Number | Name | Date | Kind |
---|---|---|---|
4172547 | DelGrande | Oct 1979 | |
4921157 | Dishon et al. | May 1990 | |
5102030 | Tamashima et al. | Apr 1992 | |
5125560 | Degani et al. | Jun 1992 | |
5129962 | Gutierrez et al. | Jul 1992 | |
5177134 | Mullen, III et al. | Jan 1993 | |
5255839 | da Costa Alves et al. | Oct 1993 | |
5407121 | Koopman et al. | Apr 1995 | |
5435481 | Da Costa Alves et al. | Jul 1995 | |
5447267 | Sakai et al. | Sep 1995 | |
5499754 | Bobbio et al. | Mar 1996 | |
5499756 | Banerji et al. | Mar 1996 | |
5511719 | Miyake et al. | Apr 1996 |
Number | Date | Country |
---|---|---|
0 59 5 343 A2 | May 1994 | EPX |
195 33 171 | Sep 1995 | DEX |
54-125969 | Sep 1979 | JPX |
59-229278 | Oct 1983 | JPX |
60-108161 | Nov 1983 | JPX |
59-010468 | Jan 1984 | JPX |
60-184465 | Sep 1985 | JPX |
3062935 | Mar 1991 | JPX |
4269896 | Sep 1992 | JPX |
5-152378 | Jun 1993 | JPX |
5-190601 | Jul 1993 | JPX |
Entry |
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"Micro-Soldering Method for Die Bumping/Die Attach", Research Disclosure, Jun. 1991, p. 386. |
"Ultrasonic Reflow Soldering," Ultrasonics, vol. 9, No. 2, Apr. 1971, pp. 67-68. |