Patent Application
20090304544
Systems and methods are provided for manufacturing brazing alloy components, and particularly to manufacturing brazing alloy components having sufficient ductility to form a ring-shaped member.
Conventional systems and methods for manufacturing alloys used to braze ferrous and non-ferrous metals and alloys have been successful for many years. However, while such conventional methods provide techniques for manufacturing brazing alloys, these systems and methods have not provided brazing alloys capable of forming ring-shaped members to be used in various brazing applications.
In accordance with one embodiment, a method for manufacturing a brazing alloy component comprises extruding a billet to form an elongated member, drawing the elongated member through a die mechanism, and cooling the elongated member to form the alloy component. The billet comprises an alloy material consisting essentially of phosphorus, silicon, copper and at least one of tin and antimony. The alloy component is sufficiently ductile such that the alloy component can be formed into a ring-shaped member.
In accordance with another embodiment, a method of manufacturing a brazing alloy component comprises means for extruding a billet to form an elongated member, means for drawing the elongated member through a die, means for cooling the elongated member to form an alloy component, and means for forming a ring-shaped member from the alloy component. The billet comprises an alloy material consisting essentially of phosphorus, silicon, copper and at least one of tin and antimony.
In accordance with yet another embodiment, a system of manufacturing a brazing alloy component comprises an extrusion device, a heating mechanism, a drawing device and a cooling mechanism. The extrusion device is configured to extrude a billet to form an elongated member. The billet comprises an alloy material consisting essentially of phosphorus, silicon, copper and at least one of tin and antimony. The elongated member has a predetermined thickness. The heating mechanism is configured to heat the elongated member having exited the extrusion device. The drawing device is configured to receive the elongated member from the heating mechanism and modify the elongated member. The modified elongated member has a smaller thickness than the predetermined thickness. The cooling mechanism is configured to cool the elongated member exiting the drawing device to form an alloy component.
While the specification concludes with claims particularly pointing out and distinctly claiming the invention, it is believed that the same will be better understood from the following description taken in conjunction with the accompanying in which:
Embodiments are herein described in detail in connection with the drawings of
As illustrated in the embodiment of
Extruder dies can have any of a variety of suitable designs. One embodiment of an extruder die 24 is illustrated in
Once the extruded elongated member exits the extruder device 22, it can be cooled prior to entering the drawing station 14. For example, the extruded elongated member can be placed on rolls to cool prior to being sent to the drawing station 14. The drawing station 14, as generally represented in
One embodiment of a drawing station 14 is illustrated in
The elongated member can be heated by the heating mechanism 34 prior to entering the drawing device 32. This step softens the elongated member so that it can more easily be drawn down into a desired size or shape. The drawing device 32, as shown in
Once the elongated member is drawn down through the drawing station 14, it enters an annealing station 16 as shown in the embodiments of
As shown in the embodiment of
Wire thickness—0.070 inches
Ring inner diameter—0.308 inches
Wire thickness—0.070 inches
Ring inner diameter—0.366 inches
Wire thickness—0.070 inches
Ring inner diameter—0.369 inches
The process described herein provides an alloy component with enhanced ductility characteristics, and in fact, provides an alloy component with such increased ductility that the alloy component can be formed into ring-shaped members as discussed above. The alloy component discussed herein has a liquidus temperature above about 840° F., thus making the ring-shaped members formed from the alloy component suitable for brazing applications. In fact, one embodiment of the alloy component includes the component having a brazing temperature below about 1300° F. In another embodiment, the alloy component has a brazing temperature below about 1250° F.
As noted herein, prior to the extrusion of the alloy component, the alloy material is in the form of a billet. A billet can comprise multiple forms (e.g., block or cylinder). The billet can be cast from a melting process whereby the chemical elements used to make the alloy material are added together. In one embodiment, the alloy material in its broadest form consists essentially of phosphorus, silicon, copper and at least one of tin and antimony. In another embodiment, the alloy consists essentially of from about 6.0% to about 7.0% phosphorus, from about 6.5% to about 7.0% tin and/or antimony, from about 0.005% to about 0.4% silicon and the remainder copper. In yet another embodiment, the alloy consists essentially of from about 6.5% to about 6.7% phosphorus, from about 6.65% to about 6.85% tin and/or antimony, from about 0.01% to about 0.2% silicon and the remainder copper. In another embodiment, the alloy consists essentially of about 6.6% phosphorus, about 6.75% tin and/or antimony, about 0.015% silicon and the remainder copper. It is noted, that impurities may be present by virtue of the raw materials used to manufacture the alloys or due to process conditions, and are to be distinguished from elements intentionally added to the alloy. Thus, the embodiments of the alloy materials described herein may include impurity amounts of other elements. While the alloy material can include other chemical elements, one embodiment contemplates having the alloy component formed substantially of only the elements phosphorus, tin, silicon and copper. It is noted that, in an alternative embodiment, tin could be replaced with or used in conjunction with antimony. Moreover, a benefit of adding silicon in the presence of tin is to provide a color and/or texture change of the copper base from a dull, grainy, brown finish to a very smooth finish and/or bright tin color. Silicon added to the alloy can also increase the average tensile strength of copper alloys.
In accordance with one embodiment, the ring-shaped member 52 can be placed between two metal or alloy parts and then heated such that at least a major portion of the alloy material from the ring-shaped member 52 is molten such that it flows between the two metal or alloy parts. It is contemplated that the ring-shaped member can be coated with a flux material which can be mechanically added to the ring-shaped member during manufacture or manually added subsequent to production. It will be appreciated that the flux can facilitate improved flow and bonding of the molten alloy material. Once cooled, a brazen joint is formed, wherein the material of the ring-shaped member 52 is bonded to the two metal components. When the alloy component is in the form of a ring-shaped member, it can be used in applications where the parts to be joined are substantially tubular in shape.
Other advantages to using systems, methods and alloy components as described herein can be more broadly contemplated as well. For example, the alloy component provides a low melting temperature, provides strength and gives good capillary fill on loose joints and still works effectively on tight joints.
The foregoing description of embodiments and examples has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the forms described. Numerous modifications are possible in light of the above teachings. Some of those modifications have been discussed, and others will be understood by those skilled in the art. The embodiments were chosen and described in order to best illustrate various embodiments as are suited to the particular use contemplated. It is hereby intended that the scope of the invention be defined by the claims appended hereto.
