Patent Application
20240006873
Embodiments generally relate to electrical interfaces. More particularly, embodiments relate to technology to resolve connector damage due to arcing.
Universal Serial Bus (USB) technology (e.g., Universal Serial Bus Type-C Cable and Connector Specification, Release 2.0, August 2019, USB Implementers Forum) provides for charging and/or operating power to be supplied from a source device to a sink device connected to the source device. For example, a laptop computer might negotiate a power delivery setting with an external charger (e.g., adapter) in which the external charger supplies (e.g., as a source device) power to the laptop computer (e.g., as a sink device). In such a case, the external charger provides the power to the laptop computer via a USB Type-C connector (e.g., plug) that is inserted (e.g., by a user) into a USB Type-C receptacle (e.g., port) on the laptop computer.
If the user removes/unplugs the connector from the receptacle during operation, a voltage difference may exist between contacts within the connector and contacts within the receptacle. Since the construction of USB Type-C connectors and receptacles calls for relatively tight spacing between the contacts, removal of the adapter may lead to an electrical field large enough to breakdown the air between the connector and the receptacle. As a result, a continuous spark or arcing may occur. Indeed, the continuous energy may be sufficient to cause damage to the connector and/or receptacle.
The various advantages of the embodiments will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
Turning now to
In the illustrated example, an unplug event 18 occurs, where the user removes the plug 14 from the receptacle 16 while the adapter 12 is supplying power to the computing system 10. Thus, the user contact results in a disconnected state 26. Conventionally, the port contact(s) 20 may remain connected to the bulk capacitor during the disconnected state 26. Accordingly, the voltage level of the port contact(s) 20 may decrease relatively quickly as the bulk capacitor discharges stored current into the computing system 10 (e.g., acting as a small battery). Additionally, the adapter 12 may take more time (e.g., 650 milliseconds (ms)) to shut down the source output voltage to the connector contact(s) 22 once the disconnected state 26 is detected. Thus, the voltage difference between the contact(s) 20, 22 and the tight spacing between the contact(s) 20, 22 may be enough to create an electrical field large enough to breakdown the air between the contact(s) 20, 22 and generate a spark 28 (e.g., arcing) from the connector contact(s) 22 to the port contact(s) 20. The spark 28 may damage the contact(s) 20, 22 over time (e.g., via corrosion) and may present a safety hazard.
As will be discussed in greater detail, the technology described herein provides for automatically anticipating the disconnected state 26 and disconnecting the bulk capacitor from the port contact(s) 20 (e.g., reducing the primary load of the sink device). As a result, the voltage level of the port contact(s) 20 may remain at a similar voltage level of the connector contact(s) 22 at the onset of the disconnected state 26. The technology described herein therefore enables the spark 28 to be eliminated, which maintains the condition of the contact(s) 20, 22 (e.g., eliminating corrosion) and/or improves safety.
With continuing reference to
As best shown in
As will be discussed in greater detail, the piezoelectric membrane 32 may be electrically connected to one or more configuration channel contacts. In such a case, when a user grasps/contacts the piezoelectric membrane 32, an electrical signal (e.g., voltage transition from low to high) is transferred to the receptacle of the computing system via the CC contact(s), wherein the electrical signal indicates user contact with the adapter plug 30. Upon receipt of the electrical signal, the computing system may begin to monitor the receptacle for a disconnect condition (e.g., CC line state change and/or bus voltage reduction within a predefined amount of time). If the disconnect condition is detected, the computing system may then disconnect a bulk capacitor (e.g., 1000′ (microfarad) capacitor) from the receptacle. In an embodiment, disconnection of the bulk capacitor from the receptacle prevents a current arc from the adapter plug 30 to the receptacle.
Turning now to
Upon connection of the receptacle 72 with an adapter plug (not shown), a power delivery (PD) controller 88 may negotiate a power delivery setting (e.g., sink device status receiving SPR or EPR power delivery) with the adapter plug over the CC line(s) 74. A low voltage line 90 may be activated while the PD negotiations are underway. Once the PD negotiations are complete, the PD controller 88 may open the low voltage line 90 and enable the delivery of the negotiated level of power via the switches 80, 82 (e.g., controlling the slew rate).
The PD controller 88 includes logic (e.g., logic instructions, configurable logic hardware, fixed-functionality logic hardware, etc., not shown) to detect a signal from a piezoelectric membrane of the adapter plug, wherein the signal indicates user contact with the adapter plug. In one example, the signal is detected via the CC line(s) 74. The PD controller 88 may also disconnect the bulk capacitor 78 from the receptacle 72 in response to a disconnect condition associated with the user contact. In one example, the PD controller 88 monitors the receptacle 72 for the disconnect condition in response to the signal. Additionally, the PD controller 88 may disconnect the bulk capacitor 78 from the receptacle 72 by deactivating the switches 80, 82.
In an embodiment, the disconnect condition includes a state change in the CC line(s) 74 within a predetermined amount of time, a voltage reduction in the bus voltage line 76, etc., or any combination thereof. For example, the CC contact in the adapter plug is typically longer than the other contacts within the adapter plug. Thus, a state change in the CC line(s) 74 may be indicative that the user contact culminated in an unplug event. Additionally, a reduction in the voltage on the bus voltage line 76 may be indicative that the bulk capacitor 78 has begun discharging due to an unplug event. In either case, disconnecting the bulk capacitor 78 from the receptacle 72 prevents the voltage difference between the bus voltage line 76 and the bus voltage contacts of the adapter plug from being great enough to trigger arcing. In an example, the input capacitor 86 remains connected to the receptacle 72 while the bulk capacitor 78 is disconnected from the receptacle 72. The illustrated input capacitor 86 does not discharge as quickly as the bulk capacitor 78 because the input capacitor 86 does not provide current to the load 84 during the unplug event.
The illustrated processing block 102 provides for detecting a signal from a piezoelectric membrane of an adapter plug, wherein the signal indicates user contact with the adapter plug. In one example, block 102 negotiates a power delivery setting with the adapter plug via a configuration channel line prior to detecting the signal from the piezoelectric membrane. Block 104 monitors a receptacle adjacent to the adapter plug for a disconnect condition in response to the signal, wherein the disconnect condition is associated with the user contact. The disconnect condition may include, for example, a configuration channel line state change and/or a bus voltage reduction (e.g., of 5V) within a predetermined amount of time. Block 104 may detect the signal via a configuration channel line. Block 106 disconnects a bulk capacitor from the receptacle in response to the disconnect condition. In an embodiment, block 106 deactivates one or more switches connected between the bulk capacitor and the receptacle. Additionally, an input capacitor may remain connected to the receptacle while the bulk capacitor is disconnected from the receptacle.
Disconnection of the bulk capacitor from the receptacle therefore prevents a current arc from the adapter plug to the receptacle. Accordingly, the method 100 enhances performance at least to the extent that preventing arcing reduces damage to the receptacle and/or adapter plug. Arcing prevention also improves safety.
At laptop block 108e, the Type-C subsystem (TCSS) is configured to operate in USB mode by default. Laptop block 108f then waits for a source capability message. The supply then sends an advertisement message 108g that indicates the power capabilities of the supply. The laptop returns a request message 108h, which requests a power profile. The supply may also return an acceptance message 108i. Upon receipt of the acceptance message 108i, the laptop (e.g., sink device) enters a power sink standby mode at laptop block 108t.
Supply block 108j initiates a ramp-up of the bus voltage to the explicitly contracted value (e.g., 20V). Additionally, the supply may issue a ready message 108k, wherein laptop block 108l exits the power sink standby mode. A current message 108m ramps the bus current to the negotiated power. Laptop block 108n detects a signal from a piezoelectric membrane of the adapter plug prior to an unplug event 1080. Laptop block 108p observes a pull-up resistance disconnection on the CC line and laptop block 108q determines whether the bus voltage has ramped down by 5V. If so, laptop block 108r deactivates the sink device FETs. Otherwise, laptop block 108s resets the CC disconnect state. Thus, laptop block 108r prevents a current arc from the adapter plug to the receptacle, reduces damage to the receptacle and/or adapter plug, and improves safety.
Turning now to
In the illustrated example, the system 110 includes a host processor 112 (e.g., CPU) having an integrated memory controller (IMC) 114 that is coupled to a system memory 116. In an embodiment, an IO module 118 is coupled to the host processor 112. The illustrated IO module 118 communicates with, for example, a network controller 126 (e.g., wired and/or wireless), an external adapter 124, and mass storage 128 (e.g., hard disk drive/HDD, optical disc, solid-state drive/SSD, flash memory, etc.). In an embodiment, the external adapter 124 includes a plug that is inserted into a receptacle of the computing system 110, wherein the plug includes a piezoelectric membrane. Additionally, the computing system 110 may include a power delivery interface such as, for example, the power delivery interface 70 (
In one example, the mass storage 128 and/or the system memory 116 include instructions 132, which when executed by a controller 119 (e.g., PD controller), causes the controller 119 and/or the computing system 110 to implement one or more aspects of the method 100 (
The computing system 110 is therefore considered performance-enhanced at least to the extent that disconnection of the bulk capacitor from the receptacle prevents a current arc between the adapter plug and the receptacle. Preventing arcing also reduces damage to the receptacle and/or adapter plug and improves safety.
The logic 144 may be implemented at least partly in configurable or fixed-functionality hardware. In one example, the logic 144 includes transistor channel regions that are positioned (e.g., embedded) within the substrate(s) 142. Thus, the interface between the logic 144 and the substrate(s) 142 may not be an abrupt junction. The logic 144 may also be considered to include an epitaxial layer that is grown on an initial wafer of the substrate(s) 142.
The technology described herein therefore extends the life cycle of power delivery plugs and receptacles without increasing the size of the bulk capacitor on the sink side. Indeed, a larger bulk capacitor would fail to address long-term reliability risks, add stress to the sink device FETs (e.g., due to larger inrush current during connection), and increase cost. Moreover, during AC mode of operation, the energy stored in a larger capacitor (e.g., 135 μF capacitor at a 5A maximum limit) may be used up for system performance.
Embodiments are applicable for use with all types of semiconductor integrated circuit (“IC”) chips. Examples of these IC chips include but are not limited to processors, controllers, chipset components, programmable logic arrays (PLAs), memory chips, network chips, systems on chip (SoCs), SSD/NAND controller ASICs, and the like. In addition, in some of the drawings, signal conductor lines are represented with lines. Some may be different, to indicate more constituent signal paths, have a number label, to indicate a number of constituent signal paths, and/or have arrows at one or more ends, to indicate primary information flow direction. This, however, should not be construed in a limiting manner. Rather, such added detail may be used in connection with one or more exemplary embodiments to facilitate easier understanding of a circuit. Any represented signal lines, whether or not having additional information, may actually comprise one or more signals that may travel in multiple directions and may be implemented with any suitable type of signal scheme, e.g., digital or analog lines implemented with differential pairs, optical fiber lines, and/or single-ended lines.
Example sizes/models/values/ranges may have been given, although embodiments are not limited to the same. As manufacturing techniques (e.g., photolithography) mature over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the figures, for simplicity of illustration and discussion, and so as not to obscure certain aspects of the embodiments. Further, arrangements may be shown in block diagram form in order to avoid obscuring embodiments, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the computing system within which the embodiment is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments, it should be apparent to one skilled in the art that embodiments can be practiced without, or with variation of, these specific details. The description is thus to be regarded as illustrative instead of limiting.
The term “coupled” may be used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms “first”, “second”, etc. may be used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.
As used in this application and in the claims, a list of items joined by the term “one or more of” may mean any combination of the listed terms. For example, the phrases “one or more of A, B or C” may mean A; B; C; A and B; A and C; B and C; or A, B and C.
Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments can be implemented in a variety of forms. Therefore, while the embodiments have been described in connection with particular examples thereof, the true scope of the embodiments should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.
