Some electronic equipment manufacturers design different circuit board modules with common dimensions (e.g., the same heights, the same lengths, etc.). For example, suppose that a manufacturer wishes to offer a mid-range processing module having a first type of connector, and a high-end processing module having a second type of connector. The manufacturer may see advantages to using a similar circuit board layout for each module and thus want to keep the height and length of the two processing modules the same. Additionally, the manufacturer may see advantages using a single layout for an interconnect (e.g., a midplane, a backplane, etc.) to which either the mid-range processing module having the first type of connector, or the high-end processing module having the second type of connector, will connect.
If the mid-range processing module and the high-end processing module have the same general shape and appearance, it may be difficult for someone to distinguish the two modules from each other. Accordingly, the likelihood exists that the person (e.g., a technician) may inadvertently attempt to connect the mid-range processing module having the first type of connector to the high-end interconnect, or alternatively attempt to connect the high-end processing module having the second type of connector to the mid-range interconnect. A source of further complication is the fact that such a processing module typically engages an interconnect in a blind-mating manner thus preventing the person from simply making a visual comparison of the connector layout of the processing module with the connector layout of the interconnect.
To prevent that person from inadvertently connecting the wrong processing module to the wrong interconnect, the manufacturer may rely on that person to exercise extreme care when handling processing modules. For example, one approach to preventing connection of the wrong processing module to the wrong interconnect (hereinafter referred to as the labeling approach) involves placement of conspicuous matching labels on the mid-range processing module and the mid-range interconnect, and placement of different matching labels on the high-end processing module and the high-end interconnect. Accordingly, the person will be able to avoid inadvertent connection of a mid-range module to a high-end interconnect, or vice versa, by performing a close comparison of the labels.
Another approach to preventing connection of the wrong processing module to the wrong interconnect (hereinafter referred to as the sensing approach) involves training the person to physically sense when a processing module properly aligns with a correctly matching interconnect, and when the processing module improperly aligns the wrong interconnect. In particular, as the person moves the connectors of the processing module into contact with corresponding connectors of the interconnect, the person will be able to manually feel whether the processing module matches the interconnect. Specifically, if the person attempts to provide an extraordinary amount of force and the processing module fails to connect with the interconnect, the person knows that the person is attempting to connect the wrong processing module with the wrong interconnect and that the person should stop the attempt.
Unfortunately, there are deficiencies to the above-described conventional approaches to making sure a person does not inadvertently connect a processing module to a wrong interconnect. For example, the above-described conventional labeling approach relies heavily on proper training of the person to manually compare labels thus increasing the cost of training as well as slowing down the installation process. Furthermore, there is no guarantee that the labels will be properly attached to the processing modules, or that the labels will remain secured to the processing modules.
Additionally, the above-described conventional physical sensing approach risks causing damage to the modules and to the interconnects. In particular, it is possible that an attempt to mate the wrong processing module with the wrong interconnect will result in mechanical damage to the connectors (e.g., scratched pads, bend pins, crack or deform connector bodies, etc.) or result in damage to the module itself (e.g., fractured solder joints, damaged device packages, removal of protective coatings, etc.). Moreover, it is possible that such an attempt to result in damage to circuitry if contact is made between connectors while the interconnect is powered up (e.g., during an attempt to hot swap a processing module).
Furthermore, neither of the above-described conventional approaches is fool-proof. Rather, both conventional approaches rely heavily on correct human training and are thus highly susceptible to human error.
In contrast to the above-described conventional approaches to preventing connection of a processing module to a wrong interconnect, an improved interconnection assembly includes a motherboard and a stopper which is mounted to the motherboard. The stopper provides (i) clearance to a correct daughter card and (ii) interference against an incorrect daughter card (i.e., a daughter card having an incompatible arrangement of connectors) thus preventing the incorrect daughter card from coming into contact with the motherboard or connectors on the motherboard. Accordingly, a correct daughter card is permitted to mate with the motherboard in an unobstructed manner. However, the stopper interferes with the incorrect daughter card thus removing the risk of damage to both the interconnection assembly and the incorrect daughter card.
One embodiment is directed to an improved interconnection assembly which is configured to couple to only one of a first daughter card having a first arrangement of daughter card connectors and a second daughter card having a second arrangement of daughter card connectors. The interconnection assembly includes a motherboard and motherboard connectors. The motherboard connectors are adapted to couple to one of the first arrangement of daughter card connectors of the first daughter card and the second arrangement of daughter card connectors of the second daughter card. The interconnection assembly further includes a stopper attached to the motherboard. The stopper is adapted to provide interference against the other of the first arrangement of daughter card connectors of the first daughter card and the second arrangement of daughter card connectors of the second daughter card to prevent the motherboard connectors from contacting the other of the first arrangement of daughter card connectors of the first daughter card and the second arrangement of daughter card connectors of the second daughter card.
The foregoing and other objects, features and advantages of the invention will be apparent from the following description of particular embodiments of the invention, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
An improved interconnection assembly includes a motherboard and a stopper, which is mounted to the motherboard, that provides (i) clearance to a correct daughter card and (ii) interference against an incorrect daughter card (i.e., a daughter card having an incompatible arrangement of connectors preventing that daughter card from properly connecting to the motherboard). Accordingly, the correct daughter card is permitted to mate with the motherboard in an unobstructed manner. However, interference between the stopper and a connector of the incorrect daughter card prevents the connector of the incorrect daughter card from contacting a corresponding connector of the motherboard thus alleviating the risk of damage to both the interconnection assembly and the incorrect daughter card.
As shown in
At this point, it should be understood that the power supplies 26(A), 26(B) are identical to each other, and that the daughter cards 28(A), 28(B) are identical to each other. Accordingly, the manufacturer of the electronic system 20 is capable of maintaining a single power supply design and a single daughter card design for the electronic system 20. In view of the use of single designs, in order to accomplish proper distribution of signals and in order to minimize the complexity of laying out the interconnection assembly 24, the layout of the top half of the interconnection assembly 24 is generally the same as the bottom half of the interconnection assembly 24 except that the bottom half is flipped 180 degrees (i.e., upside down). This aspect is clearly observable in
Accordingly, to properly install a power supply 26 (
Similarly, to properly install a daughter card 28 (
When all of the components are properly installed within the chassis 22 and the electronic system 20 is in operation, the electronic system 20 is configured to perform data storage operations on behalf of one or more external host computers. In particular, the power supplies 26 provide power to the daughter cards 28 and to the disk drives 30 through the interconnection assembly 24, and the daughter cards 28 store and retrieve data from the disk drives 30 through the interconnection assembly 24 on behalf of the external host computers.
It should be understood that the electronic system 20 includes, by way of example, two power supplies 26(A), 26(B) and two daughter cards 28(A), 28(B) for fault tolerance purposes. In some arrangements, the electronic system 20 includes a number of power supplies 26 other than two (e.g., one, three, four, etc.), and/or a number of daughter cards 28 other than two (e.g., one, three, four, etc.).
It should be further understood that the manufacturer of the electronic system 20 may wish to additionally manufacture components and systems which are slightly different compared to those described above. For example, suppose that the interconnection assembly 24 and the daughter cards 28 of the electronic system 20 uses VHDM®-based connectors and components to achieve a first style of operation. Now, further suppose that the manufacturer wishes to achieve a different style of operation using slightly different circuitry and GBX®-based connectors and components in place of the VHDM-based connectors and components. VHDM and GBX are connector technologies of Teradyne, Inc. of Boston, Mass.
As shown in
Along these lines and as shown in
However, the motherboard connectors 66 and the daughter card connectors 68 (i.e., GBX connectors) of the electronic system 60 (
It should be understood that the electronic systems 20, 60 use the same chassis 22. Further along these lines, the manufacturer is capable of using the chassis 22 universally among different electronic systems with any midplane and any daughter card configuration and thus leveraging off of a single chassis design.
Further details of the original electrical system of
As shown in
Preferably, the plane-shaped base 72 of the stopper 70 separates the interference portion 74 from the daughter card side 52 of the motherboard 50 in a cantilevered manner by at least an eighth of an inch. That is, the plane-shaped base 72 provides clearance 76 (
As shown in
However, due to the interleaved positioning of the interference portions 74 of the stoppers 70 within the rows of motherboard connectors 56, the stoppers 70 interfere with the daughter cards 64 of
It should be understood that the stopper 70 is configured to be incompatible with an interconnection assembly 62 of the electronic system 60 (
As mentioned above, an improved interconnection assembly 24 includes a motherboard 50 and a stopper 70, which is mounted to the motherboard 50, that provides (i) clearance to a correct daughter card 28 and (ii) interference against an incorrect daughter card 64 (i.e., a daughter card 64 having an incompatible arrangement of connectors 68 preventing that daughter card 64 from properly connecting to the motherboard 50). Accordingly, the correct daughter card 28 is permitted to mate with the motherboard 50 in an unobstructed manner. However, interference between the stopper 70 and a connector 68 of the incorrect daughter card 64 prevents the connector 68 of the incorrect daughter card 64 from contacting a corresponding connector 58 of the motherboard 50 thus alleviating the risk of damage to both the interconnection assembly 24 and the incorrect daughter card 64.
While this invention has been particularly shown and described with references to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
For example, the motherboards 50, 80 were described and shown above as being midplanes of portions of data storage systems by way of example only. In other arrangements, the motherboards 50, 80 form portions of other types of electronic systems (e.g., general computing systems, network systems, real-time custom systems), etc.). Furthermore, the principles and techniques described above are suitable for use in other embodiments such as on a backplane, or in a card cage environment.
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