TEMPERATURE CHAMBER

Information

  • Patent Application
  • 20230294100
  • Publication Number
    20230294100
  • Date Filed
    March 15, 2023
    a year ago
  • Date Published
    September 21, 2023
    a year ago
Abstract
There is provided a temperature chamber including: a heat transfer member in which a bottom wall and side walls are integrated; a recessed portion surrounded by the bottom wall and the side walls; and a heat source member that is configured to heat and/or cool the heat transfer member.
Description
Claims
  • 1. A temperature chamber comprising: a heat transfer member in which a bottom wall and side walls are integrated;a recessed portion surrounded by the bottom wall and the side walls; anda heat source member that is configured to heat and/or cool the heat transfer member.
  • 2. The temperature chamber according to claim 1, wherein at least one of the side walls has a non-uniform thickness.
  • 3. The temperature chamber according to claim 1, wherein at least one of the side walls has a larger thickness in a bottom region than in any other region.
  • 4. The temperature chamber according to claim 1, wherein at least one of the side walls has a smaller planar cross-sectional area on an upper side than on a bottom side.
  • 5. The temperature chamber according to claim 1, wherein the recessed portion is provided with a step portion on an inner side surface.
  • 6. The temperature chamber according to claim 1, further comprising: a lid member, wherein the recessed portion is configured to be sealed with the lid member, the lid member has a window, and inside of the recessed portion is configured to be observed from outside.
Priority Claims (1)
Number Date Country Kind
2022-042847 Mar 2022 JP national