Information
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Patent Application
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20230294100
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Publication Number
20230294100
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Date Filed
March 15, 2023a year ago
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Date Published
September 21, 2023a year ago
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Inventors
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Original Assignees
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CPC
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International Classifications
Abstract
There is provided a temperature chamber including: a heat transfer member in which a bottom wall and side walls are integrated; a recessed portion surrounded by the bottom wall and the side walls; and a heat source member that is configured to heat and/or cool the heat transfer member.
Claims
- 1. A temperature chamber comprising:
a heat transfer member in which a bottom wall and side walls are integrated;a recessed portion surrounded by the bottom wall and the side walls; anda heat source member that is configured to heat and/or cool the heat transfer member.
- 2. The temperature chamber according to claim 1, wherein at least one of the side walls has a non-uniform thickness.
- 3. The temperature chamber according to claim 1, wherein at least one of the side walls has a larger thickness in a bottom region than in any other region.
- 4. The temperature chamber according to claim 1, wherein at least one of the side walls has a smaller planar cross-sectional area on an upper side than on a bottom side.
- 5. The temperature chamber according to claim 1, wherein the recessed portion is provided with a step portion on an inner side surface.
- 6. The temperature chamber according to claim 1, further comprising: a lid member,
wherein the recessed portion is configured to be sealed with the lid member, the lid member has a window, and inside of the recessed portion is configured to be observed from outside.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2022-042847 |
Mar 2022 |
JP |
national |