The present invention relates to a tag patch antenna, and an RFID (radio frequency identification) tag using the tag patch antenna, and more particularly, to a tag patch antenna in which the communication distance is not deteriorated despite being attached to an object including a liquid or a metal and which has a simple and inexpensive structure, and to an RFID tag using the tag patch antenna.
Conventionally, RFID systems where a reader/writer transmits a radio wave of approximately 1 W, a tag side receives the signal and returns information within the tag with a radio wave, and the reader/writer identifies the tag, have been put into practical use.
The tag includes an antenna and an LSI chip connected to the antenna. The tag does not include a power supply within the tag itself, but activates the circuit of the LSI chip by using power induced by resonance with communication waves from a reader/writer, and transmits an ID and the latest updated data within a memory to the reader/writer.
In such an RFID system, a wireless signal of the UHF (Ultra High Frequency) band (865 MHz in EU, 915 MHz in US, and 953 MHz in Japan) is used.
A communication distance of an RFID system using such a UHF band is relatively long, and is expected to be utilized in various fields in the future.
However, if the tag is attached to a metal such as a personal computer, an automobile, a container, a steel desk, etc., or an object including a liquid, such as a polyethylene terephthalate bottle, a human body, etc., the antenna gain of the tag is deteriorated by mirror image effects peculiar to the metal being a good conductor of electricity or the liquid, leading to a significant deterioration in the communication distance of the tag. A solution to this problem has been demanded.
In light of the above described background, various types of tag antennas adaptable to metals or liquids have been devised so far, and some of them have been commercialized.
For example, Patent Document 1 as such conventional technology describes a configuration for preventing a patch antenna from being affected by an object existing on the side of a ground conductor by arranging the ground conductor in a position opposed to the patch antenna with respect to an interposed dielectric, and by arranging a tag to make the ground conductor contact the object including a liquid or a metal.
However, to implement the configuration described by Patent Document 1, an LSI chip must be connected to the patch antenna and the ground conductor, which are arranged above and under the interposed dielectric. This connection is made using a method of installing a connection wire to go around the side surface of the dielectric, or using a method of forming a penetration hole in the dielectric and of inserting a connection wire into the penetration hole. Both of these methods require cumbersome process steps.
In the meantime, Patent Document 2 as conventional technology which does not require such cumbersome process steps describes a method by which an LSI chip can be connected to a patch antenna with only a process executed on the surface of a dielectric.
However, for the tag antenna described by the above described Patent Document 1 or 2, an expensive material such as a high-frequency substrate, ceramics, etc. is used as a dielectric onto which the tag antenna is pasted. Therefore, further reductions in product price are desired so as to meet growing demand expected in the future. Moreover, the demands for a further increase in the communication distance and a broader band of available frequencies have been increasing.
Patent Document 2: U.S. Pat. No. 6,215,402 B1 (FIGS. 3, 4A and 4B)
An object of the present invention is to provide a tag patch antenna in which the communication distance is not deteriorated despite being attached to an object including a liquid or a metal and which has a simple and inexpensive structure, and an RFID tag using the tag patch antenna.
A tag patch antenna in a first aspect of the present invention includes a slit formed in the vicinity of an edge of an antenna pattern along a part of the edge, and a feeding point to which a tag LSI is connected and which is formed by cutting an intermediate portion of the part of the edge separated by the slit from the body of the antenna pattern by the width of the slit.
In this tag patch antenna, for example, the intermediate portion of the part of the edge is formed to be tilted toward an inner side of the body of the antenna pattern along with the slit, the feeding point is formed to be further inward with respect to an extended line of the edge of the body of the antenna pattern, and an outward mounting mark of the tag LSI is formed between the extended line of the edge and the feeding point.
Additionally, the length of one side of the slit with respect to the feeding point may be formed to be longer than the length of the other side. Moreover, for example, a cutout may be formed in one side of the body of the antenna pattern.
An RFID tag in a second aspect of the present invention includes the tag patch antenna in the first aspect of the present invention, the tag LSI connected to the feeding point of the tag patch antenna, a resinous body molded in a shape of a card to hold the tag patch antenna and the tag LSI, a universal resinous substrate onto which the resinous body is pasted, and a conductor film pasted onto an outer surface that is a surface opposite to the surface pasted with the universal resinous substrate.
In this RFID tag, the conductor film may be, for example, an aluminum tape. Moreover, for example, a material having a relative permittivity εr of 3.5 and a dielectric loss tanδ of 0.01 may be available as the resinous body, and, for example, a material having a relative permittivity εr of 5.1 and a dielectric loss tanδ of 0.0003 may be available as the universal resinous substrate.
Furthermore, it is preferable that the resinous body is pasted onto the universal resinous substrate so that a surface opposite to a surface including external electrodes for the tag LSI is faced toward the surface onto which the resinous body is pasted.
Still further, one side of the body of the antenna pattern in the tag patch antenna may be short-circuited to the conductor film via a conductor.
1 RFID tag
2
a resinous substrate
2
b resinous body
3 tag patch antenna (antenna pattern)
4 tag LSI
5 slit
6(6a, 6b) part of an edge
7 universal resinous substrate
8 conductor film
9 adhesive
10 RFID tag
11 extended line of an edge
12
a,
12
b feeding portion
13 feeding point
14(14a, 14b) mounting mark
15 dicing line
16 conductor
17 impedance of a tag patch antenna
18 impedance of a tag LSI
19 X axis of Smith chart
20 RFID tag
21 cutout portion
As illustrated in
In the tag patch antenna 3 of the RFID tag 1, a slit 5 is formed in the vicinity of an edge (the edge of the upper side among the four sides in
The feeding point is formed by cutting the intermediate portion of the part 6 of the edge that is separated by the slit 5 from the body of the antenna by the width of the slit 5, and the tag LSI 4 is connected to the feeding point.
The part 6 of the edge which is formed by the slit 5 operates as an inductance of the tag patch antenna 3, as will be described in detail later. The capacitance of the tag LSI 4 mounted at the feeding point is canceled out by this inductance.
As illustrated in
A method of molding the tag patch antenna 3 and the tag LSI 4 in the shape of a card using the resinous body 2b may be realized by a manufacturing manner similar to a normal inlet method for holding the resinous substrate 2a (on which the tag patch antenna 3 has been formed and the tag LSI 4 has been mounted at the feeding point) in a hollow within the die with a shape of a card, injecting a melted resinous body 2b into the die, and for cooling down the resinous body 2b.
The resinous body 2b is a dielectric resin, and the above described resinous substrate 2a is apparently integrated with the resinous body 2b to be visually indiscernible by being molded.
Additionally, a universal resinous substrate 7 is pasted onto the bottom of the resinous body 2b that is molded in the shape of a card as the upper portion. On an outer surface (the bottom surface in
The resinous body 2b and the universal resinous substrate 7 are pasted together with double-sided tape or an appropriate adhesive 9. For example, PET (polyethylene terephthalate) is used as the resinous body 2b and a universal material such as dielectric ABS (acrylonitrile-butadiene-styrene) resin, etc. is used as the universal resinous substrate 7.
Additionally, for example, adhesive aluminum tape or the like is used as the conductor film 8. The conductor film 8 forms a ground part for the tag patch antenna 3.
In this state, a resinous body 2b in the shape of a card is pasted onto the universal resinous substrate 7 so that a surface (the bottom surface in
RFID tag using the tag patch antenna according to a second embodiment of the present invention.
As illustrated in
Furthermore, the length of one side (the right side in
Generally, a dedicated mounting machine is used to mount the tag LSI 4 in the antenna pattern 3 by mounting the tag LSI 4 at the feeding point 13 where the feeding portions 12a and 12b of the antenna pattern 3 are formed to be faced to each other, and by connecting two bumps, which are the external electrodes of the tag LSI 4 formed on the back surface, to the feeding portions 12a and 12b.
The dedicated mounting machine mounts the tag LSI 4 in the proper position of the feeding point 13 while recognizing as an image two mounting marks 14 (14a, 14b) that interpose the feeding point 13 and are formed in vicinities inward and outward from the feeding point 13, although this is not particularly illustrated.
Accordingly, it is necessary to form the mounting marks 14 (14a, 14b) in advance in positions inward and outward from the feeding point 13 in the antenna pattern 3.
Normally, the mounting marks 14 are formed with the same material as the tag patch antenna 3. Namely, the mounting marks 14 are designed to be included in the shape of the antenna pattern when the tag patch antenna 3 is formed on the resinous substrate 2a.
The outward mounting mark 14b among the mounting marks 14 (14a, 14b), which are formed in two positions inward and outward from the feeding point 13, is formed to be further inward with respect to the extended line 11 of the edge of the antenna pattern 2 between the extended line 11 of the edge and the feeding point 13. This is because the feeding point 13 is positioned to be further inward with respect to the extended line 11 of the edge of the antenna pattern 3 by the distance d as described above.
Here, if the antenna pattern 3 does not have a configuration where the feeding point 13 of the antenna pattern 3 is formed to be further inward with respect to the extended line 11 of the edge of the body of the antenna pattern 3 by the distance d, namely, if the antenna pattern 3 has a configuration represented with broken lines in
In this case, an outward mounting mark 14b′ among the mounting marks 14 (14a, 14b), which are formed in two positions inward and outward from the feeding point 13, is arranged on the outer side of the tag LSI 4′ with respect to the antenna pattern 3. Accordingly, the mounting mark 14b′ is half-positioned in a dicing line 15 of the resinous substrate 2a, or is positioned completely on the outer side of the dicing line 15.
In either case, metal debris is generated along with the debris of the resinous substrate 2a after the resinous body 2b in the shape of a card is cut out along the dicing line 15 with a dicing line saw.
Additionally, if the mounting mark 14b′ is half-positioned in the dicing line 15 of the resinous substrate 2a, the lifetime of the dicing line saw may be shortened because the mark 14b′ portion is cut when the resinous body 2b in the shape of a card is cut out.
However, the entire antenna pattern 3 including the mounting marks 14 (14a, 14b) is accommodated within a predetermined area, namely, the area of the resinous body 2b in the shape of a card as in this embodiment, whereby metal debris is not generated when the resinous body 2b in the shape of a card is cut out along the dicing line 15 with the dicing line saw. Moreover, since the mounting marks 14 are not cut, the lifetime of the blade is not shortened.
As illustrated in
In this shape, the antenna pattern 3 is formed at a depth of 0.75 from the top surface of the resinous body 2b.
Additionally, the universal resinous substrate 7 pasted onto the bottom surface of the resinous body 2b with the adhesive 9 measures 4.0 mm, 5.1, and 0.003 respectively in thickness, relative permittivity εr, and dielectric loss tanδ in accordance with a merchandise catalog.
In the meantime, marketed ceramic substrates are as high as 20 to 30 in permittivity εr, and also their prices are ten times the universal resinous substrate 7.
In the embodiment, the universal resinous substrate is used, whereby the RFID tag costs far less and can be mass-produced. In this configuration, the side of the conductor film 8 configured with aluminum tape, etc., is attached to the surface of a conductor 16 such as a metal, bottled water, a human body, etc., as illustrated in
In
As is known from the results of simulating the communication distance illustrated in
As represented by the Smith chart of
Namely, the antenna pattern 3 and the tag LSI 4 match. Generally, the impedance of a tag antenna and that of a tag LSI have complex-conjugates of each other. Therefore, if both of the impedances are positioned symmetrically with respect to the X axis of the Smith chart as described above, the tag antenna can supply energy of electromagnetic wave to the tag LSI with high efficiency.
The following equations (1) and (2) represent the method of calculating the communication distance, which is used in the above described simulation.
In the above provided equations (1) and (2), λ represents a wavelength, Pt represents the transmission power of RW (reader/writer), Gt represents an antenna gain (gain) of the RW, q represents a matching coefficient, Pth represents the minimum operation power of the tag LSI, Gr represents the gain of the tag antenna, Rc represents the resistance of the tag LSI, Xc represents the reactance of the tag LSI, Ra represents the resistance of the tag patch antenna, and Xa represents the reactance of the tag patch antenna.
Additionally, the calculation condition is that the minimum operation power Pth of the tag LSI is −9 dBm, the antenna gain Gt of the RW is 8 dBi, and the transmission power Pt of the RW is 26 dBm (cable loss is considered here). Moreover, Zc is defined to be equal to Rc+jXc, and Za is defined to be equal to Ra+jXa. Note that “j” represents an imaginary number.
In the configuration of the tag patch antenna 3 illustrated in
In the characteristic chart illustrated in
As illustrated in
It is also represented, from
As illustrated in
As described above, the tag patch antenna 3 according to the present invention is adaptable to a broad band only by changing the total length L of the antenna.
The value of the capacitance within the tag LSI 4 varies depending on the manufacturer or part number. The tag patch antenna 3 according to the present invention is not only adaptable to a broad band but is also able to easily adjust matching with the tag LSI 4 by causing an alternating current circuit, formed in the shape of a loop by the part 6 of the edge formed by the slit 5 and the body of the antenna, to work as an inductance. This is described below.
Not only the tag LSI 4 according to this embodiment but also LSI chips generally include a parallel resistance Rc (approximately 200 to 2000 Ω) and a parallel capacitance Cc (approximately 0.2 to 2 pF).
In the meantime, the equation “f0=½π√LC” for calculating the condition under which the above described LSI chip and an antenna having an inductance match at a certain resonant frequency f0 is well known.
Here, to cause the RFID tag 10 and the tag patch antenna 3, which are illustrated in
If the parallel inductance La of the tag patch antenna 3 and the parallel capacitance Cc of the tag LSI 4 cancel each other out as described above, all power induced by electromagnetic waves received by the tag patch antenna 3 is supplied to the tag LSI 4. Moreover, all power from the tag LSI 4 is supplied to the tag patch antenna 3, and is externally emitted.
Therefore, a match with the parallel capacitance Cc of the tag LSI 4 is observed by varying the parallel inductance La of the tag patch antenna 3.
In
Additionally, this figure represents a characteristic curve obtained by plotting values resulting from simulating a model where the length S (mm) of the slit 5 is lengthened from 20 mm to 35 mm in increments of 5 mm.
As illustrated in
The method of adjusting a resonant frequency at which the tag patch antenna 3 and the tag LSI 4, which are referred to in the third embodiment, match is not limited to the method of changing the total length of the tag patch antenna.
As illustrated in
It was proven from the results of a simulation and experiments that the resonant frequency is adjusted by changing the depth C of the cutout 21.
Namely, operations and effects similar to those obtained by increasing the total length L of the tag patch antenna is achieved by changing the depth C of the cutout 21 while the total length L of the tag patch antenna is held fixed.
In any of the above described embodiments, the total length of the tag patch antenna can be halved by short-circuiting one side of the tag patch antenna to the conductor film of the ground part via an appropriate conductor, although this is not particularly illustrated.
In this case, although an effective bandwidth becomes narrow, other performance capabilities are similar to those of the above described embodiments.
As described above in detail, according to the present invention, an RFID tag without a deteriorated communication distance despite being attached to an object including a liquid or a metal can be provided.
Additionally, a tag patch antenna that can easily adjust a match with a tag LSI can be provided by setting the impedance of the tag LSI to “several tens+j several hundreds of Ω” (j is an imaginary number).
Furthermore, an expensive material such as a high-frequency substrate, etc. is not used but rather a marketed PET resin or a universal resinous substrate is used as a dielectric. Therefore, the RFID tag can be simplified in structure and mass-produced at low cost, thereby readily meeting the growing demand of the market expected in the future.
Still further, there is no need to make the front and the back surfaces of a tag continuous by making a penetration hole in a dielectric substrate when the front and the back surfaces of the tag are connected as in a normal patch antenna. As a result, the RFID tag can be manufactured with simple process steps.
This application is a continuation of a PCT application PCT/JP2007/000854 filed on Aug. 8, 2007, the entire contents of which are incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
Parent | PCT/JP2007/000854 | Aug 2007 | US |
Child | 12686105 | US |