 to the second food product 27 contained within the heating chamber 26. An exterior surface 37 of the heating pipe 28 and an exterior surface 38 of the heating chamber 26 may define a third cavity 39. The method may include the step of filling, at least partially, the third cavity 39 with a third heat transfer compound 6″. The third heat transfer compound 6″ may abut or adjoin the exterior surface 37 of the heating pipe 28 and the exterior surface 38 of the heating chamber 26. The third heat transfer compound 6″ may be adapted to transfer thermal energy from the heating chamber 26 to the heating pipe 28. The method may include the step of filling the heating pipe 28 with a third heat transfer medium 29. An interior surface 30 of the heating pipe 28 may be adapted to receive thermal energy from the third heat transfer medium 29.
Referring to
In an embodiment, the food storage machine 1 may store a frozen food product 42. The machine 1 may include a freezing chamber 16 configured to store the frozen food product 42. The freezing chamber 16 may be adapted to receive thermal energy from the stored frozen food product 42. A freezing pipe 23 may be adapted to indirectly receive thermal energy from the freezing chamber 16. The freezing chamber 16 may be adapted to indirectly transfer thermal energy from the stored food product 42 to the freezing pipe 23. The freezing pipe 23 may be configured to contain a heat transfer medium 24. The heat transfer medium 24 may be adapted to receive thermal energy from an interior surface 25 of the freezing pipe 23. A heat transfer compound 6 may adjoin or abut the freezing chamber 16 and the freezing pipe 23. The heat transfer compound 6 may be adapted to directly transfer thermal energy from the freezing chamber 16 to the freezing pipe 23. The heat transfer compound 6 may comprise graphite.
The food storage machine 1 may store a warm or heated food product 27, in accordance with certain embodiments. The machine 1 may include a heating pipe 28 configured to contain a heat transfer medium 29. An interior surface 30 of the heating pipe 28 may be adapted to receive thermal energy from the heat transfer medium 29. A heating chamber 26 may be configured to store a heated food product 27. The heating chamber 26 may be adapted to indirectly receive thermal energy from the heating pipe 28. The heating chamber 26 may be adapted to indirectly transfer thermal energy from the heating pipe 28 to the stored, heated food product 27 within the heating chamber 26. A heat transfer compound 6 may adjoin or abut the heating chamber 26 and the heating pipe 28. The heat transfer compound 6 may be adapted to directly transfer thermal energy from the heating pipe 28 to the heating chamber 26. The heat transfer compound 6 may comprise graphite.
While the present disclosure has been particularly shown and described with reference to an embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure. Although some of the drawings illustrate a number of operations in a particular order, operations that are not order-dependent may be reordered and other operations may be combined or broken out. While some reordering or other groupings are specifically mentioned, others will be apparent to those of ordinary skill in the art and so do not present an exhaustive list of alternatives.
This application claims priority from U.S. Provisional Application No. 62/868,150, filed on Jun. 28, 2019, the entirety of which is hereby incorporated by reference herein.
Filing Document | Filing Date | Country | Kind |
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PCT/US2020/039571 | 6/25/2020 | WO |
Number | Date | Country | |
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62868150 | Jun 2019 | US |