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4698025 | Silbernagel et al. | Oct 1987 | A |
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5156554 | Rudoy et al. | Oct 1992 | A |
5186647 | Denkmann et al. | Feb 1993 | A |
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5299956 | Brownell et al. | Apr 1994 | A |
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5310363 | Brownell et al. | May 1994 | A |
5362257 | Neal et al. | Nov 1994 | A |
5399107 | Gentry et al. | Mar 1995 | A |
5403200 | Chen | Apr 1995 | A |
5474474 | Siemon et al. | Dec 1995 | A |
5478261 | Bogese, II | Dec 1995 | A |
5503572 | White et al. | Apr 1996 | A |
5580257 | Harwath | Dec 1996 | A |
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5639261 | Rutkowski et al. | Jun 1997 | A |
5639266 | Patel | Jun 1997 | A |
5647043 | Anderson et al. | Jul 1997 | A |
5659650 | Arnett | Aug 1997 | A |
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5700167 | Pharney et al. | Dec 1997 | A |
5713764 | Brunker et al. | Feb 1998 | A |
5716237 | Conorich et al. | Feb 1998 | A |
5735714 | Orlando et al. | Apr 1998 | A |
5759070 | Belopolsky | Jun 1998 | A |
5779503 | Tremblay et al. | Jul 1998 | A |
5785546 | Hamai et al. | Jul 1998 | A |
5791935 | Yamanashi | Aug 1998 | A |
5791943 | Lo et al. | Aug 1998 | A |
5795186 | Tulley et al. | Aug 1998 | A |
5885111 | Yu | Mar 1999 | A |
5911602 | Vaden | Jun 1999 | A |
5924896 | Arnett et al. | Jul 1999 | A |
5938479 | Paulson et al. | Aug 1999 | A |
5941734 | Ikeda et al. | Aug 1999 | A |
5947761 | Pepe | Sep 1999 | A |
5947772 | Arnett et al. | Sep 1999 | A |
6066005 | Belopolsky | May 2000 | A |
6083052 | Adams et al. | Jul 2000 | A |
6086428 | Pharney et al. | Jul 2000 | A |
6089909 | Tokuwa | Jul 2000 | A |
6089923 | Phommachanh | Jul 2000 | A |
6102722 | Arnett | Aug 2000 | A |
6165023 | Troutman et al. | Dec 2000 | A |
6234836 | Schmidt et al. | May 2001 | B1 |
6270358 | Nozick | Aug 2001 | B1 |
6305950 | Doorhy | Oct 2001 | B1 |
6334792 | Schmidt et al. | Jan 2002 | B1 |
6371793 | Doorhy et al. | Apr 2002 | B1 |
Number | Date | Country |
---|---|---|
0 777 304 | Jun 1997 | EP |
2314466 | Dec 1997 | GB |
WO 9744862 | Nov 1997 | WO |
WO 0042682 | Jul 2000 | WO |
Entry |
---|
The Siemon Company Catalog pages—front cover page through p. 1.39, and back cover page, dated 1999. |
Panduit Corp., Tinley Park, Illinois, “Panduit®Communication Products”, cover page, pp. 40-49, and back page (1996). |
Copy of U.S. application Ser. No. 09/811,148. |