1. Field of Invention
The present invention relates to semiconductor integrated circuits, and more specifically, to a low voltage reference circuit that is capable of outputting a plurality of voltages with minimal operating voltage overhead.
2. Description of Related Art
Voltage reference circuits are a critical component of many analog, digital and mixed-signal integrated circuits. Circuits such as oscillators, Phase Locked Loops (PLLs), and Dynamic Random Access Memories (DRAM) depend on stable, temperature independent voltage references. Most voltage references in use today require an operating voltage of at least 1.3 V. This is especially true for three terminal series regulated voltage references (a more desirable voltage reference due to reduced power dissipation). The output ranges of these devices vary from 1.3 V (for a bipolar process) to 1.6 V or more (for a CMOS process). As operating voltages of integrated circuits decrease with decreasing critical dimensions, the need has arisen for lower operating voltages of voltage reference circuits. At the same time, however, these reference circuits need to maintain their temperature independence. Therefore, it is desirable to provide a temperature compensated voltage reference circuit that minimizes overhead, functions at operating voltages at or below 1.3V and provides a stable reference voltage output.
The present invention provides a circuit for creating a temperature compensated voltage output with a reduced operational input voltage overhead. In one embodiment a voltage reference circuit employs voltage regulating circuitry to reduce voltage differences caused by short channel effects. The reduction of these differences allows for a lower overhead voltage. In a second embodiment these voltage differences are reduced by regulating circuit nodes within the voltage reference circuit with Bipolar Junction Transistors (BJTs) which have more ideal characteristics. In the above embodiments the voltage reference circuit may be a bandgap reference circuit or a sub-bandgap reference circuit.
In a third embodiment a sub-bandgap low voltage reference circuit uses a current conveyer as a temperature coefficient adjustment circuit to balance the temperature coefficients of an output current. The resultant output current is temperature compensated. In a fourth embodiment the current conveyer may be replaced with a single resistor to balance the temperature coefficient of the output current. An additional resistor may be used in these embodiments to create a temperature compensated voltage from the output current.
Various other embodiments are described where the above embodiments are used in combination with each other to offer an assortment of temperature compensated circuits that a circuit designer could use for a voltage reference with minimized voltage overhead.
In addition to the above embodiments, a temperature compensated current source is also presented that uses the ground terminal of a current differencing amplifier to balance the temperature coefficients of an output current. The temperature compensated current source may also be used with a resistor to create a temperature compensated voltage output. Other embodiments may also comprise different types of transistors such as DTMOS transistors.
These as well as other aspects and advantages of the present invention will become apparent to those of ordinary skill in the art by reading the following detailed description, with appropriate reference to the accompanying drawings.
Preferred embodiments of the present invention are described with reference to the following drawings, wherein:
a is a schematic drawing of a temperature compensated voltage reference circuit implementing an amplifier and a FET as a voltage regulator in accordance with one embodiment of the present invention;
b is a schematic drawing of a temperature compensated voltage reference circuit implementing an additional BJT as a voltage regulator in accordance with one embodiment of the present invention;
a is a schematic drawing of a temperature compensated voltage reference circuit implementing a current conveyer so as to balance the temperature coefficient of an output voltage in accordance with one embodiment of the present invention;
b is a schematic drawing of a temperature compensated voltage reference circuit implementing a resistor used to balance the temperature coefficient of an output voltage in accordance with one embodiment of the present invention;
a is a schematic drawing of a temperature compensated voltage reference circuit implementing an additional BJT as a voltage regulator and a resistor used to balance the temperature coefficient of an output voltage in accordance with one embodiment of the present invention;
b is a schematic drawing of a temperature compensated voltage reference circuit implementing an additional BJT as a voltage regulator and two resistors used to balance the temperature coefficient of an output voltage in accordance with one embodiment of the present invention;
a is a schematic drawing of a temperature compensated voltage source using the ground terminal of a current differencing amplifier to balance the temperature coefficient of an output voltage in accordance with one embodiment of the present invention;
b is a schematic drawing of a temperature compensated current source using the ground terminal of a current differencing amplifier to balance the temperature coefficient of an output current in accordance with one embodiment of the present invention;
a is a schematic drawing of a voltage reference circuit whereby transistors in the reference circuit have been replaced with Dynamic-threshold MOS transistors (DTMOS) in accordance with one embodiment of the present invention; and
b is a graph illustrating VREF, VE2, and VIN vs. temperature of the circuits in
In view of the wide variety of embodiments to which the principles of the present invention can be applied, it should be understood that the illustrated embodiments are examples only, and should not be taken as limiting the scope of the present invention.
Several embodiments of a temperature compensated voltage reference circuit are presented. All of the embodiments seek to lower the input voltage required for a voltage reference circuit. One circuit for minimizing overhead voltages includes circuitry that regulates the voltage at the drains of two FETs within a voltage reference circuit. This regulating circuitry may be placed in a bandgap or sub-bandgap reference circuit. In other embodiments a temperature coefficient adjustment circuit is used in a sub-bandgap circuit. The temperature coefficient adjustment circuit may be a current conveyer or a resistor that is tapped off one node of the reference circuit. The extra current (or voltage) assists in balancing the temperature coefficient of an output current. The output current may also be used to provide a voltage. Both the voltage and the current are temperature compensated.
Various other combinations of the above circuits are presented. One example is a sub-bandgap reference circuit that also employs voltage regulating circuitry. Another current source using the ground terminal of a current differencing amplifier as an extra current to balance the temperature coefficient of an output current is also present. This circuit may also be used to create a temperature compensated voltage output.
Turning now to the figures,
The collector current of transistors Q1 116 (I1 120) and Q2 118 (I2 122) have a designed ratio:
p=I2/I1
This ratio is typically 1:1 but it can vary depending on the design of the circuit. The area of both transistors is also designed to have a ratio given by:
r=A1/A2
Assuming that the collector currents of Q1 116 and Q2 118 are equal to their respective emitter currents, the currents I1 120 and I2, 122 through transistors Q1 116 (and R1 124) and Q2 118 are determined by:
I1=(VT/R1)ln(p·r)
I2=pI1
Where:
VT=kT/q
If the design of M1 106 is matched to the design of M3 108, which is not necessarily required, the current through transistor M3 108 (I3 126) is the sum of I1 120 and I2 122 and can be calculated as:
I3=(p+1)(VT/R1)ln(p·r)
All of the currents, I1 120, I2 122, and I3 126, are dependent on VT, which is Proportional-To-Absolute-Temperature (PTAT); as temperature increases, VT increases and thus these three currents increase. The voltage VE3 128, at the emitter of Q3 130 is Complementary-To-Absolute-Temperature (CTAT). Multiplying the current I3 by the resister R3 132 and adding the voltage VE3, creates the output voltage VREF 102 and is calculated as:
VREF=VE3+(p+1)(R3/R1)VT ln(p·r)
VREF 102 can be made temperature independent by considering the temperature coefficients of both terms of the equation. The first term of the equation, VE3 128, has a negative temperature coefficient of −2 mV/° C. and the second term has a positive temperature coefficient. This positive temperature coefficient can be designed by choosing R3/R1, p and r. By setting the positive temperature coefficient to +2 mV/° C., the two terms cancel each other and a stable temperature compensated voltage reference results. A graph of typical VREF vs. Temperature is displayed in
The problem, as stated previously, is that the operating voltage necessary to create the desired output VREF 102, namely VIN 104, needs to be lowered as device sizes are reduced. As discussed above, conventional voltage reference circuits with MOS transistors operate around 1.6 V, (300–400 mV above VREF 102); this is due to power supply rejection (PSR) limitations which are caused by varying drain voltages in M1106 (node 134) and M3130 (node 136). These varying drain voltages are induced by channel length modulation. The 300–400 mV overhead is due to increasing the lengths of M1106 and M3108 or using compound transistors to compensate for channel length modulation. Even if the MOS transistors M1106 and M3108 are replaced with bipolar transistors, the required overhead is still in the range of 100 mV. Clearly, in order to reduce unwanted overhead, the varying drain voltages of M1 106 and M3 108 need to be minimized. The following embodiments provide a reliable, temperature compensated, voltage reference by minimizing drain voltage variation.
In the embodiment of
Reference circuit 300a employs an operational amplifier 338 and a PMOS transistor 340 to reduce operational voltage overhead. Many different types of amplifiers may be used for amplifier 338. Two inputs of the amplifier 338 (AR2) connect nodes 134 and 136. The gate of the PMOS transistor M1A 340 is coupled with the output of AR2338. AR2338 in combination with M1A 340 serves to regulate the voltage at nodes 134 and 136. Because both of these nodes are now regulated at a similar voltage, the impact of the PSR limitations due to drain voltage variation is eliminated, allowing a stable operating voltage, VIN, 104a with reduced overhead (about 100 mV above VREF 102a). Like the circuit of
VREF=VE3+(p+1)(R3/Rl)VT ln(p·r)
The first term VE3 128, has a negative temperature coefficient (−2 mV/° C.) and the second term has a positive, “designable” temperature coefficient (+2 mV/° C.).
b is a schematic drawing of an alternative embodiment to that shown in
A modification that can be made to the circuit of
The embodiments of
The change in current with temperature through M1 (PTAT) is mirrored through to transistor M3 104. The voltage at node 134, however, is CTAT. This negative voltage is used to produce a current IR2 452 through resistor R2 446 via amplifier 454. Because the voltage at node 134 is CTAT, the current IR2 452 is also CTAT. This current is conveyed to FET M4 456 and summed with the current through M3 104 to produce a temperature compensated current Icomp 456 through resistor R3 132. The temperature coefficients are effectively balanced at node 136. A temperature compensated voltage VREF 102c may be created with resistor R3 126. The equation for VREF 102c is as follows:
VREF=R3[(VE2/R2)+(p+1)(VT/R1)ln(p r)]
The temperature coefficients of the first and second terms within the brackets are set equal to each other. Other considerations such as the matching of FETs M2 454 and M4 456 may also need to be considered in the design circuit 400a.
Alternative to the embodiment of
A circuit designer may choose either embodiment of circuit 400a or 400b to produce a sub-bandgap reference circuit. Both embodiments provide advantages in manufacturing. Circuit 400a has more components associated with it than circuit 400b; however, when calibrating the circuit it is relatively simple to adjust the current conveyer. The resistor 446, when used by itself, as in circuit 400b may be more difficult to calibrate than the current conveyer of circuit 400a. However, less circuit components are required.
In alternative embodiments of
Instead of using an amplifier and a FET, a BJT may be used to regulate the voltages at nodes 134 and 136 (as in
b is an alternative embodiment of that shown in
One additional benefit of both of the embodiments in
a is a schematic drawing of another embodiment of a temperature compensated voltage reference circuit that eliminates the effects of channel length modulation by removing transistor M3 and referencing the output voltage at node 964. The ground terminal 966 of AR1130 is coupled with R3 132. The temperature compensation is accomplished by summing the currents I1 120, I2 122 and IR2 452 entering node 964. The resistor R3 132 can be chosen to establish a desired output voltage. The ground terminal 966 of the current differencing amplifier 130 supplies the summation of currents I1 120 and I2 122. An additional resistor 968, analogous to resistor R4 762 in
b is an alternative embodiment to the circuit of
One additional method for lowering the input voltage of all of the above embodiments is to replace some or all of the transistors, particulary the bipolar, with Dynamic-Threshold MOS transistors (DTMOS) transistors. In doing so, all of the above embodiments could have operating voltages as low as 500 mV. DTMOS transistors are a form of lateral bipolar transistors that use a vestigial gate to separate the emitter and collector regions. They are particularly useful with all of the above embodiments when their vestigial gates are tied to their bases. The bandgap voltage (when extrapolated to zero Kelvin) of these transistors is about 0.6V rather 1.2V. In addition, the Vbe temperature gradient is 1 mV/° C. rather than 2 mV/° C.
In
A graph of the operating voltage, VIN, and the output voltage, VREF, is shown vs. temperature is shown in
One additional implementation that should also be recognized in the above embodiments is replacing transistor M1 106 and M3 108 with PNP bipolar transistors. If a dual well or silicon-on-insulator process is available, these transistors offer additional advantages. Namely, they require less area and they also have less PSR limitations.
Embodiments of the present invention have been described above. A low voltage reference circuit with reduced operating overhead may be created by regulating the voltage at the drains of FETs within the reference circuit. In sub-bandgap circuits, the temperature coefficients of an output current or voltage may be adjusted to zero via a current conveyer or an extra current tap. A current source may also be constructed using the above methods. The current source may be used to create a range of temperature compensated voltages.
All of the transistors in the above embodiments may be fabricated in a variety of ways. Different types of FETs (such as n-MOS, or DTMOS) or BJTs (such as NPN) may be implemented to construct alternative embodiments. Those skilled in the art will understand, however, that additional changes and modifications may be made to these embodiments without departing from the true scope and spirit of the present invention, which is defined by the claims.
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