Systems for processing sample processing devices

Information

  • Patent Grant
  • 8834792
  • Patent Number
    8,834,792
  • Date Filed
    Friday, November 13, 2009
    14 years ago
  • Date Issued
    Tuesday, September 16, 2014
    9 years ago
Abstract
A system and method for processing sample processing devices. The system can include a base plate adapted to rotate about a rotation axis. The system can further include a cover including a first projection, and a housing. A portion of the housing can be movable with respect to the base plate between an open position and a closed position, and can include a second projection. The first projection and the second projection can be adapted to be coupled together when the portion is in the open position and decoupled when the portion is in the closed position. The method can include coupling the cover to the portion of the housing, moving the portion of the housing from the open position to the closed position, and rotating the base plate about the rotation axis.
Description
FIELD

The present disclosure relates to systems and methods for using rotating sample processing devices to, e.g., amplify genetic materials, etc.


BACKGROUND

Many different chemical, biochemical, and other reactions are sensitive to temperature variations. Examples of thermal processes in the area of genetic amplification include, but are not limited to, Polymerase Chain Reaction (PCR), Sanger sequencing, etc. One approach to reducing the time and cost of thermally processing multiple samples is to use a device including multiple chambers in which different portions of one sample or different samples can be processed simultaneously. Examples of some reactions that may require accurate chamber-to-chamber temperature control, comparable temperature transition rates, and/or rapid transitions between temperatures include, e.g., the manipulation of nucleic acid samples to assist in the deciphering of the genetic code. Nucleic acid manipulation techniques include amplification methods such as polymerase chain reaction (PCR); target polynucleotide amplification methods such as self-sustained sequence replication (3SR) and strand-displacement amplification (SDA); methods based on amplification of a signal attached to the target polynucleotide, such as “branched chain” DNA amplification; methods based on amplification of probe DNA, such as ligase chain reaction (LCR) and QB replicase amplification (QBR); transcription-based methods, such as ligation activated transcription (LAT) and nucleic acid sequence-based amplification (NASBA); and various other amplification methods, such as repair chain reaction (RCR) and cycling probe reaction (CPR). Other examples of nucleic acid manipulation techniques include, e.g., Sanger sequencing, ligand-binding assays, etc.


Some systems used to process rotating sample processing devices are described in U.S. Pat. No. 6,889,468 titled MODULAR SYSTEMS AND METHODS FOR USING SAMPLE PROCESSING DEVICES and U.S. Pat. No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al.).


SUMMARY

Some embodiments of the present disclosure provide a system for processing sample processing devices. The system can include a base plate operatively coupled to a drive system and having a first surface, wherein the drive system rotates the base plate about a rotation axis, and wherein the rotation axis defines a z-axis. The system can further include a cover adapted to be positioned facing the first surface of the base plate. The cover can include a first projection. The system can further include a housing comprising a portion movable with respect to the base plate between an open position in which the cover is not coupled to the base plate and a closed position in which the cover is coupled to the base plate. The portion can include a second projection. The first projection and the second projection can be adapted to be coupled together when the portion is in the open position and decoupled from each other when the portion is in the closed position, such that the cover is rotatable with the base plate about the rotation axis when the portion is in the closed position and when the cover is coupled to the base plate. The system can further include a sample processing device comprising at least one process chamber and adapted to be positioned between the base plate and the cover. The sample processing device can be rotatable with the base plate about the rotation axis when the sample processing device is coupled to the base plate.


Some embodiments of the present disclosure provide a method for processing sample processing devices. The method can include providing a base plate operatively coupled to a drive system and having a first surface, providing a cover adapted to be positioned facing the first surface of the base plate, and providing a housing. The housing can include a portion movable with respect to the base plate between an open position in which the cover is not coupled to the base plate and a closed position in which the cover is coupled to the base plate. The method can further include positioning a sample processing device on the base plate. The sample processing device can include at least one process chamber. The method can further include coupling the cover to the portion of the housing when the portion of the housing is in the open position, and moving the portion of the housing from the open position to the closed position. The method can further include coupling the cover to the base plate at least partially in response to moving the portion of the housing from the open position to the closed position. The method can further include rotating the base plate about a rotation axis, wherein the rotation axis defines a z-axis.


Other features and aspects of the present disclosure will become apparent by consideration of the detailed description and accompanying drawings.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is an exploded perspective view of an assembly according to one embodiment of the present disclosure, the system including a cover, a sample processing device, and a base plate.



FIG. 2 is an assembled perspective cross-sectional view of the system of FIG. 1.



FIG. 3 is a perspective view of a system according to one embodiment of the present disclosure, the system including the assembly of FIGS. 1-2, the system shown in an open position.



FIG. 4 is a perspective view of the system of FIG. 3, the system shown in a partially open position.



FIG. 5 is a close-up side cross-sectional view of the system of FIGS. 3-4, the system shown in a first position.



FIG. 6 is a close-up side cross-sectional view of the system of FIGS. 3-5, the system shown in a second position.



FIG. 7 is a close-up side cross-sectional view of the system of FIGS. 3-6, the system shown in a third position.





DETAILED DESCRIPTION

Before any embodiments of the present disclosure are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “connected,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect connections and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings. It is to be understood that other embodiments may be utilized, and structural or logical changes may be made without departing from the scope of the present disclosure. Furthermore, terms such as “front,” “rear,” “top,” “bottom,” and the like are only used to describe elements as they relate to one another, but are in no way meant to recite specific orientations of the apparatus, to indicate or imply necessary or required orientations of the apparatus, or to specify how the invention described herein will be used, mounted, displayed, or positioned in use.


The present disclosure generally relates to systems and methods for sample processing devices. Such systems can include means for holding, rotating, thermally controlling and/or accessing portions of a sample processing device. In addition, systems and methods of the present disclosure can provide or facilitate positioning a sample processing device in a desired location of the system, for example, for conducting an assay of interest, and/or removing the sample processing device from the system, for example, when an assay of interest is complete. Furthermore, systems and methods of the present disclosure can facilitate such positioning or removal of a sample processing device without the need for additional tools or equipment.


In some embodiments of systems and methods of the present disclosure, the system can include an annular compression system, which can include an open area (e.g., an open central area), such that the annular compression system can perform and/or facilitate the desired thermal control and rotation functions for the sample processing device, while allowing access to at least a portion of the sample processing device. For example, some systems of the present disclosure cover a top surface of a sample processing device in order to hold the sample processing device onto a rotating base plate and/or to thermally control and isolate portions of the sample processing device (e.g., from one another and/or ambience). However, other systems of the present disclosure (e.g., annular compression systems and methods) can provide the desired positioning and holding functions as well as the desired thermal control functions, while also allowing a portion of the sample processing device to be exposed to other devices or systems for which it may be desirable to have direct access to the sample processing device. For example, in some embodiments, sample delivery (e.g., manual or automatic pipetting) can be accomplished after the sample processing device has already been positioned between an annular cover and a base plate. By way of further example, in some embodiments, a portion of the sample processing device can be optically accessible (e.g., to electromagnetic radiation), for example, which can enable more efficient laser addressing of the sample processing device, or which can be used for optical interrogation (e.g., absorption, reflectance, fluorescence, etc.). Such laser addressing can be used, for example, for fluid (e.g., microfluidic) manipulation of a sample in the sample processing device.


Furthermore, in some embodiments, annular compression systems and methods of the present disclosure can enable unique temperature control of various portions of a sample processing device. For example, fluid (e.g., air) can be moved over an exposed surface of the sample processing device in areas that are desired to be rapidly cooled, while the areas that are desired to be heated or maintained at a desired temperature can be covered and isolated from other portions of the sample processing device and/or from ambience.


In addition, in some embodiments, systems and methods of the present disclosure can allow a portion of the sample processing device to be exposed to interact with other (e.g., external or internal) devices or equipment, such as robotic workstations, pipettes, interrogation instruments, and the like, or combinations thereof. Similarly, the systems and methods of the present disclosure can protect desired portions of the sample processing device from contact.


As a result, “accessing” at least a portion of a sample processing device can refer to a variety of processing steps and can include, but is not limited to, physically or mechanically accessing the sample processing device (e.g., delivering or retrieving a sample via direct or indirect contact, moving or manipulating a sample in the sample processing device via direct or indirect contact, etc.); optically accessing the sample processing device (e.g., laser addressing); thermally accessing the sample processing device (e.g., selectively heating or cooling an exposed portion of the sample processing device); and the like; and combinations thereof.


The present disclosure provides methods and systems for sample processing devices that can be used in methods that involve thermal processing, e.g., sensitive chemical processes such as polymerase chain reaction (PCR) amplification, transcription-mediated amplification (TMA), nucleic acid sequence-based amplification (NASBA), ligase chain reaction (LCR), self-sustaining sequence replication, enzyme kinetic studies, homogeneous ligand binding assays, and more complex biochemical or other processes that require precise thermal control and/or rapid thermal variations. The sample processing systems are capable of providing simultaneous rotation of the sample processing device in addition to effecting control over the temperature of sample materials in process chambers on the devices.


Some examples of suitable sample processing devices that may be used in connection with the methods and systems of the present disclosure may be described in, e.g., commonly-assigned U.S. Patent Publication No. 2007/0010007 titled SAMPLE PROCESSING DEVICE COMPRESSION SYSTEMS AND METHODS (Aysta et al.); U.S. Patent Publication No. 2007/0009391 titled COMPLIANT MICROFLUIDIC SAMPLE PROCESSING DISKS (Bedingham et al.); U.S. Patent Publication No. 2008/0050276 titled MODULAR SAMPLE PROCESSING APPARATUS KITS AND MODULES (Bedingham et al.); U.S. Pat. No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al.) and U.S. Pat. No. 7,026,168 titled SAMPLE PROCESSING DEVICES (Bedingham et al.). Other useable device constructions may be found in, e.g., U.S. Pat. No. 7,435,933 (Bedingham et al.) titled ENHANCED SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS; U.S. Provisional Patent Application Ser. No. 60/237,151 filed on Oct. 2, 2000 and entitled SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS (Bedingham et al.); and U.S. Pat. No. 6,814,935 titled SAMPLE PROCESSING DEVICES AND CARRIERS (Harms et al.). Other potential device constructions may be found in, e.g., U.S. Pat. No. 6,627,159 titled CENTRIFUGAL FILLING OF SAMPLE PROCESSING DEVICES (Bedingham et al.); PCT Patent Publication No. WO 2008/134470 titled METHODS FOR NUCLEIC ACID AMPLIFICATION (Parthasarathy et al.); and U.S. Patent Publication No. 2008/0152546 titled ENHANCED SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS (Bedingham et al.).


Some embodiments of the sample processing systems of the present disclosure can include base plates attached to a drive system in a manner that provides for rotation of the base plate about an axis of rotation. When a sample processing device is secured to the base plate, the sample processing device can be rotated with the base plate. The base plate can include at least one thermal structure that can be used to heat portions of the sample processing device and may include a variety of other components as well, e.g., temperature sensors, resistance heaters, thermoelectric modules, light sources, light detectors, transmitters, receivers, etc.


Other elements and features of systems and methods for processing sample processing devices can be found in U.S. patent application Ser. No. 12/617,905, filed on even date herewith, which is incorporated herein by reference in its entirety.



FIGS. 1-2 illustrate a sample processing assembly 50 that can be used in connection with sample processing systems of the present disclosure. For example, systems of the present disclosure can include the sample processing assembly 50 or portions thereof, and can include other elements as well. FIGS. 3-7 illustrate a system 100 according to one embodiment of the present disclosure that, by way of example only, includes the sample processing assembly 50. Elements and features of the sample processing assembly 50 will be described first below.


As shown in FIGS. 1-2, the assembly 50 can include a base plate 110 that rotates about an axis of rotation 111. The base plate 110 can also be attached to a drive system 120, for example, via a shaft 122. It will, however, be understood that the base plate 110 may be coupled to the drive system 120 through any suitable alternative arrangement, e.g., belts or a drive wheel operating directly on the base plate 110, etc.


As shown in FIGS. 1-2, the assembly 50 can further include a sample processing device 150 and an annular cover 160 that can be used in connection with the base plate 110, as will be described herein. Systems of the present disclosure may not actually include a sample processing device as, in some instances, sample processing devices are consumable devices that are used to perform a variety of tests, etc. and then discarded. As a result, the systems of the present disclosure may be used with a variety of different sample processing devices.


As shown in FIGS. 1-2, the depicted base plate 110 includes a thermal structure 130 that can include a thermal transfer surface 132 exposed on the top surface 112 of the base plate 110. By “exposed” it is meant that the transfer surface 132 of the thermal structure 130 can be placed in physical contact with a portion of a sample processing device 150 such that the thermal structure 130 and the sample processing device 150 are thermally coupled to transfer thermal energy via conduction. In some embodiments, the transfer surface 132 of the thermal structure 130 can be located directly beneath selected portions of a sample processing device 150 during sample processing. For example, in some embodiments, the selected portions of the sample processing device 150 can include one or more process chambers, such as thermal process chambers 152. The process chambers can include those discussed in, e.g., U.S. Pat. No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al.). By way of further example, the sample processing device 150 can include various features and elements, such as those described in U.S. Patent Publication No. 2007/0009391 titled COMPLIANT MICROFLUIDIC SAMPLE PROCESSING DISKS (Bedingham et al.).


As a result, by way of example only, the sample processing device 150 can include one or more input wells and/or other chambers (sometimes referred to as “non-thermal” chambers or “non-thermal” process chambers) 154 positioned in fluid communication with the thermal process chambers 152. For example, in some embodiments, a sample can be loaded onto the sample processing device 150 via the input wells 154 and can then be moved via channels (e.g., microfluidic channels) and/or valves to other chambers and/or ultimately to the thermal process chambers 152.


In some embodiments, as shown in FIGS. 1-2, the input wells 154 can be positioned between a center 151 of the sample processing device 150 and at least one of the thermal process chambers 152. In addition, the annular cover 160 can be configured to allow access to a portion of the sample processing device 150 that includes the input well(s) 154, such that the input well(s) 154 can be accessed when the cover 160 is positioned adjacent to or coupled to the sample processing device 150.


As shown in FIGS. 1-2, the annular cover 160 can, together with the base plate 110, compress a sample processing device 150 located therebetween, for example, to enhance thermal coupling between the thermal structure 130 on the base plate 110 and the sample processing device 150. In addition, the annular cover 160 can function to hold and/or maintain the sample processing device 150 on the base plate 110, such that the sample processing device 150 and/or the cover 160 can rotate with the base plate 110 as it is rotated about axis 111 by drive system 120. The rotation axis 111 can define a z-axis of the assembly 50.


As used herein, the term “annular” or derivations thereof can refer to a structure having an outer edge and an inner edge, such that the inner edge defines an opening. For example, an annular cover can have a circular or round shape (e.g., a circular ring) or any other suitable shape, including, but not limited to, triangular, rectangular, square, trapezoidal, polygonal, etc., or combinations thereof. Furthermore, an “annulus” of the present invention need not necessarily be symmetrical, but rather can be an asymmetrical or irregular shape; however, certain advantages may be possible with symmetrical and/or circular shapes.


The compressive forces developed between the base plate 110 and the cover 160 may be accomplished using a variety of different structures or combination of structures. One exemplary compression structure depicted in FIGS. 1-2 are magnetic elements 170 located on (or at least operatively coupled to) the cover 160 and corresponding magnetic elements 172 located on (or at least operatively coupled to) the base plate 110. Magnetic attraction between the magnetic elements 170 and 172 may be used to draw the cover 160 and the base plate 110 towards each other, thereby compressing, holding, and/or deforming a sample processing device 150 located therebetween. As a result, the magnetic elements 170 and 172 can be configured to attract each other to force the annular cover 160 in a first direction D1 (see FIG. 1) along the z-axis of the assembly 50, such that at least a portion of the sample processing device 150 is urged into contact with the transfer surface 132 of the base plate 110.


As used herein, a “magnetic element” is a structure or article that exhibits or is influenced by magnetic fields. In some embodiments, the magnetic fields can be of sufficient strength to develop the desired compressive force that results in thermal coupling between a sample processing device 150 and the thermal structure 130 of the base plate 110 as discussed herein. The magnetic elements can include magnetic materials, i.e., materials that either exhibit a permanent magnetic field, materials that are capable of exhibiting a temporary magnetic field, and/or materials that are influenced by permanent or temporary magnetic fields.


Some examples of potentially suitable magnetic materials include, e.g., magnetic ferrite or “ferrite” which is a substance including mixed oxides of iron and one or more other metals, e.g., nanocrystalline cobalt ferrite. However, other ferrite materials may be used. Other magnetic materials which may be used in the assembly 50 may include, but are not limited to, ceramic and flexible magnetic materials made from strontium ferrous oxide which may be combined with a polymeric substance (such as, e.g., plastic, rubber, etc.); NdFeB (this magnetic material may also include Dysprosium); neodymium boride; SmCo (samarium cobalt); and combinations of aluminum, nickel, cobalt, copper, iron, titanium, etc.; as well as other materials. Magnetic materials may also include, for example, stainless steel, paramagnetic materials, or other magnetizable materials that may be rendered sufficiently magnetic by subjecting the magnetizable material to a sufficient electric and/or magnetic field.


In some embodiments, the magnetic elements 170 and/or the magnetic elements 172 can include strongly ferromagnetic material to reduce magnetization loss with time, such that the magnetic elements 170 and 172 can be coupled with a reliable magnetic force, without substantial loss of that force over time.


Furthermore, in some embodiments, the magnetic elements of the present disclosure may include electromagnets, in which the magnetic fields can be switched on and off between a first magnetic state and a second non-magnetic state to activate magnetic fields in various areas of the assembly 50 in desired configurations when desired.


In some embodiments, the magnetic elements 170 and 172 can be discrete articles operatively coupled to the cover 160 and the base plate 110, as shown in FIGS. 1-2 (in which the magnetic elements 170 and 172 are individual cylindrically-shaped articles). However, in some embodiments, the base plate 110, the thermal structure 130, and/or the cover 160 can include sufficient magnetic material (e.g., molded or otherwise provided in the structure of the component), such that separate discrete magnetic elements are not required. In some embodiments, a combination of discrete magnetic elements and sufficient magnetic material (e.g., molded or otherwise) can be employed.


As shown in FIGS. 1-2, the annular cover 160 can include a center 161, which can be in line with the rotation axis 111 when the cover 160 is coupled to the base plate 110, an inner edge 163 that at least partially defines an opening 166, and an outer edge 165. As described above, the opening 166 can facilitate accessing at least a portion of the sample processing device 150 (e.g., a portion comprising the input wells 154), for example, even when the annular cover 160 is positioned adjacent to or coupled to the sample processing device 150. As shown in FIGS. 1-2, the inner edge 163 of the annular cover 160 can be configured to be positioned inwardly (e.g., radially inwardly) of the thermal process chambers 152, relative to the center 161 of the annular cover 160, for example, when the annular cover 160 is positioned adjacent the sample processing device 150. In addition, the inner edge 163 of the annular cover 160 can be configured to be positioned radially outwardly of the input wells 154. Furthermore, in some embodiments, as shown in FIGS. 1-2, the outer edge 165 of the annular cover 160 can be configured to be positioned outwardly (e.g., radially outwardly) of the thermal process chambers 152 (and also outwardly of the input wells 154).


The inner edge 163 can be positioned a first distance d1 (e.g., a first radial distance or “first radius”) from the center 161 of the annular cover 160. In such embodiments, if the annular cover 160 has a substantially circular ring shape, the opening 166 can have a diameter equal to twice the first distance d1. In addition, the outer edge 165 can be positioned a second distance d2 (e.g., a second radial distance or “second radius”) from the center 161 of the annular cover 160. In some embodiments, the first distance d1 can be at least about 50% of the second distance. In some embodiments, at least about 60%, and in some embodiments, at least about 70%. In addition, in some embodiments, the first distance d1 can be no greater than about 95% of the second distance, in some embodiments, no greater than about 85%, and in some embodiments, no greater than about 80%. In some embodiments, the first distance d1 can be about 75% of the second distance d2.


Furthermore, in some embodiments, the outer edge 165 can be positioned a distance d2 (e.g., a radial distance) from the center 161, which can define a first area, and in some embodiments, the area of the opening 166 can be at least about 30% of the first area, in some embodiments, at least about 40%, and in some embodiments, at least about 50%. In some embodiments, the opening 166 can be no greater than about 95% of the first area, in some embodiments, no greater than about 75%, and in some embodiments, no greater than about 60%. In some embodiments, the opening 166 can be about 53% of the first area.


In addition, the annular cover 160 can include an inner wall 162 (e.g., an “inner circumferential wall” or “inner radial wall”; which can function as an inner compression ring, in some embodiments, as described below) and an outer wall 164 (e.g., an “outer circumferential wall” or “outer radial wall”; which can function as an outer compression ring, in some embodiments, as described below). In some embodiments, inner and outer walls 162 and 164 can include or define the inner and outer edges 163 and 165, respectively, such that the inner wall 162 can be positioned inwardly (e.g., radially inwardly) of the thermal process chambers 152, and the outer wall 164 can be positioned outwardly (e.g., radially outwardly) of the thermal process chambers 152. As further shown in FIGS. 1-2, in some embodiments, the inner wall 162 can include the magnetic elements 170, such that the magnetic elements 170 form a portion of or are coupled to the inner wall 162. For example, in some embodiments, the magnetic elements 170 can be embedded (e.g., molded) in the inner wall 162. As shown in FIG. 1-2, the annular cover 160 can further include an upper wall 167 that can be positioned to cover a portion of the sample processing device 150, such as a portion that comprises the thermal process chambers 152.


As shown in FIGS. 1 and 2, in some embodiments, the upper wall 167 can extend inwardly (e.g., radially inwardly) of the inner wall 162 and the magnetic elements 170. In the embodiment illustrated in FIGS. 1-4, the upper wall 167 does not extend much inwardly of the inner wall 162. However, in some embodiments, the upper wall 167 can extend further inwardly of the inner wall 162 and/or the magnetic elements 170 (e.g., toward the center 161 of the cover 160), for example, such that the size of the opening 166 is smaller than what is depicted in FIGS. 1-4. Furthermore, in some embodiments, the upper wall 167 can define the inner edge 163 and/or the outer edge 165.


In some embodiments, at least a portion of the cover 160, such as one or more of the inner wall 162, the outer wall 164, and the upper wall 167, can be optically clear. For example, at least a portion of the upper wall 167 that is adapted to be positioned over one or more of the input wells 154 and/or a portion of the upper wall 167 that is adapted to be positioned over the thermal process chambers 152 can be optically clear to allow for optically accessing at least a portion of the sample processing device 150.


As used herein, the phrase “optically clear” can refer to an object that is transparent to electromagnetic radiation ranging from the infrared to the ultraviolet spectrum (e.g., from about 10 nm to about 10 μm (10,000 nm)); however, in some embodiments, the phrase “optically clear” can refer to an object that is transparent to electromagnetic radiation in the visible spectrum (e.g., about 400 nm to about 700 nm). In some embodiments, the phrase “optically clear” can refer to an object with a transmittance of at least about 80% within the wavelength ranges above.


Such configurations of the annular cover 160 can function to effectively or substantially isolate the thermal process chambers 152 of the sample processing device 150 when the cover 160 is coupled to or positioned adjacent the sample processing device 150. For example, the cover 160 can physically, optically, and/or thermally isolate a portion of the sample processing device 150, such as a portion comprising the thermal process chambers 152. In some embodiments, as shown in FIG. 1, the sample processing device 150 can include one or more thermal process chambers 152, and further, in some embodiments, the one or more thermal process chambers 152 can be arranged in an annulus about the center 151 of the sample processing device 150, which can sometimes be referred to as an “annular processing ring.” In such embodiments, the annular cover 160 can be adapted to cover and/or isolate a portion of the sample processing device 150 that includes the annular processing ring or the thermal process chambers 152. For example, the annular cover 160 includes the inner wall 162, the outer wall 164, and the upper wall 167 to cover and/or isolate the portion of the sample processing device 150 that includes the thermal process chambers 152. In some embodiments, one or more of the inner wall 162, the outer wall 164, and the upper wall 167 can be a continuous wall, as shown, or can be formed of a plurality of portions that together function as an inner or outer wall (or inner or outer compression ring), or an upper wall. In some embodiments, enhanced physical and/or thermal isolation can be obtained when at least one of the inner wall 162, the outer wall 164 and the upper wall 167 is a continuous wall.


In addition, in some embodiments, the ability of the annular cover 160 to cover and effectively thermally isolate the thermal process chambers 152 from ambience and/or from other portions of the assembly 50 can be important, because otherwise, as the base plate 110 and the sample processing device 150 are rotated about the rotation axis 111, air can be caused to move quickly past the thermal process chambers 152, which, for example, can undesirably cool the thermal process chambers 152 when it is desired for the chambers 152 to be heated. Thus, in some embodiments, depending on the configuration of the sample processing device 150, one or more of the inner wall 162, the upper wall 167 and the outer wall 164 can be important for thermal isolation.


As shown in FIGS. 1-2, in some embodiments, the sample processing device 150 can also include a device housing or body 153, and in some embodiments, the body 153 can define the input wells 154 or other chambers, any channels, the thermal process chambers 152, etc. In addition, in some embodiments, the body 153 of the sample processing device 150 can include an outer lip, flange or wall 155. In some embodiments, as shown in FIGS. 1-2, the outer wall 155 can include a portion 157 adapted to cooperate with the base plate 110 and a portion 159 adapted to cooperate with the annular cover 160. For example, as shown in FIG. 2, the annular cover 160 (e.g., the outer wall 164) can be dimensioned to be received within the area circumscribed by the outer wall 155 of the sample processing device 150. As a result, in some embodiments, the outer wall 155 of the sample processing device 150 can cooperate with the annular cover 160 to cover and/or isolate the thermal process chambers 152. Such cooperation can also facilitate positioning of the annular cover 160 with respect to the sample processing device 150 such that the thermal process chambers 152 are protected and covered without the annular cover 160 pressing down on or contacting any of the thermal process chambers 152.


In some embodiments, the outer wall 155 of the sample processing device 150 and the one or more input wells 154 formed in the body 153 of the sample processing device 150 can effectively define a recess (e.g., an annular recess) 156 in the sample processing device 150 (e.g., in a top surface of the sample processing device 150) in which at least a portion of the annular cover 160 can be positioned. For example, as shown in FIGS. 1-2, the inner wall 162 (e.g., including the magnetic elements 170) and the outer wall 164 can be positioned in the recess 156 of the sample processing device 150 when the annular cover 160 is positioned over or coupled to the sample processing device 150. As a result, in some embodiments, the outer wall 155, the input wells 154 and/or the recess 156 can provide reliable positioning of the cover 160 with respect to the sample processing device 150.


In some embodiments, as shown in FIGS. 1-2, the magnetic elements 170 can be arranged in an annulus, and the annulus or portion of the cover 160 that includes the magnetic elements 170 can include an inner edge (e.g., an inner radial edge) 173 (see FIGS. 5-7) and an outer edge (e.g., an outer radial edge) 175 (see FIGS. 5-7). As shown in FIGS. 1-2, the cover 160 and/or the magnetic elements 170 can be configured, such that both the inner edge 173 and the outer edge 175 can be positioned inwardly (e.g., radially inwardly) with respect to the thermal process chambers 152.


As a result, in some embodiments, the magnetic elements 170 can be restricted to an area of the cover 160 where the magnetic elements 170 are positioned outwardly (e.g., radially outwardly) of the input wells 154 (or other protrusions, chambers, recesses, or formations in the body 153) and inwardly (e.g., radially inwardly) of the thermal process chambers 152. In such configurations, the magnetic elements 170 can be said to be configured to maximize the open area of the sample processing device 150 that is available for access by other devices or for other functions. In addition, in such embodiments, the magnetic elements 170 can be positioned so as not to interrupt or disturb the processing of a sample positioned in the thermal process chambers 152.


In some embodiments, as shown in FIGS. 1-2, the magnetic elements 170 of the cover 160 can form at least a portion of or be coupled to the inner wall 162, such that the magnetic elements 170 can function as at least a portion of the inner compression ring 162 to compress, hold, and/or deform the sample processing device 150 against the thermal transfer surface 132 of the thermal structure 130 of the base plate 110. As shown in FIGS. 1-2, one or both of the magnetic elements 170 and 172 can be arranged in an annulus, for example, about the rotation axis 111. Furthermore, in some embodiments, at least one of the magnetic elements 170 and 172 can include a substantially uniform distribution of magnetic force about such an annulus.


In addition, the arrangement of the magnetic elements 170 in the cover 160 and the corresponding arrangement of the magnetic elements 172 in the base plate 110 can provide additional positioning assistance for the cover 160 with respect to one or both of the sample processing device 150 and the base plate 110. For example, in some embodiments, the magnetic elements 170 and 172 can each include sections of alternating polarity and/or a specific configuration or arrangement of magnetic elements, such that the magnetic elements 170 of the cover 160 and the magnetic elements 172 of the base plate 110 can be “keyed” with respect to each other to allow the cover 160 to reliably be positioned in a desired orientation (e.g., angular position relative to the rotation axis 111) with respect to at least one of the sample processing device 150 and the base plate 110.


In some embodiments, compliance of sample processing devices of the present disclosure may be enhanced if the devices include annular processing rings that are formed as composite structures including cores and covers attached thereto using pressure sensitive adhesives. The sample processing device 150 shown in FIGS. 1-2 is an example of one such composite structure. As shown in FIG. 1, in some embodiments, the sample processing device 150 can include the body 153 to a first covers 182 and a second cover (not shown) are attached using adhesives (e.g., pressure sensitive adhesives). Where process chambers (e.g., thermal process chambers 152) are provided in a circular array (as depicted in FIG. 1) that is formed by a composite structure, the thermal process chambers 152 and covers can at least partially define a compliant annular processing ring that is adapted to conform to the shape of the underlying thermal transfer surface 132 when the sample processing device 150 is forced against the transfer surface 132, such as a shaped thermal transfer surface 132. In such embodiments, the compliance can be achieved with some deformation of the annular processing ring while maintaining the fluidic integrity of the thermal process chambers or any other fluidic passages or chambers in the sample processing device 150 (i.e., without causing leaks).


In some embodiments, the annular cover 160 may not include an outer wall 164 and/or an upper wall 167. In such embodiments, the thermal process chambers 152 may be exposed and accessible, or the upper wall 167 alone, if present, may cover that portion of the sample processing device 150. Furthermore, in some embodiments, the cover may include a smaller opening than the opening 166 shown in FIGS. 1-2, and in some embodiments, the cover may not include an opening at all, but rather can be disc-shaped.


That is, in some embodiments, the assembly 50 and system 100 can be used in connection with a different sample processing device and/or cover than those of the sample processing assembly 50. It should be understood that that the sample processing assembly 50 is shown by way of example only. Other sample processing devices may themselves be capable of substantially thermally isolating thermal process chambers without requiring that the cover be configured to provide thermal isolation. As a result, the systems of the present disclosure can be adapted to cooperate with a variety of covers and sample processing devices. In addition, certain covers may be more useful in combination with some sample processing devices than others.


The system 100 shown in FIGS. 3-7 is shown as including the sample processing assembly 50; however, it should be noted that other sample processing assemblies can be used in connection with, or form a portion of, the system 100. In addition, as mentioned above, in some embodiments, the sample processing device is a consumable component and does not form a portion of the sample processing assembly 50 or the system 100.


The system 100 is shown in an open position or state Po in FIG. 3 and in a partially closed (or partially open) state or position Pp in FIG. 4. As shown in FIGS. 3 and 4, the system 100 can include a housing 102 that can include a first portion (sometimes referred to as a “lid”) 104 and a second portion (sometimes referred to as a “base”) 106 that are movable with respect to each other between the open position Po and a closed position Pc (see FIG. 5), including a variety of positions intermediate of the open position Po and the closed position Pc, such as the partially closed position Pp. By way of example only, the first portion 104 is shown in FIGS. 3 and 4 as being movable with respect to the second portion 106, while the second portion 106 remains substantially stationary. However, it should be understood that a variety of suitable relative movements between the first portion 104 and the second portion 106 can be employed. For example, in some embodiments, the second portion 106 can be movable relative to the first portion 104.


The housing 102, and particularly, the first portion 104 and the second portion 106, can form an enclosure around the sample processing assembly 50, for example, during various processing or assaying steps or procedures, such as those described above, so as to isolate the sample processing assembly 50 from ambience during such processing. That is, in some embodiments, the housing 102 can be configured to have at least one state or position in which the at least a portion of the sample processing assembly 50 can be thermally isolated from ambience, physically separated or protected from ambience, and/or fluidly separated from ambience.


As described above, the cover 160 can be used to hold, maintain and/or deform the sample processing device 150 on the base plate 110. The base plate 110 is not visible in FIGS. 3 and 4 because the sample processing device 150 has already been positioned on the base plate 110 in FIGS. 3 and 4. The cover 160 is shown in FIGS. 3 and 4 as being coupled to a portion of the first portion 104 of the housing 102. For example, in FIG. 3, the cover 160 has been positioned on a hanger 108 that is provided by the first portion 104 of the housing 102. The housing 102 can include or can be coupled to the hanger 108. In addition, by way of example only, the system 100 is shown in FIGS. 3 and 4 as the cover 160 being coupled to the first portion 104 of the housing 102, and the sample processing device 150 being positioned on the base plate 110 in the second portion 106 of the housing 102. However, it should be understood that a variety of other suitable configurations are possible and within the scope of the present disclosure. For example, in some embodiments, the second portion 106 is movable with respect to the first portion 104, and in some embodiments, the sample processing device 150 and the base plate 110 are positioned in the first portion 104 of the housing 102, and the cover 160 is coupled to a hanger 108 in the second portion 106 of the housing 102.


In addition, although not shown in FIGS. 3 and 4, the base plate 110 can be rotated about the rotation axis 111 via any of a variety of drive systems that can be positioned in the system 100, or coupled to the system 100. For example, in some embodiments, a suitable drive system can be located in the second portion 106 of the housing 102, positioned to drive the base plate 110. Furthermore, in some embodiments, the electromagnetic energy source 190 can also be positioned below the base plate 110 in the second portion 106 of the housing 102.


As shown in FIGS. 3 and 4, the cover 160 can interact with at least a portion of the housing 102 (e.g., the hanger 108 provided by the first portion 104 of the housing 102), such that the cover 160 can be moved toward or away from the sample processing device 150 when the first portion 104 and the second portion 106 of the housing 102 are moved relative to one another. In addition, in some embodiments, the cover 160 can be coupled to or decoupled from a portion of the housing 102 without the use of additional tools or equipment. Such an interaction between the cover 160 and the housing 102 can provide robust, reliable and safe positioning of the cover 160 with respect to the sample processing device 150 and/or the base plate 110. Furthermore, the cover 160 can be decoupled from the first portion 104 of the housing 102 for cleaning and/or disposal. Then, the cover 160 can be reused, for example, with a new sample processing device 150, by repositioning the cover 160 on the hanger 108. Alternatively, the cover 160 can be discarded after use, and a new, second cover can then be coupled to the housing 102 and moved toward the sample processing device 150 (or a new sample processing device) and/or the base plate 110.


As described above, the magnetic elements 170 in the cover 160 can be adapted to attract the magnetic elements 172 in the base plate 110. As a result, as the first portion 104 of the housing 102 is moved closer to the second portion 106, the magnetic elements 170 begin to get near enough to the magnetic elements 172 to cause an attraction between the magnetic elements 170 and the magnetic elements 172. Such an attraction can provide additional positioning assistance between the cover 160 and the base plate 110 and/or the sample processing device 150. For example, such an attraction can inhibit the cover 160 from falling off of the hanger 108 as the angle α (as shown in FIG. 4 and described below) between the first portion 104 and the second portion 106 decreases.


As shown in FIGS. 1-2, the inner edge 163 of the cover 160 is at least partially provided by a lip, flange or projection 124 (see also FIGS. 3-7; also sometimes referred to as the “first projection”). By way of example only, the projection 124 is shown as being an extension of the upper wall 167 of the cover 160, and extending further inwardly (e.g., radially inwardly) of the inner edge 173 of the magnetic elements 170 (and/or of the inner wall 162). Because the cover 160 is shown in the illustrated embodiment as having a circular ring shape, the projection 124 of the illustrated embodiment is an inner radial projection that projects radially inwardly, relative to the center 161 of the cover 160. However, it should be understood that other configurations of the projection 124 are possible, and can depend on the general shape and structure of the cover 160. For example, in some embodiments, the projection 124 is not necessarily a radial projection, and in some embodiments, the projection 124 is not necessarily an inner projection, as will be described in greater detail below.


As further shown in FIGS. 5-7, the hanger 108 can include a lip, flange or projection 126 (see FIGS. 5-7; also sometimes referred to as the “second projection”) that can be adapted to engage or to be coupled to the first projection 124 of the cover 160. By way of example only, the hanger 108 is shown as including an arc and having a substantially arcuate (e.g., almost semi-circular) shape, and the second projection 126 is shown as including an arc and having a substantially arcuate (e.g., almost semi-circular) shape. In addition, the second projection 126 is shown as being an outer projection and as extending radially outwardly, for example, relative to the center 161 of the cover 160 when the cover 160 is coupled to the hanger 108.


The arcuate shape of the hanger 108 of the illustrated embodiment can facilitate coupling the cover 160 to the hanger 108, can facilitate coupling/decoupling the cover 160 to/from the hanger 108 without the need for additional tools or equipment, and can facilitate holding the cover 160 throughout the relative movement between the first portion 104 and the second portion 106 (e.g., from an open position Po to a closed position Pc).


As a result, in some embodiments, the hanger 108 can include at least a 90-degree arc, in some embodiments, at least a 120-degree arc, and in some embodiments, at least a 140-degree arc. Furthermore, in some embodiments, the hanger 108 can include an arc of no greater than 180 degrees, in some embodiments, an arc of no greater than 170 degrees, and in some embodiments, an arc of no greater than 160 degrees. In embodiments in which the hanger 108 has a lower-angled arc, coupling/decoupling the cover 160 to/from the hanger 108 can be facilitated. However, in embodiments in which the hanger 108 has a higher-angled arc, the cover 160 can be better inhibited from undesirably falling off of the hanger 108.


In addition, with reference to FIGS. 5-7, in some embodiments, the distance between the cover 160 and the first portion 104 of the housing 102 when the cover 160 is coupled to the hanger 108 can at least partially play a role in facilitating coupling/decoupling the cover 160 to/from the hanger 108 and/or in inhibiting the cover 160 from undesirably falling off of the hanger 108. For example, in some embodiments, a pocket formed in the first portion 104 can be adapted to receive at least a portion of the cover 160 when the cover 160 is coupled to the hanger 108, and, in some embodiments, the clearance between the cover 160 and the pocket can facilitate coupling/decoupling the cover 160 to/from the hanger 108 and/or can inhibit the cover 160 from undesirably falling off of the hanger 108.


That is, when the first portion 104 of the housing 102 is at least partially open (i.e., moved at least partially away from the second portion 106), the cover 160 can be hung on the hanger 108 by coupling the first projection 124 to the second projection 126. As shown in FIG. 3, positioning the first portion 104 of the housing 102 in the open position Po shown in FIG. 3, can facilitate hanging the cover 160 on the hanger 108 by engaging the first projection 124 and the second projection 126. Furthermore, the cover 160 can be coupled to the hanger 108 (and the first projection 124 can be coupled to the second projection 126) without the need for additional tools or equipment.


Then, as shown in FIG. 4, the first portion 104 and the second portion 106 of the housing 102 can be moved toward one another to close the housing 102 and to assemble the sample processing assembly 50, such that the cover 160 comes down into contact with one or more of the sample processing device 150 and the base plate 110 and urges at least a portion of the sample processing device 150 into contact with at least a portion of the base plate 110 (e.g., the thermal structure 130 of the base plate 110). For example, such compression and urging can be accomplished by attraction of the magnetic elements 170 and 172.


As shown by way of example only in FIGS. 3 and 4, in some embodiments, the housing 102 can be configured so that the first portion 104 and the second portion 106 are pivotally movable with respect to one another. For example, as shown in FIGS. 3 and 4, the first portion 104 can be pivoted (e.g., rotated about a pivot axis A) between an open position Po and a closed position Pc (see FIG. 5) to close the housing 102 and to move the cover 160 toward the sample processing device 150 and/or the base plate 110. In such embodiments, particular advantages can be achieved by allowing a certain amount of overlap between the first and second projections 124 and 126, to inhibit the cover 160 from falling off of the hanger 108 when the first portion 104 is in a partially closed position Pp, as shown in FIG. 4. That is, as shown in FIG. 4, the first and second projections 124 and 126 can be configured such that the cover 160 can remain coupled to the hanger 108 (i.e., and the first projection 124 and the second projection 126 can remain coupled) throughout movement of the first portion 104 between an open position, such as position Po, and a closed position. Said another way, in some embodiments, the second projection 126 can be used to hold the cover 160 by the first projection 124. For example, when the first portion 104 and the second portion 106 are pivotally movable with respect to one another, the cover 160 can remain coupled to the hanger 108 (i.e., and the first projection 124 and the second projection 126 can remain coupled) no matter what the angle α is between the first portion 104 and the second portion 106.


Employing pivotal movement between the first portion 104 and the second portion 106 of the housing 102 (and, in the illustrated embodiment, between the first portion 104 and the base plate 110) is shown and described by way of example only; however, it should be understood that a variety of types of movement can be employed in the housing 102 without departing from the scope of the present disclosure. For example, in some embodiments, the first portion 104 and the second portion 106 of the housing 102 can be slidably movable with respect to one another. By way of further example, in some embodiments, the first portion 104 and the second portion 106 of the housing 102 (or the first portion 104 and the base plate 110) can be movable with respect to one another via a gantry system. For example, in some embodiments, the first portion 104 can move via a gantry system above the second portion 106 (and the base plate 110).


One of skill in the art will understand that the first and second projections 124 and 126 can be configured in a variety of manners to achieve coupling of the cover 160 to the hanger 108 throughout movement of the first portion 104 and/or the second portion 106 between an open and closed position. For example, in some embodiments, the first projection 124 and the second projection 126 can be configured to overlap by at least about 1 mm, in some embodiments, at least about 2 mm, and in some embodiments, at least 3 mm. In some embodiments, the first projection 124 and the second projection 126 can be configured to overlap by no greater than the first distance d1. In addition, in some embodiments, one or more of the projections 124 and 126 can be angled or oriented toward the other to further encourage coupling of the first and second projections 124 and 126, for example, at a variety of angles α between an open and closed position. Furthermore, in some embodiments, one or more of the projections 124 and 126 can include a mating or engaging feature to further encourage or facilitate coupling of the first and second projections 124 and 126, for example, at a variety of angles α between an open and closed position.


In some embodiments, the first projection 124 can extend a first distance (e.g., a first radial distance) in a first direction (e.g., a first radial direction, such as toward the center 161 of the cover 160) in a plane orthogonal to the rotation axis 111 or the z-axis of the system 100. In addition, in some embodiments, the second projection 126 can extend a second distance (e.g., a second radial distance) in a second direction substantially parallel and opposite to the first direction (e.g., away from the center 161 of the cover 160), such that the first projection 124 and the second projection 126 overlap, for example, when the cover 160 is coupled to the hanger 108.


Furthermore, in some embodiments, the first projection 124 can include the inner edge 163 (which can be referred to as a “first edge”; see FIGS. 1-2 and 5-7), which is positioned a first distance d1 from the center 161 of the cover 160 (or the rotation axis 111). In addition, in some embodiments, the second projection 126 can include an outer edge 123 (which can be referred to as a “second edge”; see FIGS. 5-7) positioned a second distance d2′ from the center 161 of the cover 160 when the cover 160 is coupled to the hanger 108. Furthermore, in some embodiments, the second distance d2′ can be greater than the first distance d1, such that the first projection 124 and the second projection 126 overlap.


As shown in FIGS. 5-7, in some embodiments, the overlap between the first projection 124 and the second projection 126 can increase as the first portion 104 and the second portion 106 are moved apart from one another (e.g., as the first portion 104 is moved from the first position P1 shown in FIG. 5 to the second position P2 shown in FIG. 6 and the third position P3 shown in FIG. 7). That is, the cover 160 can slide toward the hanger 108 further as the hanger 108 picks up the cover 160 (e.g., in embodiments employing pivotal movement between the first portion 104 and the second portion 106). As such, in some embodiments, the first distance d1 can decrease as the first portion 104 and the second portion 106 are moved with respect to one another, such that the distance between (or difference between) the first distance d1 and the second distance d2′ can increase.


Moreover, in some embodiments, the cover 160 can be in the shape of a circular ring. In such embodiments, the first projection 124 can be a first radial projection 124 which can extend radially inwardly (e.g., toward the center 161 of the cover 160) and which can define a first or inner radius d1 measured from the center 161 of the cover 160 (or the rotation axis 111 of the system 100). In addition, in such embodiments, the second projection 126 can be a second radial projection 126 which can extend radially outwardly (e.g., away from the center 161 of the cover 160) and which can define a second or outer radius d2′ measured from the center 161 of the cover 160 (or the rotation axis 111). The second radius can be greater than the first radius, such that the first radial projection 124 and the second radial projection 126 overlap.


As described in greater detail below with reference to FIGS. 5-7, in some embodiments, the cover 160 and the hanger 108 (and accordingly, the first projection 124 and the second projection 126) can become decoupled at a desired position. For example, in some embodiments, the cover 160 and the hanger 108 can become decoupled when the housing 102 is closed, that is, when the first portion 104 and the second portion 106 are positioned adjacent one another in a closed position (see position Pc in FIG. 5). Such decoupling can occur in order to allow the cover 160 to disengage from the hanger 108 and/or to engage with the other components of the sample processing assembly 50.


By way of example only, three different relative positions of the first portion 104 and the second portion 106 of the housing 102 are shown in FIGS. 5-7. A first position P1, which is also the closed position Pc referenced above, is shown in FIG. 5. As shown in FIG. 5, the housing 102 is closed, and the sample processing assembly 50 is closed. That is, as shown, the cover 160 is positioned atop the sample processing device 150, which is positioned atop the base plate 110, and the magnetic elements 170 of the cover 160 and the magnetic elements 172 of the base plate 110 are being attracted to each other, urging at least a portion of the sample processing device 150 in the first direction D1 along the z-axis toward the base plate 110, and namely, toward the thermal transfer surface 132 of the thermal structure 130 of the base plate 110.


As further shown in FIG. 5, in the first position P1, the second projection 126 is not coupled to the first projection 124, and the cover 160 is not coupled to the hanger 108. Rather, the first projection 124 and the second projection 126 are spaced a distance X apart (e.g., wherein X is a vertical distance along the z-axis or rotation axis 111 of the system 100 and parallel to the first direction D1), such that the cover 160 can rotate with the base plate 110 about the rotation axis 111, without any interference from the second projection 126. That is, as the first portion 104 and the second portion 106 of the housing 102 are moved closer together, the cover 160, and particularly, the magnetic elements 170, are able to interact with the base plate 110 and/or the sample processing device 150. In addition, as the first portion 104 and the second portion 106 are moved closer together, the cover 160 may begin to disengage from the hanger 108 and may begin to engage the other components of the sample processing assembly 50. In some embodiments, this may all occur at one point in time, for example, at the moment when the housing 102 is closed, or when the first portion 104 is moved into its closed position Pc relative to the second portion 106 of the housing 102.



FIG. 6 shows the first portion 104 and the second portion 106 of the housing 102 in a second position P2 relative to one another. In the second position P2, the first portion 104 and the second portion 106 have become to be separated or moved apart from one another. As shown in FIG. 6, such movement of the first portion 104 can begin to move the hanger 108 and the second projection 126 relative to the cover 160 and the first projection 124. As such, in the second position P2, the second projection 126 has begun to engage or be coupled to the first projection 124. As shown in FIG. 6, the housing 102 is open (e.g., in a partially open (or partially closed) position), while the sample processing assembly 50 remains in a closed position, because the cover 160 is still coupled to the sample processing device 150 and/or the base plate 110 (e.g., at least partially via the magnetic attraction between the magnetic elements 170 and the magnetic elements 172).



FIG. 7 illustrates the first portion 104 and the second portion 106 of the housing 102 in a third position P3 relative to one another. In the third position P3, the first portion 104 and the second portion 106 have become separated even further than in the second position P2 of FIG. 6. In addition, FIG. 6 shows that the additional movement of the first portion 104 to the third position P3 caused the second projection 126 of the hanger 108 to pull upwardly on the first projection 124 of the cover 160, ultimately overcoming the attraction between the magnetic elements 170 and the magnetic elements 172, and allowing the cover 160 to lift off of the other components of the sample processing assembly 50 (i.e., the sample processing device 150 and/or the base plate 110). As a result, the housing 102 is open (e.g., in a partially open (or partially closed) position), and the sample processing assembly 50 is also open (e.g., in a partially open (or partially closed) position. The first portion 104 and the second portion 106 can then continue to be moved further apart from one another to, for example, the open position Po shown in FIG. 3. As described above, the first and second projections 124 and 126 can be configured to inhibit the cover 160 from falling off of the hanger 108 (and, accordingly, to inhibit the first projection 124 and the second projection 126 from becoming decoupled) during the movement from the closed position Pc shown in FIG. 5 to the open position Po shown in FIG. 3.


As a result, the first portion 104 of the housing 102 can be moved toward and away from the base plate 110, which can move the cover 160 between a position in which the cover 160 is not coupled to the base plate 110 (e.g., via the magnetic elements 170 and 172) and a position in which the cover 160 is coupled to the base plate 110. By way of example only, the magnetic attraction between the magnetic elements 170 and the magnetic elements 172 is described as being configured to pull the cover 160 onto the base plate 110, for example, along the first direction D1. However, it should be understood that a variety of suitable configurations of the magnetic elements 170 and 172, in addition to other compression structures, can also be employed in order to couple the cover 160 to the base plate 110. For example, in some embodiments, the cover 160 can be pushed along the first direction D1 rather than being pulled. By way of example only, there could be an electromagnetic connection between at least a portion of the first portion 104 of the housing 102 (e.g., the hanger 108) and the magnetic elements 170 of the cover 160, and there could be no magnetic elements 172 in the base plate 110. In such embodiments, the electromagnetic connection between the cover 160 and the first portion 104 of the housing 102 could be reversed as the cover 160 approached the base plate 110 in order to push the cover 160 down onto the base plate 110.


Similarly, in some embodiments, the first and second projections 124 and 126 or other portions of the cover 160 and the hanger 108 can be adapted to be magnetically coupled together. For example, in some embodiments, electromagnets that can be switched on and off can be employed to assist in the coupling and decoupling between the hanger 108 and the cover 160. In addition, in some embodiments, there is no magnetic attraction between the hanger 108 and the cover 160 so as not to compete with the magnetic forces occurring between the cover 160 and the base plate 110.


In the embodiment illustrated in FIGS. 1-7 and described herein, the first projection 124 is shown as projecting or extending inwardly, and the second projection 126 is shown as projecting or extending outwardly, such that the first and second projections 124 and 126 overlap and can be engaged. However, it should be understood that in some embodiments, the first projection 124 can be an outer projection. For example, the first projection 124 can project outwardly away from the center 161 of the cover 160, e.g., in embodiments employing covers including continuous top surfaces and no opening 166. In such embodiments, the second projection 126 can be an inner projection adapted to engage the first outer projection 124. For example, the second projection 126 can project inwardly toward the center 161 of the cover 160 (e.g., when the cover 160 is coupled to the hanger 108).


As mentioned above, other covers, sample processing devices and base plates can be employed without departing from the scope of the present disclosure. In addition, a variety of combinations of various embodiments of the present disclosure can be employed. The embodiments described above and illustrated in the figures are presented by way of example only and are not intended as a limitation upon the concepts and principles of the present disclosure. As such, it will be appreciated by one having ordinary skill in the art that various changes in the elements and their configuration and arrangement are possible without departing from the spirit and scope of the present disclosure.


One embodiment of the present disclosure includes a system for processing sample processing devices, the system comprising: a base plate operatively coupled to a drive system and having a first surface, wherein the drive system rotates the base plate about a rotation axis, and wherein the rotation axis defines a z-axis; a cover adapted to be positioned facing the first surface of the base plate, the cover including a first projection; a housing comprising a portion movable with respect to the base plate between an open position in which the cover is not coupled to the base plate and a closed position in which the cover is coupled to the base plate, the portion including a second projection, the first projection and the second projection adapted to be coupled together when the portion is in the open position and decoupled from each other when the portion is in the closed position, such that the cover is rotatable with the base plate about the rotation axis when the portion is in the closed position and when the cover is coupled to the base plate; and a sample processing device comprising at least one process chamber and adapted to be positioned between the base plate and the cover, the sample processing device rotatable with the base plate about the rotation axis when the sample processing device is coupled to the base plate.


In such a system embodiment, the first projection can include a first radial projection that extends in a radial direction.


In any of the embodiments above, the second projection can include a second radial projection that extends in a radial direction.


In any of the embodiments above, the portion of the housing can include a first portion that is movable with respect to a second portion of the housing, and the base plate can be positioned in the second portion of the housing.


In any of the embodiments above, the portion of the housing can be pivotally movable with respect to the base plate.


In any of the embodiments above, the portion of the housing can be slidably movable with respect to the base plate.


In any of the embodiments above, the portion of the housing can be movable with respect to the base plate via a gantry system.


In any of the embodiments above, the sample processing device can be adapted to be positioned between the base plate and the cover.


In any of the embodiments above, the first projection can extend a first distance in a first direction in a plane orthogonal to the z-axis, and the second projection can extend a second distance in a second direction substantially parallel and opposite to the first direction, such that the first projection and the second projection overlap.


In any of the embodiments above, the first projection can include a first edge positioned a first distance from a center of the cover, the second projection can include a second edge positioned a second distance from the center of the cover, and the second distance can be greater than the first distance.


In any of the embodiments above, the cover can be in the shape of a circular annulus, wherein the first projection of the cover includes a first radial projection that extends radially inwardly and defines an inner radius measured from a center of the cover, and wherein the second projection includes a second radial projection that extends radially outwardly and defines an outer radius measured from the center of the cover, and wherein the outer radius is greater than the inner radius.


In any of the embodiments above, the second projection can be spaced a distance from the first projection when the portion of the housing is in the closed position, such that the cover is rotatable with the base plate.


In any of the embodiments above, the second projection can be movable into contact with the first projection when the portion of the housing is moved from the closed position to the open position.


In any of the embodiments above, the second projection can be adapted to pick up the cover by engaging the first projection when the portion of the housing is moved from the closed position to the open position.


In any of the embodiments above, the second projection can be adapted to hold the cover when the portion of the housing is in the open position.


In any of the embodiments above, the cover can be adapted to be at least one of coupled to and decoupled from the portion of the housing without additional tools.


In any of the embodiments above, the cover can include an annular cover comprising an inner edge, and the inner edge can be positioned inwardly of the at least one process chamber.


Any of the embodiments above can further include at least one first magnetic element operatively coupled to the base plate; and at least one second magnetic element operatively coupled to the cover, the at least one first magnetic element configured to attract the at least one first magnetic element to force the cover in a first direction along the z-axis.


In any of the embodiments above, the first projection can be decoupled from the second projection at least partially in response to the magnetic attraction between the at least one first magnetic element and the at least one second magnetic element.


In any of the embodiments above, the at least one first magnetic element can be arranged in a first annulus, and the at least one second magnetic element can be arranged in a second annulus.


In any of the embodiments above, the second annulus of magnetic elements can include an inner edge and an outer edge, and both the inner edge and the outer edge can be positioned inwardly, relative to the rotation axis, of the at least one process chamber when the sample processing device is coupled to the base plate.


In any of the embodiments above, at least one of the first annulus of magnetic elements and the second annulus of magnetic elements can include a substantially uniform distribution of magnetic force about the annulus.


In any of the embodiments above, the at least one first magnetic element and the at least one second magnetic element can be keyed with respect to one another, such that the cover couples to the base plate in a desired orientation.


Any of the embodiments above can further include a thermal structure operatively coupled to the base plate, wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate, and wherein the magnetic attraction between the at least one first magnetic element and the at least one second magnetic element urges at least a portion of the sample processing device into contact with the transfer surface of the base plate.


In any of the embodiments above, the at least a portion of the sample processing device can include the at least one process chamber.


Another embodiment of the present disclosure can include a method for processing sample processing devices, the method comprising: providing a base plate operatively coupled to a drive system and having a first surface; providing a cover adapted to be positioned facing the first surface of the base plate; providing a housing comprising a portion movable with respect to the base plate between an open position in which the cover is not coupled to the base plate and a closed position in which the cover is coupled to the base plate; positioning a sample processing device on the base plate, the sample processing device comprising at least one process chamber; coupling the cover to the portion of the housing when the portion of the housing is in the open position; moving the portion of the housing from the open position to the closed position; coupling the cover to the base plate at least partially in response to moving the portion of the housing from the open position to the closed position; and rotating the base plate about a rotation axis, wherein the rotation axis defines a z-axis.


In such a method embodiment, coupling the cover to the base plate can include decoupling the cover from the portion of the housing.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection, and decoupling the cover from the portion of the housing can include decoupling the first projection from the second projection, such that the cover is free to rotate with the base plate about the rotation axis.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection, and decoupling the cover from the portion of the housing can include spacing the first projection a distance from the second projection.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection.


In any of the embodiments above, coupling the cover to the portion of the housing can include coupling the first projection to the second projection.


In any of the embodiments above, the first projection can extend a first distance in a first direction in a plane orthogonal to the z-axis, and the second projection can extend a second distance in a second direction substantially parallel and opposite to the first direction, such that the first projection and the second projection overlap.


In any of the embodiments above, the first projection can include a first edge positioned a first distance from a center of the cover, the second projection can include a second edge positioned a second distance from the center of the cover, and the second distance can be greater than the first distance.


In any of the embodiments above, the cover can be in the shape of a circular annulus, wherein the first projection of the cover includes a first radial projection that extends radially inwardly and defines an inner radius measured from a center of the cover, and wherein the second projection includes a second radial projection that extends radially outwardly and defines an outer radius measured from the center of the cover, and wherein the outer radius is greater than the inner radius.


Any of the embodiments above can further include providing at least one first magnetic element operatively coupled to the base plate, and providing at least one second magnetic element operatively coupled to the cover.


In any of the embodiments above, coupling the cover to the base plate can include coupling the at least one first magnetic element and the at least one second magnetic element.


Any of the embodiments above can further include decoupling the cover from the portion of the housing, wherein decoupling the cover from the portion of the housing includes coupling the at least one first magnetic element to the at least one second magnetic element.


Any of the embodiments above can further include rotating the cover with the base plate about the rotation axis when the cover is coupled to the base plate.


In any of the embodiments above, coupling the cover to the portion of the housing can include coupling the cover to the portion of the housing without additional tools.


Any of the embodiments above can further include moving the portion of the housing from the closed position to the open position.


In any of the embodiments above, moving the portion of the housing from the closed position to the open position can include decoupling the cover from the base plate.


In any of the embodiments above, moving the portion of the housing from the closed position to the open position can include coupling the cover to the portion of the housing.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection, and moving the portion from the closed position to the open position can include moving the second projection into contact with the first projection.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection, and moving the portion from the closed position to the open position can include using the second projection to pick up the cover by coupling the second projection and the first projection.


In any of the embodiments above, the cover can include a first projection and the portion of the housing can include a second projection, and any of the embodiments above can further include using the second projection to hold the cover when the portion of the housing is in the open position.


Any of the embodiments above can further include decoupling the cover from the portion of the housing.


All references and publications cited herein are expressly incorporated herein by reference in their entirety into this disclosure.


Various features and aspects of the present disclosure are set forth in the following claims.

Claims
  • 1. A system for processing sample processing devices, the system comprising: a base plate operatively coupled to a drive system and having a first surface, wherein the drive system rotates the base plate about a rotation axis, and wherein the rotation axis defines a z-axis;a cover adapted to be positioned facing the first surface of the base plate, the cover including a first projection;a housing comprising a portion movable with respect to the base plate between an open position in which the cover is not coupled to the base plate and a closed position in which the cover is coupled to the base plate, the portion including a second projection, the first projection and the second projection adapted to be coupled together when the portion is in the open position and decoupled from each other when the portion is in the closed position, such that the cover is decoupled from the entire portion of the housing and is configured to rotate with the base plate about the rotation axis when the portion is in the closed position and when the cover is coupled to the base plate; anda sample processing device comprising at least one process chamber and adapted to be positioned between the base plate and the cover, the sample processing device rotatable with the base plate about the rotation axis when the sample processing device is coupled to the base plate.
  • 2. The system of claim 1, wherein the first projection includes a first radial projection that extends in a radial direction.
  • 3. The system of claim 1, wherein the second projection includes a second radial projection that extends in a radial direction.
  • 4. The system of claim 1, wherein the portion of the housing includes a first portion that is movable with respect to a second portion of the housing, and wherein the base plate is positioned in the second portion of the housing.
  • 5. The system of claim 1, wherein the portion of the housing is pivotally movable with respect to the base plate.
  • 6. The system of claim 1, wherein the portion of the housing is slidably movable with respect to the base plate.
  • 7. The system of claim 1, wherein the portion of the housing is movable with respect to the base plate via a gantry system.
  • 8. The system of claim 1, wherein the sample processing device is adapted to be positioned between the base plate and the cover.
  • 9. The system of claim 1, wherein the first projection extends a first distance in a first direction in a plane orthogonal to the z-axis, and wherein the second projection extends a second distance in a second direction substantially parallel and opposite to the first direction, such that the first projection and the second projection overlap.
  • 10. The system of claim 1, wherein the first projection includes a first edge positioned a first distance from a center of the cover, wherein the second projection includes a second edge positioned a second distance from the center of the cover, and wherein the second distance is greater than the first distance.
  • 11. The system of claim 1, wherein the cover is in the shape of a circular annulus, wherein the first projection of the cover includes a first radial projection that extends radially inwardly and defines an inner radius measured from a center of the cover, and wherein the second projection includes a second radial projection that extends radially outwardly and defines an outer radius measured from the center of the cover, and wherein the outer radius is greater than the inner radius.
  • 12. The system of claim 1, wherein the second projection is spaced a distance along the z-axis from the first projection when the portion of the housing is in the closed position, such that the cover is rotatable with the base plate.
  • 13. The system of claim 1, wherein the second projection is movable into contact with the first projection when the portion of the housing is moved from the closed position to the open position.
  • 14. The system of claim 1, wherein the second projection is adapted to pick up the cover by engaging the first projection when the portion of the housing is moved from the closed position to the open position.
  • 15. The system of claim 1, wherein the second projection is adapted to hold the cover when the portion of the housing is in the open position.
  • 16. The system of claim 1, wherein the cover is adapted to be at least one of coupled to and decoupled from the portion of the housing without additional tools.
  • 17. The system of claim 1, wherein the cover includes an annular cover comprising an inner edge, and wherein the inner edge is positioned inwardly of the at least one process chamber.
  • 18. The system of claim 1, further comprising: at least one first magnetic element operatively coupled to the base plate; andat least one second magnetic element operatively coupled to the cover, the at least one first magnetic element configured to attract the at least one first magnetic element to force the cover in a first direction along the z-axis.
  • 19. The system of claim 18, wherein the first projection is decoupled from the second projection at least partially in response to the magnetic attraction between the at least one first magnetic element and the at least one second magnetic element.
  • 20. The system of claim 18, wherein the at least one first magnetic element is arranged in a first annulus of magnetic elements, and wherein the at least one second magnetic element is arranged in a second annulus of magnetic elements.
  • 21. The system of claim 20, wherein the second annulus of magnetic elements includes an inner edge and an outer edge, and wherein both the inner edge and the outer edge are positioned inwardly, relative to the rotation axis, of the at least one process chamber when the sample processing device is coupled to the base plate.
  • 22. The system of claim 21, wherein at least one of the first annulus of magnetic elements and the second annulus of magnetic elements includes a substantially uniform distribution of magnetic force about the annulus.
  • 23. The system of claim 18, wherein the at least one first magnetic element and the at least one second magnetic element are keyed with respect to one another, such that the cover couples to the base plate in a desired orientation.
  • 24. The system of claim 18, further comprising a thermal structure operatively coupled to the base plate, wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate, and wherein the magnetic attraction between the at least one first magnetic element and the at least one second magnetic element urges at least a portion of the sample processing device into contact with the transfer surface of the base plate.
  • 25. The system of claim 24, wherein the at least a portion of the sample processing device includes the at least one process chamber.
US Referenced Citations (254)
Number Name Date Kind
3555284 Anderson Jan 1971 A
3713124 Durland et al. Jan 1973 A
3795451 Mailen Mar 1974 A
3798459 Anderson et al. Mar 1974 A
3856470 Cullis et al. Dec 1974 A
3873217 Anderson et al. Mar 1975 A
3912799 Chisholm Oct 1975 A
3964867 Berry Jun 1976 A
4030834 Bauer et al. Jun 1977 A
4046511 Stabile Sep 1977 A
4111304 Lucas Sep 1978 A
4123173 Bullock et al. Oct 1978 A
4244916 Guigan Jan 1981 A
4252538 Barr Feb 1981 A
4256696 Soodak Mar 1981 A
4298570 Lillig et al. Nov 1981 A
4384193 Kledzik et al. May 1983 A
4390499 Curtis et al. Jun 1983 A
4396579 Schroeder et al. Aug 1983 A
D271993 Swartz Dec 1983 S
4456581 Edelmann et al. Jun 1984 A
D274553 Perry Jul 1984 S
4476733 Chlosta et al. Oct 1984 A
4488810 Hatanaka et al. Dec 1984 A
4498896 Leis Feb 1985 A
D277891 Uffenheimer et al. Mar 1985 S
4554436 Chlosta et al. Nov 1985 A
4580896 Brickus et al. Apr 1986 A
4632908 Schultz Dec 1986 A
D288124 Brickus et al. Feb 1987 S
4673657 Christian Jun 1987 A
4695430 Coville et al. Sep 1987 A
4766078 Gang Aug 1988 A
4814279 Sugaya Mar 1989 A
4839296 Kennedy et al. Jun 1989 A
4906432 Geiselman Mar 1990 A
4933146 Meyer et al. Jun 1990 A
4981801 Suzuki et al. Jan 1991 A
4990075 Wogoman Feb 1991 A
5049591 Hayashi et al. Sep 1991 A
5079155 Cox et al. Jan 1992 A
5086337 Noro et al. Feb 1992 A
5128197 Kobayashi et al. Jul 1992 A
5135786 Hayashi et al. Aug 1992 A
5139832 Hayashi et al. Aug 1992 A
D329024 Marks Sep 1992 S
5145935 Hayashi Sep 1992 A
5149505 English et al. Sep 1992 A
5154888 Zander et al. Oct 1992 A
5182083 Barker et al. Jan 1993 A
5207987 Kureshy et al. May 1993 A
5217572 Guy et al. Jun 1993 A
5219526 Long Jun 1993 A
5229297 Schnipelsky et al. Jul 1993 A
5242370 Silver et al. Sep 1993 A
5254479 Chemelli Oct 1993 A
5258163 Krause et al. Nov 1993 A
5264184 Aysta et al. Nov 1993 A
5278377 Tsai Jan 1994 A
5281516 Stapleton et al. Jan 1994 A
5288463 Chemelli Feb 1994 A
5310523 Smethers et al. May 1994 A
5336467 Heidt et al. Aug 1994 A
5411065 Meador et al. May 1995 A
5415839 Zaun et al. May 1995 A
5422271 Chen et al. Jun 1995 A
5429810 Knaepler et al. Jul 1995 A
5438128 Nieuwkerk et al. Aug 1995 A
5439649 Tseung et al. Aug 1995 A
5446270 Chamberlain et al. Aug 1995 A
5460780 Devaney, Jr. et al. Oct 1995 A
5461134 Leir et al. Oct 1995 A
5464541 Aysta et al. Nov 1995 A
5496518 Arai et al. Mar 1996 A
5496520 Kelton et al. Mar 1996 A
5525514 Jacobs et al. Jun 1996 A
5527931 Rich et al. Jun 1996 A
5529708 Palmgren et al. Jun 1996 A
5571410 Swedberg et al. Nov 1996 A
5578270 Reichler et al. Nov 1996 A
5587128 Wilding et al. Dec 1996 A
5593838 Zanzucchi et al. Jan 1997 A
5599501 Carey et al. Feb 1997 A
5601141 Gordon et al. Feb 1997 A
5604130 Warner et al. Feb 1997 A
5616301 Moser et al. Apr 1997 A
5637469 Wilding et al. Jun 1997 A
5639428 Cottingham Jun 1997 A
5639810 Smith, III et al. Jun 1997 A
5691208 Miltenyi et al. Nov 1997 A
RE35716 Stapleton et al. Jan 1998 E
5720923 Haff et al. Feb 1998 A
5721123 Hayes et al. Feb 1998 A
5726026 Wilding et al. Mar 1998 A
5792372 Brown et al. Aug 1998 A
5795547 Moser et al. Aug 1998 A
5800785 Bochner Sep 1998 A
5804141 Chianese Sep 1998 A
5811296 Chemelli et al. Sep 1998 A
5819842 Potter et al. Oct 1998 A
5822903 Davis, Sr. Oct 1998 A
5833923 McClintock et al. Nov 1998 A
5856194 Arnquist et al. Jan 1999 A
5863502 Southgate et al. Jan 1999 A
5863801 Southgate et al. Jan 1999 A
5869002 Limon et al. Feb 1999 A
5876675 Kennedy Mar 1999 A
5886863 Nagasaki et al. Mar 1999 A
5922617 Wang et al. Jul 1999 A
5925455 Bruzzone et al. Jul 1999 A
5948227 Dubrow Sep 1999 A
5976468 Godec et al. Nov 1999 A
5997818 Hacker et al. Dec 1999 A
6001643 Spaulding Dec 1999 A
6007690 Nelson et al. Dec 1999 A
6007914 Joseph et al. Dec 1999 A
6013513 Reber et al. Jan 2000 A
6030581 Virtanen Feb 2000 A
6048457 Kopaciewicz et al. Apr 2000 A
6063589 Kellogg et al. May 2000 A
6068751 Neukermans May 2000 A
6074827 Nelson et al. Jun 2000 A
6093370 Yasuda et al. Jul 2000 A
6103199 Bjornson et al. Aug 2000 A
6143247 Sheppard, Jr. et al. Nov 2000 A
6143248 Kellogg et al. Nov 2000 A
6153012 Rupp et al. Nov 2000 A
6168759 Green et al. Jan 2001 B1
6168948 Anderson et al. Jan 2001 B1
6183693 Bogen et al. Feb 2001 B1
6184029 Wilding et al. Feb 2001 B1
6190617 Clark et al. Feb 2001 B1
6197595 Anderson et al. Mar 2001 B1
6200474 Kopaciewicz et al. Mar 2001 B1
D441873 Köhler May 2001 S
6265168 Gjerde et al. Jul 2001 B1
6284113 Bjornson et al. Sep 2001 B1
6296809 Richards et al. Oct 2001 B1
6302134 Kellogg et al. Oct 2001 B1
6306273 Wainright et al. Oct 2001 B1
6319469 Mian et al. Nov 2001 B1
6344326 Nelson et al. Feb 2002 B1
6375898 Ulrich et al. Apr 2002 B1
6391264 Hammer et al. May 2002 B2
6399025 Chow Jun 2002 B1
6413782 Parce et al. Jul 2002 B1
6432365 Levin et al. Aug 2002 B1
6440725 Pourahmadi et al. Aug 2002 B1
6450047 Swedberg et al. Sep 2002 B2
6451260 Düsterhöft et al. Sep 2002 B1
6461287 Glater Oct 2002 B1
6465225 Fuhr et al. Oct 2002 B1
6467275 Ghoshal Oct 2002 B1
6479300 Jiang et al. Nov 2002 B1
6527432 Kellogg et al. Mar 2003 B2
6532997 Bedingham et al. Mar 2003 B1
6548788 Kellogg et al. Apr 2003 B2
6558947 Lund et al. May 2003 B1
6565808 Hudak et al. May 2003 B2
6566637 Revesz et al. May 2003 B1
6572830 Burdon et al. Jun 2003 B1
6582662 Kellogg et al. Jun 2003 B1
6593143 Gordon Jul 2003 B1
6617136 Parthasarathy et al. Sep 2003 B2
6627159 Bedingham et al. Sep 2003 B1
6632399 Kellogg et al. Oct 2003 B1
6645758 Schnipelsky et al. Nov 2003 B1
6648853 McEntee Nov 2003 B1
6660147 Woudenberg et al. Dec 2003 B1
6664104 Pourahmadi et al. Dec 2003 B2
6692596 Moll et al. Feb 2004 B2
6706519 Kellogg et al. Mar 2004 B1
6720187 Bedingham et al. Apr 2004 B2
6723236 Fisk et al. Apr 2004 B2
6730516 Jedrzejewski et al. May 2004 B2
6734401 Bedingham et al. May 2004 B2
6780818 Gundel et al. Aug 2004 B2
6814935 Harms et al. Nov 2004 B2
6824738 Neeper et al. Nov 2004 B1
6889468 Bedingham et al. May 2005 B2
6987253 Bedingham et al. Jan 2006 B2
7026168 Bedingham et al. Apr 2006 B2
7144726 Takagi Dec 2006 B2
7164107 Bedingham et al. Jan 2007 B2
7192560 Parthasarathy et al. Mar 2007 B2
7273591 Sellers et al. Sep 2007 B2
D557425 Nakamura et al. Dec 2007 S
D559993 Nagakubo et al. Jan 2008 S
D559994 Nagakubo et al. Jan 2008 S
D560284 Nagakubo et al. Jan 2008 S
7322254 Bedingham et al. Jan 2008 B2
7323660 Bedingham et al. Jan 2008 B2
7332326 Kellogg et al. Feb 2008 B1
D564667 Bedingham et al. Mar 2008 S
7396508 Richards et al. Jul 2008 B1
7435933 Bedingham et al. Oct 2008 B2
7569186 Bedingham et al. Aug 2009 B2
D600722 Yabe et al. Sep 2009 S
D605206 Yabe et al. Dec 2009 S
7628954 Gomm et al. Dec 2009 B2
7754474 Aysta et al. Jul 2010 B2
7763210 Bedingham et al. Jul 2010 B2
7767937 Bedingham et al. Aug 2010 B2
20010045000 Gundel et al. Nov 2001 A1
20020047003 Bedingham et al. Apr 2002 A1
20020048533 Harms et al. Apr 2002 A1
20020064885 Bedingham et al. May 2002 A1
20020097632 Kellogg et al. Jul 2002 A1
20030013203 Jedrzejewski et al. Jan 2003 A1
20030017567 Parthasarathy et al. Jan 2003 A1
20030044322 Andersson et al. Mar 2003 A1
20030053934 Andersson et al. Mar 2003 A1
20030118804 Bedingham et al. Jun 2003 A1
20030120062 Parthasarathy et al. Jun 2003 A1
20030124506 Bedingham et al. Jul 2003 A1
20030138779 Parthasarathy et al. Jul 2003 A1
20030139550 Savu et al. Jul 2003 A1
20030152491 Kellogg et al. Aug 2003 A1
20030152994 Woudenberg et al. Aug 2003 A1
20030155034 De Beukeleer et al. Aug 2003 A1
20030228706 Ramstad et al. Dec 2003 A1
20030231878 Shigeura Dec 2003 A1
20040016702 Hennessy et al. Jan 2004 A1
20040016898 Cox et al. Jan 2004 A1
20040018116 Desmond et al. Jan 2004 A1
20040018117 Desmond et al. Jan 2004 A1
20040023371 Fawcett Feb 2004 A1
20040121471 Dufresne et al. Jun 2004 A1
20040179974 Bedingham et al. Sep 2004 A1
20040209258 Parthasarathy et al. Oct 2004 A1
20050028587 Baer et al. Feb 2005 A1
20050036911 Sellers et al. Feb 2005 A1
20050130177 Bedingham et al. Jun 2005 A1
20050142563 Haddad et al. Jun 2005 A1
20050142570 Parthasarathy et al. Jun 2005 A1
20050142571 Parthasarathy et al. Jun 2005 A1
20050142663 Parthasarathy et al. Jun 2005 A1
20050180890 Bedingham et al. Aug 2005 A1
20050282290 Fujimoto et al. Dec 2005 A1
20060013732 Parthasarathy et al. Jan 2006 A1
20070007270 Bedingham et al. Jan 2007 A1
20070009391 Bedingham et al. Jan 2007 A1
20070010007 Aysta et al. Jan 2007 A1
20070132723 Lurz et al. Jun 2007 A1
20070142780 Van Lue Jun 2007 A1
20080050276 Bedingham et al. Feb 2008 A1
20080058991 Lee Mar 2008 A1
20080152546 Bedingham et al. Jun 2008 A1
20090068062 Jafari et al. Mar 2009 A1
20090143250 Lee Jun 2009 A1
20090263280 Bedingham et al. Oct 2009 A1
20100050751 Lee Mar 2010 A1
20100281961 Saiki et al. Nov 2010 A1
20110124132 Kim May 2011 A1
Foreign Referenced Citations (84)
Number Date Country
2130013 Mar 1999 CA
3712624 Nov 1988 DE
0 281 368 Sep 1988 EP
0169306 May 1990 EP
0402994 Nov 1994 EP
0693560 Jan 1996 EP
0807486 Nov 1997 EP
0 965 388 Dec 1999 EP
0 807 468 Dec 2001 EP
0810030 Mar 2003 EP
1 010 979 Oct 2003 EP
60-57259 Apr 1985 JP
9-72912 Mar 1997 JP
11124419 May 1999 JP
2003-504637 Feb 2003 JP
2004-525339 Aug 2004 JP
2005-514014 May 2005 JP
2005-274241 Oct 2005 JP
2009-216395 Sep 2009 JP
9119567 Dec 1991 WO
9426414 Nov 1994 WO
9429400 Dec 1994 WO
9518676 Jul 1995 WO
9519781 Jul 1995 WO
9615576 May 1996 WO
9634028 Oct 1996 WO
9634029 Oct 1996 WO
9635458 Nov 1996 WO
9641864 Dec 1996 WO
9700230 Jan 1997 WO
9721090 Jun 1997 WO
9746707 Dec 1997 WO
9804909 Feb 1998 WO
9807019 Feb 1998 WO
9849340 Nov 1998 WO
9850147 Nov 1998 WO
9853311 Nov 1998 WO
9909394 Feb 1999 WO
9915876 Apr 1999 WO
9915888 Apr 1999 WO
9940174 Aug 1999 WO
9944740 Sep 1999 WO
9946591 Sep 1999 WO
9955827 Nov 1999 WO
9958245 Nov 1999 WO
9967639 Dec 1999 WO
0005582 Feb 2000 WO
0040750 Jul 2000 WO
0045180 Aug 2000 WO
0050172 Aug 2000 WO
0050642 Aug 2000 WO
0062051 Oct 2000 WO
0068336 Nov 2000 WO
0069560 Nov 2000 WO
0078455 Dec 2000 WO
0079285 Dec 2000 WO
0106228 Jan 2001 WO
0107892 Feb 2001 WO
0112327 Feb 2001 WO
0130995 May 2001 WO
0138865 May 2001 WO
0200347 Jan 2002 WO
03054509 Jul 2003 WO
03054510 Jul 2003 WO
03058224 Jul 2003 WO
03058253 Jul 2003 WO
03093836 Nov 2003 WO
03104783 Dec 2003 WO
2004010760 Feb 2004 WO
2004011142 Feb 2004 WO
2004011143 Feb 2004 WO
2004011147 Feb 2004 WO
2004011148 Feb 2004 WO
2004011149 Feb 2004 WO
2004011365 Feb 2004 WO
2004011592 Feb 2004 WO
2004011681 Feb 2004 WO
2004094672 Nov 2004 WO
2005005045 Jan 2005 WO
2005016532 Feb 2005 WO
2007005810 Jan 2007 WO
2007005853 Jan 2007 WO
2008134470 Nov 2008 WO
WO 2009057267 May 2009 WO
Non-Patent Literature Citations (15)
Entry
Handbook of Pressure Sensitive Adhesive Technology, Donatas Satas (Ed.) 2nd Edition, Title page, Publication page, Table of Contents, and p. 172, and Fig. 8-16 on p. 173, Van Nostrand Reinhold, New York, NY 1989.
Handbook of Pressure Sensitive Adhesive Technology, 3rd Edition, Title page, Publication page, Table of Contents, and pp. 508-517.
Litton Product Brochure; Poly Scientific EC3848 High Speed Slip Ring Capsule; Blacksburg, VA; 2 pgs (Oct. 1999).
Meridian Laboratory Datasheet [online]; Rotocon high performance rotary electrical contacts; 5 pgs [retrieved on Jun. 18, 2002]. Retrieved from the Internet: <http://www.meridianlab.com/>.
Meridian Laboratory Datasheet [online]: Model MM Micro-Minature; 5 pgs. [retrieved on Jul. 19, 2001]. Retrieved from the Internet: <http://www.meridianlab.com/mm.htm>.
Motion Technology Product Guide; Commercial and Military/Aerospace Applications; Blacksburg, VA; 8 pgs. (Jul. 1999).
Nist Grant, Project Brief [online]; ATools for DNA Diagnostics (Oct. 1998) Integrated, Micro-Sample Preparation System for Genetic Analysis,@ [retrieved on Aug. 5, 2002] 2 pgs. Retrieved form the internet at <http://jazz.nist.gov/atpcf/prjbriefs/prjbrief.cfm?ProjectNumber=98-08-0031>.
Test Methods for Pressure Sensitive Adhesive Tapes, Pressure Sensitive Tape Council, (1996) (4 pgs).
Sambrook et al., Molecular Cloning, A laboratory Manual, 2nd Edition, Cold Spring Harbor Laboratory, 1989 (30 pgs) includes Title and copyright pages and Table to Contents.
Emmer, A. et al.; “Wall deactivation with fluorosurfactants for capillary electrophoretic analysis of biomolecules”; Electrophoresis 2001, 22; pp. 660-665.
Garcia, A. et al.; “Comparison of Two Leukocyte Extraction Methods for Cytomegalovirus Antigenemia Assay”; Journal of Clinical Microbiology, Jan. 1996; vol. 34, No. 1; pp. 182-184.
U.S. Appl. No. 60/237,151, filed Oct. 2, 2000.
International Search Report PCT/US2009/064365 Jul. 28, 2010, 5 pgs.
Chiou et al., “A Closed-Cycle Capillary Polymerase Chain Reaction Machine”, Analytical Chemistry, vol. 73, No. 9, May 1, 2001, 2018-2021.
The People's Republic of China Search Report, Oct. 30, 2013, 3 pages.
Related Publications (1)
Number Date Country
20110117656 A1 May 2011 US