The present invention relates to a jig and relates particularly to a tank support jig and a tank cleaning method for cleaning a tank.
In a general semiconductor manufacturing process, a large amount of chemical solution is often used, and the purity of chemical solution is very important for prevention of impurities from staying in a semiconductor device.
Conventionally, chemical solution is manufactured in a chemical plant and then is carried to a semiconductor plant after injected into a tank or is injected into a tank provided in the semiconductor plant, followed by work regarding a semiconductor manufacturing process in the semiconductor plant. Therefore, in order to prevent impurities from staying inside the tank, the tank requires cleaning in advance before chemical solution is injected into the tank. Due to such cleaning, with no impurities contaminating chemical solution, the purity of chemical solution is kept.
Note that, according to a conventional tank cleaning method, as illustrated in
Meanwhile, in the industry, there is a method of cleaning the tank 9′ by immersion in cleaning fluid. For example, as illustrated in
However, according to such a conventional method with immersion in cleaning fluid, the cleaning fluid 8″ requires filling up to almost maximum capacity. Thus, a large amount of the cleaning fluid 8″ and long immersion are required, leading to a large increase in the cost of cleaning work and a large increase in the duration of cleaning, namely, a drop in the economic benefit of cleaning work.
Furthermore, according to such a conventional method with immersion in cleaning fluid, from a viewpoint of safety, the cleaning fluid 8″ is not injected up to the upper end space inside the tank 9′. Thus, the upper end space inside the tank 9′ is difficult to clean. Therefore, after chemical solution is injected into the tank 9′, the impurities remaining in the upper end space inside the tank 9′ contaminate the chemical solution, leading to a deterioration in the purity of chemical solution. Thus, the yield of the semiconductor manufacturing is influenced.
Therefore, at present, it is very important to solve such various problems in the conventional technology.
According to the present invention having been made in consideration of such various disadvantages in the conventional technology, provided is a tank support jig for supporting a cylindrical tank, the tank support jig including: a curved body having a first end and a second end that face with an interval in between; and a connecting member disposed across the interval, the connecting member connecting the first end and the second end of the curved body such that the interval is adjustable, in which the curved body and the connecting member form an annular structure for the tank that is to be placed horizontally inside the annular structure with the curved body in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank.
In the tank support jig, the curved body may include a plurality of support portions connected mutually. For example, the plurality of support portions may be detachably connected mutually.
In the tank support jig, the support portions may be each a rod or sheet. The support portions may be each arc-shaped.
In the tank support jig, the connecting member may be horseshoe-shaped.
In the tank support jig, with a screw member, the connecting member may be connected to the first end and the second end of the curved body.
The tank support jig may further include a base on which the curved body is placed. For example, the base may be slidable in contact with an outer circumferential face of the curved body in a circumferential direction such that the tank is allowed to rotate when the tank is placed horizontally inside the annular structure.
According to the present invention, further provided is a tank-support-jig assemblage including a plurality of tank support jigs, in which the plurality of tank support jigs is attached at different positions in an axial direction of the tank.
According to the present invention, provided is a tank cleaning method including: a step of preparing a tank support jig including: a curved body having a first end and a second end that face with an interval in between; and a connecting member disposed across the interval, the connecting member connecting the first end and the second end of the curved body such that the interval is adjustable, the curved body and the connecting member forming an annular structure for a cylindrical tank to be placed horizontally inside the annular structure with the curved body in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank; a step of attaching the tank support jig to a cylindrical tank such that the tank is placed horizontally inside the annular structure with the tank support jig having the annular structure in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank; a step of injecting cleaning fluid into the tank; and a step of cleaning an interior of the tank with the cleaning fluid by rotating, around an axial line of the annular structure, the tank having the tank support jig attached and having the cleaning fluid inside.
In the tank cleaning method, in the step of cleaning, the tank may be caused to pivot backward and forward. For example, with the connecting member as a rotation stopper, the tank may be caused to pivot backward and forward with the rotation stopper as a criterion.
The tank cleaning method may further include a step of placing the curved body of the tank support jig attached to the tank member onto a base slidable in contact with an outer circumferential face of the curved body in a circumferential direction such that the tank is allowed to rotate.
In the tank cleaning method, the step of cleaning may include operating the tank manually to rotate the tank with respect to the base. The base may supply operating force to rotate the tank.
As above, mainly with the horizontal placement of the tank and the rotation of the tank in combination, the tank cleaning method according to the present invention enables dissolution and removal of impurities inside the tank due to agitation of the cleaning fluid. Therefore, in comparison to a conventional spray tank cleaning method, the tank cleaning method according to the present invention enables uniform cleaning of any region inside the tank. Strong agitation of the cleaning fluid inside the tank due to a very large rotation force of the tank enables easy cleaning and removal of dirt on the inner-wall face of the tank. Thus, after chemical solution required in a semiconductor manufacturing process is injected into the tank, the chemical solution in the tank is not contaminated with impurities. Thus, with very high purity, the yield of the semiconductor manufacturing process can be secured.
Furthermore, the tank cleaning method according to the present invention enables cleaning work with the horizontal placement of the tank and the rotation of the tank in combination and with cleaning fluid injected up to half the maximum capacity of the tank, leading to a large reduction in the consumption of the cleaning fluid and no requirement of a long-immersion process. Thus, in comparison to a conventional tank cleaning method, the tank cleaning method according to the present invention enables a large reduction in the cost of cleaning work and a reduction in the duration of cleaning, leading to a rise in the economic benefit of cleaning work.
Since the tank cleaning method according to the present invention enables cleaning work with the horizontal placement of the tank and the rotation of the tank in combination and with cleaning fluid injected up to half the maximum capacity of the tank, not only the safety of cleaning work can be achieved but also any region can be cleaned inside the tank. Therefore, in comparison to a conventional immersion tank cleaning method, the tank cleaning method according to the present invention enables no impurities to remain in any region inside the tank after cleaning work. Thus, after chemical solution required in a semiconductor manufacturing process is injected into the tank, the chemical solution in the tank is not contaminated with impurities. Thus, with very high purity, the yield of the semiconductor manufacturing process can be secured.
The tank support jig according to the present invention enables, because of its annular structure, effective distribution of stress to the outer circumferential face of the tank having cleaning fluid injected inside and thus can firmly support the tank having cleaning fluid injected inside with no deformation of the tank.
Specific embodiments of the present invention will be described below.
For example, the structures, proportions, and dimensions in the accompanying drawings of the present specification are given together with the contents in the specification such that those skilled in the technical field that the present invention belongs to can understand easily, and thus do not limit defined conditions enabling embodiments of the present invention. Therefore, any modifications in structure, changes in proportional relationship, or adjustments in dimensions, with substantially no technical meanings, are to be included in the scope of the technical contents disclosed in the present invention, provided that an effect or object of the present invention is not influenced. Furthermore, for example, the terms such as “upper”, “first”, “second”, and “third” in the present specification are given for easy understanding and thus do not limit the scope of embodiments of the present invention. A change or adjustment in the correlation therebetween is to be included in the scope of embodiments of the present invention even in a case where substantially no change is made in the technical contents.
In the embodiment, the tank support jig 1 supports a cylindrical tank 9 (refer to
The curved body 10 has a first end 10a and a second end 10b that face with an interval G in between.
In the embodiment, the curved body 10 includes a first support portion 101, a second support portion 102, and a third support portion 103 in mutual connection. For example, the first support portion 101, the second support portion 102, and the third support portion 103 are detachably connected mutually.
An exemplary detachably attachment method is as follows. The first support portion 101, the second support portion 102, and the third support portion 103 each have an end side, as illustrated in
Furthermore, the curved body 10 is in close contact with at least part of the outer circumferential face S of the tank 9 (refer to
The curved body 10 has an inner circumferential face C2 made of, for example, a soft rubber pad, such as black rubber, for contribution to close contact with the outer circumferential face S of the tank 9.
The connecting member 11 is disposed across the interval G and connects the first end 10a and the second end 10b of the curved body 10 such that the width t of the interval G (refer to
In the embodiment, as illustrated in
Furthermore, with a plurality of screw members 21 (refer to
For example, as illustrated in
Preferably, a bracket (not illustrated) may be disposed between at least either the leg 112 or leg 113 of the connecting member 11 and the corresponding second support portion 102 or third support portion 103 such that an interval (pitch d illustrated in
The configuration of the openings 110a and 110a′ is advantageous to stress distribution of the connecting member 11, leading to avoidance of a problem with a crack on the connecting member 11 due to stress concentration. Therefore, in the process of adjustment of the width t of the interval G, the structure of the connecting member 11 can be protected against destruction.
In another embodiment, referring to
As illustrated in
Furthermore, as illustrated in
In another embodiment, as illustrated in
The tank-support-jig assemblage 2 includes a plurality of holders 22 each connecting adjacent tank support jigs 1. For example, the holders 22 each have a plurality of fixation holes (denoted with no reference sign) on its both opposed end sides. The tank support jigs 1 each have, in each fixation region B of the outer circumferential face C1 of the curved body 10, a plurality of fixation members 12 (refer to
Furthermore, for adjustment of the structural strength of the tank-support-jig assemblage 2, as necessary, adjustments can be made in the positions of arrangement of the fixation members 12. For example, based on the annular structure 1a illustrated in
For example, four places at angles of 90° around the center O illustrated in
Note that, as necessary, a selection can be made in the type of tank support jig 1. For example, a change may be made to the curved body 10 having a single, two, or four or more arch-shaped segments. A change may be made in the form of the connecting member 11. Thus, the above form is not limiting.
For use of the tank support jig 1, as illustrated in
Thus, referring to
In the embodiment, for usage of the tank support jig 1, with the placement surface of the base 20 as a criterial face (e.g., environmental surface, such as the ground), the direction of placing the tank 9 horizontally is defined as a front-back direction (namely, the direction of the axial line L of the tank 9, for example, an arrow direction X illustrated in
First, the first support portion 101 is disposed on the base 20 and then the tank 9 is placed horizontally on the first support portion 101 by leaning. Next, the second support portion 102 and the third support portion 103 are connected and fixed to the first support portion 101. Furthermore, the second support portion 102 and the third support portion 103 are connected and fixed with the connecting member 11, resulting in formation of an annular structure 1a. Thus, as illustrated in
Next, as illustrated in
In the embodiment, the cleaning fluid 8 contains hydrogen peroxide accounting for 31% and having a density of 1.11 g/cm3. The cleaning fluid 8 is, at its maximum, half the maximum capacity of the tank body 90 (approximately 20 tons in weight). Thus, at the time of rotation of the tank support jig 1 in contact with the rollers 200, the cleaning fluid 8 shakes inside the tank body 90.
Note that, as another process, before the tank 9 is leaned, first, the cleaning fluid 8 may be injected into the tank body 90 and then the tank 9 may be placed horizontally on the first support portion 101 by leaning.
After that, the curved body 10 moves rotationally, for example, due to external force such as manual external force or electrical external force. Thus, the tank 9 having the cleaning fluid 8 injected inside and being provided with the tank support jig 1 (or the tank-support-jig assemblage 2) rotates around the axial line L of the tank 9 as a rotation axis, so that the cleaning fluid 8 shakes inside the tank body 90. Due to the cleaning fluid 8 shaking as above, the interior of the tank body 90 is cleaned.
In the embodiment, the connecting member 11 is not allowed to slide over the rollers 200 of the base 20. Thus, the tank 9 is not allowed to make one rotation although the tank 9 is allowed to pivot in the left direction (counterclockwise) or in the right direction (clockwise) with the connecting member 11 as a starting point, for example, in either rotation direction F illustrated in
After cleaning work, the cleaning fluid 8 is extracted from the tank body 90 through the inlet port 92 of the tank 9 with the inlet tube 920, followed by transport to a predetermined place outside the tank 9, such as a waste-fluid collecting station (not illustrated).
Therefore, mainly with the horizontal placement of the tank 9 and the rotation of the tank 9 in combination, the tank cleaning method according to the present invention enables dissolution and removal of impurities inside the tank 9 due to agitation of the cleaning fluid 8. Therefore, in comparison to a conventional spray cleaning method, the tank cleaning method according to the present invention enables effective and uniform cleaning of any region inside the tank body 90 of the tank 9 because of the rotation angle of the tank 9. Strong agitation of the cleaning fluid 8 inside the tank due to a large rotation force of the tank 9 enables easy cleaning and removal of dirt on the inner-wall face of the tank body 90 of the tank 9. Thus, after chemical solution required in a semiconductor manufacturing process is injected into the tank body 90 of the tank 9, the chemical solution in the tank body 90 of the tank 9 is not contaminated with various types of impurities. Thus, with high purity, the yield of the semiconductor manufacturing process can be secured.
Furthermore, in comparison to a conventional immersion cleaning method, the tank cleaning method according to the present invention enables cleaning work with the horizontal placement of the tank 9 and the rotation of the tank 9 in combination and with the cleaning fluid 8 injected up to half the maximum capacity of the tank body 90 in the tank body 90 of the tank 9. Thus, a large reduction can be made in the consumption of the cleaning fluid 8 and no long-immersion process is required. Therefore, the tank cleaning method according to the present invention enables a large reduction in the cost of cleaning work and a reduction in the duration of cleaning, leading to a rise in the economic benefit of cleaning work.
In comparison to the conventional immersion cleaning method, since the tank cleaning method according to the present invention enables cleaning work with the horizontal placement of the tank 9 and the rotation of the tank 9 in combination and with cleaning fluid injected up to half the maximum capacity of the tank body 90 in the tank body 90 of the tank 9, not only an enhancement can be made in the safety of cleaning work but also any region can be cleaned inside the tank body 90 of the tank 9. Therefore, the tank cleaning method according to the present invention enables no impurities to remain in any region inside the tank body 90 of the tank 9 after cleaning work. Thus, after chemical solution required in a semiconductor manufacturing process is injected into the tank body 90 of the tank 9, the chemical solution in the tank body 90 of the tank 9 is not contaminated with various types of impurities. Thus, with high purity, a high yield can be secured in the semiconductor manufacturing.
In accordance with the requirement of the tank cleaning method according to the present invention, mainly due to the configuration of the annular structure 1a, the tank support jig 1 (or the tank-support-jig assemblage 2) according to the present invention enables an enhancement in resistance against deformation at the time of horizontal placement or rotation of the tank 9 (namely, the strength-assist function of the tank support jig 1 or the tank-support-jig assemblage 2) and effective distribution of stress to the outer circumferential face S of the tank 9 having the cleaning fluid 8 injected inside (e.g., the centrifugal force in rotation), leading to no problem with stress concentration. Therefore, the tank support jig 1 (or the tank-support-jig assemblage 2) can firmly support the tank 9 having the cleaning fluid 8 injected inside (gross weight of approximately 25 tons), leading to no deformation of the tank 9 (regardless of whether or not the cleaning fluid 8 has been injected).
Furthermore, due to the configuration of the base 20, the tank support jig 1 (or the tank-support-jig assemblage 2) according to the present invention distributes stress to the outer circumferential face S at the time of rotation of the tank 9. In particular, the adoption of a configuration in which the weight of the tank 9 is supported by four rollers 200 enables further distribution of stress to the outer circumferential face S located closer to the rollers 200 of the tank 9 having the cleaning fluid 8 injected inside. Therefore, the tank support jig 1 (or the tank-support-jig assemblage 2) can firmly support the tank 9 having the cleaning fluid 8 injected inside, leading to no deformation of the tank 9.
As above, the tank support jig and the tank cleaning method according to the present invention enable achievement of cleaning work having a high cleaning effect and a reduction in the duration of cleaning, with a configuration in which, for example, a tank placed horizontally is supported by the tank support jig having an annular structure and is rotated. Thus, for example, a reduction can be made in the time for starting a semiconductor wafer manufacturing process (period for launching a production line), leading to contribution to the technical development of a semiconductor manufacturing process.
Furthermore, according to the horizontal placement-and-rotation cleaning process of the present invention, cleaning fluid is required to be injected, at its maximum, up to half the maximum capacity of the tank. Thus, not only a reduction can be made in the cost of cleaning fluid but also a reduction can be made in the amount of cleaning fluid discharged in the cleaning work (namely, waste fluid), leading to a large reduction in the cost of waste fluid disposal.
The embodiments described above are just exemplary for the principle and effect of the present invention. It is conceivable that those skilled in the technical field that the present invention belongs to will make various modifications or alterations in the embodiments without departing from the gist of the present invention. Therefore, the present invention is not limited to the given embodiments and thus should be construed with the widest scope of the technical idea defined based on the scope of the claims.
Number | Date | Country | Kind |
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2021-024432 | Feb 2021 | JP | national |
This application is the United States National Phase of International Application No. PCT/JP2022/003357 filed Jan. 28, 2022, and claims priority to Japanese Patent Application No. 2021-024432 filed Feb. 18, 2021, the disclosures of which are hereby incorporated by reference in their entireties.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2022/003357 | 1/28/2022 | WO |